➀ SiCool Technology has secured a billion-dollar strategic financing, led by Zhongche Capital, Wan Niu Capital, and Wenxin Fund. The funds will be used for the mass delivery of silicon carbide pre-sintered bonding equipment and the commercialization of advanced packaging HBM equipment. ➁ SiCool Technology, founded in December 2018, specializes in chip interconnection technology and has become a leader in the domestic substitution of carbonized silicon pre-sintered bonding equipment. ➂ The company's products include high-precision chip bonding equipment for various scenarios, covering mobile module, power semiconductor, AI chip industry, and advanced packaging bonder. ➃ SiCool Technology will continue to focus on high-precision, high-reliability, and high-efficiency motion control core technology and plan to expand into power semiconductor, carbon silicon, and AI chip HBM directions.