Recent #HPC news in the semiconductor industry

6 months ago

➀ The adoption of multi-die solutions in HPC chip designs is driven by advancements in interconnect technology, thermal management, and power delivery.

➁ Multi-die architectures offer higher performance, design flexibility, and cost efficiency compared to traditional monolithic designs.

➂ The current market demand for scalable, energy-efficient computing, especially in AI and HPC applications, positions multi-die solutions as a crucial component for future semiconductor developments.

ChipletEDAHPC
6 months ago

➀ Infinisim, founded by Samia Rashid, specializes in SoC clock verification solutions for high-performance designs.

➁ In 2024, Infinisim capitalized on the growing demand for AI and data-intensive applications, focusing on clock performance and the challenges of timing jitter and reliability aging.

➂ For 2025, Infinisim anticipates growth driven by the rapid expansion of AI applications, emphasizing the need for precise design methodologies and reducing excessive margins to enhance performance and profitability.

AIEDAHPC
6 months ago

➀ Performance validation in SoC designs is distinct from architectural exploration, focusing on evaluating actual performance to meet specifications.

➁ Hardware-Assisted Verification (HAV) platforms play a crucial role in performance validation by enabling real-world traffic testing and firmware performance tuning.

➂ Part 2 of 2 explores the performance validation process across hardware blocks and firmware in SoC designs, emphasizing the critical role of HAV platforms.

ChipletEDAHPC
6 months ago

➀ Sarcina Technology, led by Founder and CEO Larry Zu, offers comprehensive post-silicon ecosystem services including package design, assembly, testing, qualification, and production services for leading semiconductor companies.

➁ In 2024, Sarcina developed a Bump Pitch Transformer (BPT) to simplify and reduce costs in 2.5D package designs, addressing challenges related to costly silicon TSV interposers.

➂ Sarcina aims to increase awareness of its capabilities, especially its Application Specific Advanced Package (ASAP) Service, through presentations and participation in industry conferences.

ChipletEDAHPC
6 months ago

➀ Defacto Technologies, led by Dr. Chouki Aktouf, specializes in innovative SoC design solutions and has become a leader in front-end SoC integration.

➁ In 2024, the company focused on incorporating AI technologies into their R&D projects, aiming to introduce AI-based automation in their tools.

➂ For 2025, the company plans to focus on AI-based EDA and attend key industry conferences like DAC and DATE.

AIChipletEDAHPCSoC
6 months ago
➀ 35ELEMENTS致力于通过开发立方氮化镓半导体材料来帮助实现碳中和;➁ 公司计划在两年内在兼容CMOS的Si(100)衬底上扩大其材料规模,并寻求与代工厂的合作;➂ 35ELEMENTS拥有立方氮化镓材料的独家专利,并计划制造高效的光发射器,如创新型绿色发光二极管。
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
7 months ago
➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
7 months ago
➀ TSMC unveiled its 2nm Platform Technology at IEDM, featuring GAA nanosheet transistors for AI, HPC, and mobile applications. ➁ The N2 technology achieves significant improvements in speed and power efficiency compared to the 3nm node. ➂ TSMC's N2 is scheduled for mass production in 2025, with an enhanced version, N2P, targeted for 2026.
2nm TechnologyAIEnergy efficiencyGate-All-AroundHPCMobile ApplicationsN2 PlatformSEMICONDUCTORTSMC
7 months ago
➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
8 months ago
➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
8 months ago
➀ Concerns over the impact of the U.S. presidential election and the ongoing chip war between China and the U.S. are likely to decrease China's semiconductor equipment spending to below USD 40 billion in 2025. ➁ The tension is expected to affect the global semiconductor supply chain. ➃ The situation highlights the importance of domestic semiconductor manufacturing capabilities.
ChinaChipmaking EquipmentEDAEUVHPCIndustrySEMICONDUCTORTrade WarUS Tensionselectronics