1. Advanced packaging revenue decreased by 9% in Q1 2024, reaching $10.2 billion. 2. The quarter is expected to be the weakest of the year, with an 8.1% decline from the previous quarter. 3. Recovery in the advanced packaging market is anticipated in 2024.

1. The U.S. Department of Commerce announced a $1.6 billion competition for semiconductor advanced packaging R&D projects; 2. The funding will support five R&D areas including equipment, power delivery, connector technology, chiplets ecosystem, and co-design/EDA; 3. This initiative aims to strengthen the U.S. semiconductor ecosystem and address strategic vulnerabilities in advanced packaging.