<p>➀ The evolution of semiconductor packaging from 1D PCB design to wafer-level 3D hybrid bonding;</p><p>➁ The core technologies of 2.5D and 3D packaging, including various interlayer materials;</p><p>➂ The advantages and challenges of each technology, such as Si interlayer, organic interlayer, glass interlayer, and Cu-Cu hybrid bonding;</p><p>➃ Key market trends like larger interlayer area, panel-level packaging, and glass interlayer adoption;</p><p>➄ The importance of HBM hybrid bonding and CPO in enhancing I/O bandwidth and reducing energy consumption;</p><p>➅ The significance of advanced packaging in HPC, 5G/6G, and consumer electronics markets.</p>