<p>➀ Traditional 2D chips face performance and power limitations in AI/data center applications due to communication bottlenecks and Moore's Law constraints;</p><p>➁ Alphawave Semi's 3D UCIe IP on TSMC's SoIC-X (3DFabric platform) achieves 10x better power efficiency and 5x higher density than 2.5D solutions;</p><p>➂ The vertical stacking architecture enables disaggregated chiplet designs, overcoming memory bandwidth limitations for next-gen AI/HPC systems.</p>