electronicsweekly

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March 28

  • When Will We See A 90nm SoC?

    21年前,在Globalpress 'Leading the Recovery'会议中,一个小组讨论了'何时会有量产的90nm SoC'的问题。

    来自Cadence Design Systems的高级副总裁Ted Vucurevich表示,预计最早在2004年将出现基于90nm工艺的FPGA设计。

    来自Synopsys的Anton Domic认为,到2004年,将会有非FPGA芯片在90nm工艺上实现量产。

    台积电的Andrew Moore也提到,公司的发展路线图显示,90nm工艺将在2004年实现。

    量产90nm设计面临的挑战包括预期良率问题、客户信心问题、验证问题和成本问题。

    Chip TechnologyEDAFoundriesProcess technologyTSMCsemiconductor
  • GaN picked for Mazda automotive power project

    ➀ Mazda and Rohm have signed a deal to develop GaN-based automotive power electronics.

    ➁ GaN can reduce power conversion losses and contribute to the miniaturisation of components through high-frequency operation.

    ➂ The collaboration aims to unveil a demonstration model within FY2025 and practical implementation for FY2027.

    GaNROHMSiCautomotiveelectronicsinnovationpower electronicssemiconductor
  • Farnell signs global distribution deal with MCC

    ➀ Farnell与Micro Commercial Components (MCC)签署全球分销协议;

    ➁ MCC提供包括二极管、MOSFET、IGBT、SiC器件等在内的多种半导体产品;

    ➂ MCC将超过10万种半导体产品带入Farnell,其中25%为汽车级组件。

    Farnell
  • IPC praises ‘war-hating’ President Trump for defence industry support

    ➀ The IPC, the industry association for printed circuits and electronics assembly, laments the lack of investment in the US PCB industry on the anniversary of President Biden issuing the Presidential Determination 2023-06.

    ➁ The directive signed by President Trump in 2017 aimed to assess the US defense industrial base and identified a critical technology shortfall.

    ➂ The IPC expresses its commitment to working with the administration and policymakers to ensure America's defense electronics capabilities are secure and resilient.

    PCB
  • Boosting VC investment in Cambridge

    ET Capital has initiated a new program to boost venture capital investment in Cambridge startups. The program focuses on science and technology-driven startups within the Cambridge cluster, aiming to provide a diverse portfolio across multiple sectors and technologies. The first fund, Cambridge Venture Index SEIS/EIS Fund 1, will invest in ten to fifteen startups from April 2025 to March 2026. This fund targets individual investors and is designed to democratize investment in Cambridge's future success. The strategy aims to reduce risk by diversifying investments, leveraging the performance of the best businesses in the Cambridge cluster. The fund also plans to collaborate with incubators and commercialization offices to provide predictable seed capital to startups.

    Science and TechnologyVenture Capitalinvestmentstartups
  • Tariffs lead to fall in memory inventories

    ➀ Tariffs have encouraged US memory buyers to get their orders in Q1, reducing inventories;

    ➁ DRAM prices expected to fall 0-5% QoQ in Q2, with HBM pricing to rise 3-8% due to HBM3e shipments;

    ➂ Samsung's HBM qualification progress slower than expected, but no significant capacity shift back to DRAM;

    ➃ SK hynix focusing on server and mobile DRAM, limiting PC DDR5 supply;

    ➄ DDR4 prices weak due to consumer demand and capacity expansion, with PC DRAM prices expected to remain flat QoQ in Q2;

    ➅ Server DRAM demand driven by top North American CSPs and AI server investment in China, with DDR5 prices expected to stabilise in Q2;

    ➆ Mobile DRAM demand improved, with LPDDR4X supply ample but prices expected to decline modestly;

    ➇ GDDR7 demand from next-gen graphics cards, with prices expected to hold flat or slightly down due to tight supply;

    ➈ GDDR6 prices expected to decline 3-8%, with suppliers bundling to stabilise pricing and clear inventory;

    ➉ Consumer DRAM seeing more aggressive purchasing, with DDR4 contract prices expected to rise 0-5% in 2Q25, and DDR3 prices likely to remain flat.

    DRAMGDDRHBM3eSK HynixTrendForceddr5memorysemiconductor

March 27

  • Newport fab to get £250m investment

    ➀ The former Newport Wafer Fab will receive a £250 million investment from new owners Vishay Intertechnology;

    ➁ Chancellor Rachel Reeves emphasizes the government's commitment to business growth and job creation;

    ➂ Vishay's investment plan includes expanding staff from 500 to 900 by 2030, with higher-than-average salaries;

    ➃ The investment is supported by the Automotive Transformation Fund (ATF) to bolster the UK's semiconductor supply chain.

    UKVishay Intertechnologyinvestmentsemiconductor
  • MEMS micro-tweeter loudspeaker works from 1Vrms

    ➀ xMEMS has developed a micromachined silicon earbud loudspeaker that operates without a booster amplifier;

    ➁ The speaker, known as Lassen, runs on a standard 1Vrms audio signal and delivers up to 115dB SPL across 6kHz to 20kHz;

    ➂ It is designed for two-way 'true wireless stereo' (TWS) earbuds and is available for mass production in September 2025.

    MEMSloudspeaker
  • Runnier silicone potting gels for faster filling

    ➀ Wevo has introduced a new series of runnier silicone potting gels for faster filling;

    ➁ The Wevosil series offers lower viscosity than standard products, improving air bubble elimination;

    ➂ The gels cure into gels rather than elastomers, providing effective protection against environmental influences.

    Manufacturingelectronics
  • Printed RFID ICs from Pragmatic

    ➀ Pragmatic Semiconductor has announced a new RFID tag product line for marking retail items.

    ➁ The product line, branded 'NFC Connect', is a passive IC powered and read using near-field communications.

    ➂ It is compliant with ISO15693 and NFC Forum Type 5 standards and can be easily integrated into existing workflows.

    ICNFCRFID
  • Integrating InP and SOI for multi tera-bit photonics SoCs.

    ➀ X-FAB, SMART Photonics, and Epiphany Design are collaborating to develop a photonics integration platform that combines InP and SOI technologies for multi tera-bit data rates.

    ➁ The platform aims to address customer requirements for high-speed data rates and energy efficiency in the manufacturing of optical transceivers.

    ➂ The collaboration has resulted in the development of a design flow and PDK that enables the design of photonics circuits integrating InP chiplets on an SOI platform.

    EDAPhotonicssemiconductor
  • EnSilica opens second Brazilian design centre

    ➀ EnSilica, a mixed-signal ASIC designer, has opened a second design centre in Brazil;

    ➁ The new centre is in Campinas, São Paulo State, complementing the company's existing facility in Porto Alegre;

    ➂ The expansion is driven by a multimillion-pound contract from an optical computing systems customer and aims to meet the growing demand for a resilient European-based supply chain.

    Supply Chainsemiconductorsilicon
  • Headset shipments returned to growth in 2024 but due for a dip in 2025

    ➀ After two years of decline, AR/VR headset shipments grew by 10% in 2024, according to IDC.

    ➁ Meta leads the market with a 74.6% share, followed by Apple, Sony, ByteDance, and XREAL.

    ➂ Meta and XREAL are the only two among the top five companies that recorded year-over-year growth.

    AppleByteDanceGrowthIDCMarket ShareMetaSonyeducationgamingheadset
  • Putin’s Power

    ➀ On March 26, 2000, Vladimir Putin won the Russian presidential election, succeeding Boris Yeltsin.

    ➁ Over the next 25 years, Putin has tightened his grip on power, switching roles between president and prime minister.

    ➂ In 2020, Putin amended the constitution to allow him to run for re-election in 2024 and 2030, potentially extending his rule until 2036.

    Russia

March 26

March 25