<p>➀ The semiconductor packaging and testing industry is crucial in the semiconductor supply chain, with traditional giants like OSAT facing challenges from advanced packaging technologies.</p><p>➁ Companies like OSAT leaders such as OSAT, Amkor, and Chipmos are expanding globally and focusing on advanced packaging to maintain their competitive edge.</p><p>➂ Key strategies include overseas expansion, investment in new factories, and technological innovation to meet the growing demand for advanced packaging.</p>
Related Articles
- Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona; Expands Investment to $7 Billion27 days ago
 - KeyASIC Partners with AnySilicon to Expand Global Reach and Drive Lead Generation6 months ago
 - The Transformative Growth Potential of the Semiconductor Industry8 months ago
 - Imec and ASML sign five year R&D agreement8 months ago
 - Huzhou Team Breaks International Chip Advanced Packaging Monopoly, Secures Hundreds of Millions in Financing | 36Kr Exclusive8 months ago
 - UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance11 months ago
 - European Chiplet Innovation: APECS Pilot Line Starts Operation under the EU Chips Act11 months ago
 - Chiplet Innovations for Europe: Launch of APECS Pilot Line under the EU Chips Act11 months ago
 - Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizonaabout 1 year ago
 - Intel CEO sets out the road aheadabout 1 year ago