<p>➀ Researchers at Columbia University have successfully used DNA to create 3D electronic devices with nanoscale precision, which could significantly enhance computing power by transitioning from 2D to 3D architectures.</p><p>➁ This bottom-up approach, based on DNA origami, allows for self-assembly of DNA strands into precise nanostructures, offering a more efficient alternative to traditional top-down etching methods.</p><p>➂ The integration of electrodes and semiconductor materials like silicon oxide and tin oxide onto DNA-assembled structures demonstrates their potential application in future microchips, potentially revolutionizing semiconductor manufacturing.</p>