Recent #HPC news in the semiconductor industry

14 days ago

➀ The article depicts a fictional CEO, Ed, leveraging his political position to manipulate AI investment markets through strategic gossip and high-frequency trading algorithms;

➁ Ed creates both optimistic narratives (e.g., government investments, AI breakthroughs) and pessimistic rumors (e.g., unprofitability, technical limitations) to induce market volatility;

➂ The plan aims to profit from trading volatility but risks unintended consequences in an already unstable AI-driven financial landscape.

AIHPCSoftware
15 days ago

➀ Broadcom showcased its Tomahawk 6 102.4T switch chips and Tomahawk Ultra at OCP Summit 2025, highlighting significant size differences due to SerDes speeds (112G vs. 224G);

➁ The 112G SerDes variant features a larger package for additional I/O lanes, while the 224G version’s higher-speed SerDes enables a compact design;

➂ The Tomahawk Ultra 51.2T chip, distinct from Tomahawk 6 in architecture and package size, underscores Broadcom’s push for next-gen Ethernet scalability in AI/HPC clusters.

BroadcomNetworkingHPC
18 days ago

➀ Caltech researchers developed X1, a multi-robot system combining a humanoid robot (Unitree R1) and a deployable M4 robot capable of rolling and flying, enabling navigation in complex terrains;

➁ The system demonstrated seamless transitions between walking, driving, and flying modes to overcome obstacles like ponds and stairs in a campus simulation;

➂ Physics-based control algorithms allow autonomous adaptability, aiming to advance cooperative robotics for search, rescue, and dynamic real-world applications.

Tech Of RoboticsAutomationHPC
18 days ago

➀ Researchers at the University of Oxford demonstrated a method to link quantum computers using light-based quantum gate teleportation, achieving stable communication between two ion-based modules without physical connections;

➁ The setup used trapped ions (strontium for photonic communication and calcium for data processing) in vacuum chambers, with entangled photons enabling cross-module operations at 86.2% gate accuracy and 97% entanglement fidelity;

➂ Successful execution of Grover's search algorithm validated distributed quantum computing, highlighting a scalable approach for modular quantum systems through photonic entanglement.

HPCsemiconductorAI
19 days ago

➀ The 800V DC architecture is introduced to replace traditional 48V/12V systems in AI data centers, reducing energy losses and improving efficiency;

➁ Wide bandgap semiconductors like SiC and GaN enable compact, high-efficiency power solutions for next-gen AI infrastructure;

➂ Industry collaboration accelerates adoption of 800V designs to support multi-gigawatt AI data centers with enhanced sustainability.

AIsemiconductorHPC
19 days ago

➀ Frore Systems introduced LiquidJet coldplates capable of handling up to 4.4kW TDP, compatible with NVIDIA's Blackwell and next-gen Feynman AI GPUs.

➁ The 3D short-loop jet-channel microstructures reduce pressure loss by 4x and achieve hotspot density of 600W/cm², doubling traditional coldplate performance.

➂ Scalable design supports future processors like Rubin (3.6kW) and integrates flexibility for custom hotspot mapping, improving AI training efficiency and data center PUE.

CoolingNVIDIAHPC
19 days ago

➀ German overclocker Der8auer tested spray cooling on a Ryzen 7 9800X3D CPU using a makeshift setup, revealing challenges in achieving full IHS coverage.

➁ The experimental cooling method, inspired by supercomputers like Cray X1, relies on non-conductive mist sprayed directly on the chip but underperformed compared to traditional air cooling.

➂ Despite partial success, results highlighted the critical role of nozzle placement and coolant properties, emphasizing spray cooling's niche status in supercomputing.

CoolingAMDHPC
20 days ago

➀ Nuvoton launched the Arbel NPCM8mnx SiP, a compact BMC subsystem integrating CPU, memory, storage, and power management into a 23x23mm chip, reducing development complexity for AI servers and datacenters;

➁ The SiP achieves a 70% size reduction, supports up to 4GB DDR4 and 64GB eMMC, and features post-quantum cryptography for security compliance;

➂ Designed for hyperscale deployments, it accelerates hardware development cycles and supports open standards like OpenBMC, with engineering samples currently available.

AIHPCsemiconductor
20 days ago

➀ The combined capital expenditure (capex) of eight major Cloud Service Providers (CSPs)—including Google, AWS, Meta, Microsoft, Tencent, Alibaba, and Baidu—is projected to exceed $420 billion in 2025, marking a 61% year-on-year increase and equaling their total spending in 2023 and 2024.

➀ Investment priorities focus on servers and GPUs, with high demand for Nvidia's GB200/GB300 rack systems in 2025, transitioning to the Rubin VR200 platform in 2026.

➂ The 'Magnificent Seven' U.S. tech giants (Alphabet, Amazon, Apple, Meta, Microsoft, Nvidia, Tesla) hold a combined market cap of $21 trillion, representing 36% of the S&P 500's total value.

NVIDIAHPCAI
20 days ago

➀ Broadcom and OpenAI partner to develop 6GW of custom AI accelerators, with OpenAI designing the chips and Broadcom handling development and deployment;

➀ The collaboration leverages Broadcom's Ethernet and connectivity solutions to build scalable AI infrastructure, supported by a long-term co-development agreement;

➂ Leaders from both companies emphasize the partnership's role in advancing AI capabilities, optimizing performance, and supporting OpenAI's mission to benefit humanity through artificial general intelligence (AGI).

AI chipHPCsemiconductor
21 days ago

➀ Imec challenges the perception that deep-tech investments yield only moderate returns, citing McKinsey and BCG data showing a 16% net annual IRR for deep-tech versus 10% for traditional tech with comparable failure rates;

➁ Despite high initial capital needs, deep-tech startups require less funding in later stages, face limited competition, and achieve higher profit margins due to disruptive market creation;

➂ Imec.DeepTechVentures reduces risks through semiconductor R&D expertise, global ecosystem integration, and manufacturing process optimization, accelerating commercialization of innovations like vertical AI compute architectures.

IMECsemiconductorHPC
21 days ago

➀ Broadcom has started shipping its Tomahawk 6-Davisson 102.4T switch featuring integrated co-packaged optics (CPO), achieving a 70% reduction in power consumption;

➁ The switch employs TSMC's COUPE photonic engines and 3nm Condor SerDes, with field-replaceable laser modules for improved maintenance;

➂ This innovation addresses high-power networking demands in AI clusters, enabling higher port density and energy-efficient 1.6TbE connectivity.

BroadcomCo-packaged opticsHPC
21 days ago

➀ The UK government prioritizes accelerating Small Modular Reactor (SMR) deployment to address growing electricity demand from data centers and EVs, targeting completion by the mid-2030s;

➁ Rolls-Royce is the preferred contractor, with the government streamlining approvals to reduce the typical 10-year timeline;

➂ Initial contracts for ten SMR projects, each worth £2 billion, involve major engineering firms, with potential for future expansions.

HPCautomotiveGovernment Contracts
24 days ago

➀ Microsoft Azure deploys the world's first large-scale GB300 NVL72 supercomputing cluster with 4,608 NVIDIA Blackwell Ultra GPUs, interconnected via Quantum-X800 InfiniBand for 92.1 exaFLOPS FP4 inference performance.

➁ Each NVL72 rack integrates 72 GPUs and 36 Grace CPUs, delivering 1,440 petaflops FP4 Tensor performance and pooling 37TB memory through NVLink 5, achieving 130 TB/s bandwidth.

➂ The liquid-cooled cluster, dedicated to OpenAI workloads, accelerates AI model training and deployment, marking a strategic milestone in NVIDIA's $100B partnership with OpenAI and Microsoft's global hyperscale AI infrastructure plans.

MicrosoftNVIDIAHPC
24 days ago

➀ LightMatter unveiled its Passage M1000 3D photonic superchip targeting AI applications, emphasizing advancements in photonic computing;

➁ The chip incorporates a 16-wavelength dense wavelength division multiplexing (DWDM) optical link to achieve higher bandwidth density for hyperscalers;

➂ The company highlights its ability to leverage standard single-mode fiber for improved performance in AI infrastructure.

AIHPC3D IC
24 days ago

➀ Researchers experimentally confirmed that large quantum processors (73 qubits) exhibit genuine quantum behavior by using Bell's test to detect non-local correlations;

➀ The study demonstrated energy levels below classical limits and multipartite Bell correlations, proving the system's quantum nature;

➂ This verification method enhances trust in quantum computing scalability and supports future advancements in secure communication and algorithms.

QuantumResearchHPC
25 days ago

➀ The U.S. has approved NVIDIA to export billions in AI GPUs to the UAE, with initial deployments managed by U.S.-operated datacenters;

➁ The deal allows the UAE to purchase 500,000 Blackwell GPUs annually alongside a $1.4 trillion U.S. investment commitment, while G42 will receive 20% of future shipments;

➂ The agreement reflects U.S. 'AI diplomacy' to counter China's regional influence, but faces criticism over lax security safeguards.

NVIDIAAI chipHPC
25 days ago

➀ Bochum University of Applied Sciences (HSBO) expanded international collaboration in Kenya through academia, research, and mobility programs;

➁ Professors from HSBO delivered lectures on topics like midwifery, sustainable engineering, and AI's impact on education, fostering ties with CUEA and the University of Nairobi;

➂ Plans to deepen partnerships via ERASMUS and explore joint research in renewable energy and waste management were emphasized.

AIHPCEducation
25 days ago

➀ The Hydro4U project, funded by the EU, develops climate-resilient small hydropower solutions in Central Asia, emphasizing affordability, ease of deployment, and adherence to ecological standards;

➁ Two demonstration plants—Francis Container Power Solution (FCPS) in Uzbekistan and Hydroshaft Power Solution (HSPS) in Kyrgyzstan—are implemented using modular and ecocompatible technologies;

➂ Advanced planning tools (GIS, BIM), community engagement, and partnerships aim to enhance energy security and economic opportunities while aligning with sustainability goals.

HPCSoftware3D IC
25 days ago

➀ The EU-funded Hydro4U project has developed innovative small hydropower (SHP) solutions in Central Asia, focusing on affordability, modularity, and eco-friendliness to address energy gaps in remote regions;

➁ Two pilot plants—the Francis Container Power Solution in Uzbekistan and the Hydroshaft Power Solution in Kyrgyzstan—have been deployed, emphasizing climate resilience and minimal environmental impact;

➂ The project integrates advanced tools like GIS mapping, drone surveys, and community partnerships to ensure sustainable energy access and local economic development.

HPC