Recent #HPC news in the semiconductor industry

2 months ago

➀ Fraunhofer IWU will deploy an 80 kW fuel cell test bench in October 2025 to evaluate performance and durability of hydrogen systems, supporting industrial clients and projects like Clean Energy City;

➁ The institute’s Referenzfabrik.H2 initiative focuses on optimizing manufacturing processes for electrolyzers and fuel cells to enable cost-effective mass production;

➂ Expansion includes new test infrastructure in Chemnitz and Görlitz, featuring electrolyzer testing up to 2 MW and climate simulation chambers for hydrogen storage and production R&D.

HPCautomotivesemiconductor
2 months ago

➀ Three leading semiconductor entities—Leibniz-Institut für Kristallzüchtung (IKZ), PVA TePla AG, and Siltronic AG—collaborate to scale aluminum nitride (AlN) crystal growth from 2-inch to 4-inch wafers, targeting industrial applications;

➁ AlN's ultra-wide bandgap properties enable high-efficiency power electronics (e.g., electric mobility, renewable energy) and UV photonics (e.g., disinfection, medical/agricultural sensors);

➂ Partners aim to strengthen Europe's semiconductor sovereignty by combining expertise in crystal growth (IKZ), substrate development (Siltronic), and PVT-based industrial scaling (PVA TePla).

HPCautomotivesemiconductor
2 months ago

➀ The University of Bremen collaborates with industry partners to develop an AI-driven modular edge computing system for real-time status monitoring of mobile machines in logistics and construction;

➁ The solution combines an AI cloud platform and transfer learning to minimize dependency on extensive field data, enhancing cost-effectiveness;

➂ Emphasizes data security through encryption and offers a user-friendly app to improve machine availability and operational efficiency.

AIHPCsemiconductor
2 months ago

➀ HPE introduced new ProLiant DL325 Gen12 and DL345 Gen12 servers at HPE Discover 2025, featuring AMD EPYC 9005 'Turin' processors;

➁ Both models support up to 24 DIMMs per socket for expanded memory capacity and include the iLO 7 management system;

➂ The 2U DL345 Gen12 offers superior storage flexibility and I/O expansion, targeting high-core-count workloads and modernization from legacy platforms.

AMDHPCHPE
2 months ago

➀ Sofics announces silicon validation of its IP on TSMC's 2nm technology, achieving exceptional power, performance, and area (PPA) metrics near physical limits;

➁ The IP focuses on built-in robustness for advanced integrated circuits, addressing demanding requirements in next-generation semiconductor designs;

➂ Implementation leverages TSMC's nanosheet transistor architecture, positioning the technology for cutting-edge applications.

2nmHPCsemiconductor
2 months ago

➀ Fraunhofer IZM-ASSID celebrated 15 years as a pioneer in 3D system integration and wafer-level packaging, driving innovations like TSV processing and chiplet architectures;

➁ Flagship projects CEASAX (300mm microelectronics R&D) and APECS (EU Chips Act pilot line) strengthen Europe's competitiveness in semiconductor advanced packaging and edge AI;

➂ Strategic collaborations with GlobalFoundries, Infineon, Siemens, and academia solidify its role in global high-tech ecosystems and technological resilience.

3D ICHPCsemiconductor
2 months ago

➀ Fraunhofer IWU launches an 80 kW fuel cell test stand to evaluate performance, durability, and reliability of fuel cell systems under varied operational conditions, supporting the industrial scale-up of hydrogen technologies;

➁ The facility expands testing infrastructure with additional units for electrolyzers and component-level analysis, including impedance measurements and material testing to optimize production costs and functionality;

➂ Collaboration with the Hydrogen Lab Görlitz and regional partners strengthens Saxony’s position as a hydrogen research hub, focusing on large-scale electrolysis simulation and climate-resilient testing.

CoolingHPCautomotive
3 months ago

➀ The BMFTR-funded SPINNING project demonstrated a diamond spin-photon quantum computer with 12 qubits, showcasing superior coherence times (over 10 ms) and lower error rates (<0.5%) compared to superconducting IBM models (Eagle, Heron);

➀ Photonic coupling over 20 meters enabled scalable, distributed quantum registers with high fidelity (over 0.9), offering flexible integration with classical computing systems;

➂ The project involved collaboration among 28 entities, advancing diamond material processing, qubit fabrication, and AI-driven quantum applications, funded with €16.1 million by the German government.

AI ChipHPCsemiconductor
3 months ago

➀ Researchers at Technical University of Munich (TUM) developed a robotic system to treat life-threatening tension pneumothorax during evacuation flights, using ultrasound-guided needle decompression;

➁ The system, part of the EU-funded iMEDCAP project, integrates a robotic arm and diagnostic tools for both military and civilian emergencies, such as gunshot wounds or traffic accidents;

➂ The project also includes drone-based evacuation (Avilus Grille) and telemedicine capabilities, with additional robotic modules under development for osseous access, tourniquet application, and chemical weapon response.

HPCautomotivesemiconductor
3 months ago

➀ Researchers at the Technical University of Munich (TUM) developed a medical robotic system to treat tension pneumothorax during evacuation flights, funded by the European Defense Fund;

➁ The robotic arm integrates ultrasound and a decompression needle for emergency intervention, part of the iMEDCAP project targeting military and civilian use;

➂ The system enables remote-controlled treatment via drones, with additional modules in development for tasks like drug delivery and hemorrhage control.

HPCMicrochipautomotive
3 months ago

➀ Researchers at Science Tokyo developed BBCube - a 3D chip stacking architecture enabling direct DRAM-xPU integration with 10μm chip gaps and 10ms/chip bonding;

➁ Innovations include inkjet-based COW bonding, heat-resistant DPAS300 adhesive, and embedded capacitors for power delivery;

➂ Reduces data transmission energy by 80-95% compared to traditional 2D systems, promising breakthroughs for AI accelerators and edge devices.

3D ICDRAMHPC
3 months ago

➀ The UK House of Lords Committee will hold a session with space industry leaders to discuss the space economy, domestic launch capabilities, and national security implications;

➁ Expert panels include representatives from techUK, Maersk, Orbex, and independent advisors, addressing topics like orbital launch plans and economic impacts;

➂ The Committee's final report will be submitted to the government in autumn 2025, with proceedings available for public viewing via Parliament TV.

HPCcybersecuritysemiconductor
3 months ago

➀ Ed meets water company lobbyists concerned about mandatory reporting of data centers' water usage under EU's CSRD and UK pressure;

➁ High-workload AI data centers consume water equivalent to towns of 50,000 people, sparking community resistance fears;

➂ Despite ethical concerns, Ed considers supporting reporting delays due to water firms' history of lucrative payouts to executives and shareholders.

AIHPCsemiconductor
3 months ago

➀ X Display Company (XDC) unveiled a 1 million FPS microLED display paired with a high-speed camera for machine-to-machine communication, potentially reaching 1 Tb/s speeds;

➁ The system offers 2-3x higher energy efficiency than 800G optical transceivers and eliminates physical cables, but requires high-speed encoding/decoding and infrastructure redesign;

➂ While promising for hyperscale data centers, challenges remain in practical implementation and industry adoption beyond niche applications.

CoolingHPCsemiconductor
3 months ago

➀ NVIDIA secures entire Wistron server plant capacity in Taiwan through 2026 for Blackwell/Rubin AI servers, pushing out competitors;

➁ Wistron expands production with a second plant in Zhubei, doubling capacity to meet surging demand;

➂ Strategic move ensures NVIDIA's supply chain dominance while limiting rivals' access to AI server manufacturing resources.

HPCNVIDIAWistron
3 months ago

➀ A Huawei CloudMatrix 384 cluster with 384 Ascend 910C chips outperforms Nvidia H800 in running DeepSeek's R1 LLM, achieving 300 PFLOPS BF16 compute power;

➁ The solution consumes 4x more energy (559 kW vs. Nvidia's 145 kW) with 2.3x lower efficiency, but benefits from China's abundant electricity resources;

➂ Despite Nvidia's technological lead, Huawei's brute-force approach using optical interconnects and domestic NPUs offers Chinese clients a viable alternative under export restrictions.

HPCHuaweiNVIDIA
3 months ago

➀ Researchers developed an automated data analysis method for Kelvin Probe Force Microscopy (KPFM) to measure millisecond-level voltage changes on photoelectrode surfaces, enhancing insights into charge transport dynamics.

➀ The technique, demonstrated using titanium dioxide (TiO2), enables precise correlation between local morphology and optoelectronic properties, critical for improving photoelectrochemical cells (PECs) for sustainable hydrogen and fuel production.

➂ The innovation paves the way for designing more efficient and durable materials, advancing solar fuel technologies by leveraging high-resolution microscopy and data science approaches.

HPCenergysemiconductor
3 months ago

➀ Marco Stucki won the Berlin University Alliance's open knowledge lab competition with an innovative method for manufacturing diamond-based quantum light sources, crucial for future quantum computing and secure communication networks;

➁ The competition, themed "Art meets Science," highlighted cutting-edge research in quantum technologies, exemplified by Stucki's "Sawfish Cavity"—a photonic crystal resonator that efficiently traps and amplifies light using wave-like structures;

➂ The project will be showcased through an artistic poster campaign under the Berlin University Alliance's Open Knowledge Lab initiative, bridging technical innovation and public engagement.

HPCsemiconductor
3 months ago

➀ The International Superconductive Electronics Conference (ISEC) 2025 in Erfurt convenes global experts to advance discussions on quantum computing, energy-efficient electronics, and brain-inspired computing.

➁ Thuringia positions itself as a technological innovation hub, with applications spanning secure communication, environmental sciences, and AI data center energy challenges.

➂ Forschungszentrum Jülich introduces the QSolid project, targeting scalable quantum computing through qubit integration and novel control electronics.

AIHPCsemiconductor