➀ The top three wafer fabs, Intel, Samsung, and TSMC, are making key moves to attract more orders for future generations of chip technology and improve performance and reduce delivery times for custom designs; ➁ The three giants are heading in the same direction, adopting 3D transistors and packaging, a series of enabling and scalable technologies, and larger, more diverse ecosystems, but there are significant differences in methodology, architecture, and third-party support; ➂ The expansion of transistors is expected to last at least until the 18/16/14nm range, possibly starting with nanosheet and forksheet FETs and eventually leading to complementary FETs (CFETs).