➀ The demand for High Bandwidth Memory (HBM) is increasing due to the growth of AI models, which require more parameters and energy-efficient training and inference. ➁ HBM is expected to grow at a CAGR of 50% in the coming years, driving the need for advanced DRAM wafer processing equipment and HBM stack creation. ➂ Applied Materials is a leading supplier in this field, with over 50% share in HBM packaging process equipment spending and significant innovations in DRAM processing and 3D packaging technologies.