➀ The GreenBotAI project, a German-French collaboration, aims to reduce energy consumption in industrial robots by over 25% using AI-driven path planning, simulation, and data analysis;

➀ The initiative focuses on developing trustworthy, industry-ready AI solutions, combining expertise from academia and industry partners like Fraunhofer IWU and INBOLT;

➂ Results from three years of research were showcased in Paris, highlighting improvements in productivity and sustainability under a bilateral AI innovation program.

➀ Fraunhofer ILT showcases innovations in additive manufacturing at Formnext 2025, including high-strength tungsten components for fusion reactors and the SCaRB process for simultaneous coating and surface optimization;

➁ Development of multi-material coatings using EHLA and PEEK polymers offers PFAS-free alternatives, enhancing corrosion and wear resistance;

➂ Integrated printed sensors in metal components enable real-time monitoring, improving maintenance and operational reliability in industries like aerospace and energy

➀ Fraunhofer ILT showcases advanced additive manufacturing (AM) technologies at Formnext 2025, including Laser Powder Bed Fusion (LPBF) and Selective Laser Sintering (SLS) for high-performance components in fusion energy, aerospace, and automotive industries;

➁ Innovations feature monolithic tungsten-copper structures for fusion reactor durability, simultaneous coating and roller burnishing (SCaRB) to improve surface quality, and PFAS-free multi-material coatings combining metal and polymers;

➂ Embedded sensors in AM metal parts enable real-time monitoring of stress and deformation, enhancing operational safety while reducing costs through optimized processes and material efficiency.

➀ Western Digital offers a 13% discount on two 26TB WD Red Pro NAS drives, reducing the price per drive to $449.99;

➁ The helium-sealed HDD features 11 platters, 7200 RPM, OptiNAND tech, and a 272 MB/s transfer rate for enterprise-grade NAS environments;

➂ Designed for 24/7 operation with vibration sensors and a 550TB/year workload rating, targeting users needing bulk storage.

➀ Amkor Technology increased its investment in an Arizona facility from $2bn to $7bn, expanding cleanroom space and adding a second advanced packaging/test site;

➁ The facility focuses on AI, HPC, automotive, and industrial applications, leveraging proximity to TSMC and partnerships with Intel;

➂ Arizona has attracted over $205bn in semiconductor investments since 2020, with advanced packaging markets projected to grow at a 9.5% CAGR to $79.4bn by 2030.

➀ Trogenix, an Edinburgh-based biotech company, raised $95 million in Series A funding to advance precision cancer therapies targeting aggressive tumors like glioblastoma and colorectal liver metastases;

➁ The funds will support clinical trials for glioblastoma starting in 2026 and expand its pipeline for liver and lung cancers using the proprietary Odysseus platform;

➂ The technology combines cancer cell-killing and immune stimulation through Synthetic Super Enhancers (SSEs), offering long-term protection against tumor recurrence without harming healthy tissue.

➀ EU President Ursula von der Leyen proposes a '28th regime' to unify regulations for startups, simplifying cross-border scaling in Europe;

➁ Key initiatives include the Scaleup Europe Fund to address risk capital shortages and AI-driven healthcare screening centers to accelerate technology adoption;

➂ Emphasizes Europe's potential to lead in AI and autonomous vehicles, aiming to retain talent and drive global innovation.

➀ KAYTUS MotusAI is an enterprise AI DevOps platform designed to manage end-to-end AI workflows, including inference/training clusters, storage, models, and user roles;

➁ It provides multi-tier user permissions (general users, admins, supervisors), Kubernetes integration, and resource monitoring features for GPU utilization, storage, and cluster health;

➂ The platform supports NVIDIA MIG GPU partitioning, data synchronization, and cost management tools for enterprise AI infrastructure optimization.

➀ SiPearl's Athena1, Europe's first sovereign dual-use 80-core CPU, combines military-grade security and civilian applications;

➀ Based on Arm Neoverse V1 with TSMC 6nm process, supports encrypted communications and defense systems;

➁ Strategic manufacturing shift planned to reduce reliance on Asian supply chains by 2027.

➀ Traditional 2D chips face performance and power limitations in AI/data center applications due to communication bottlenecks and Moore's Law constraints;

➁ Alphawave Semi's 3D UCIe IP on TSMC's SoIC-X (3DFabric platform) achieves 10x better power efficiency and 5x higher density than 2.5D solutions;

➂ The vertical stacking architecture enables disaggregated chiplet designs, overcoming memory bandwidth limitations for next-gen AI/HPC systems.

➀ The 11th Industrial Working Group event by Fraunhofer IDMT and Hochschule Emden/Leer focused on speech interaction and AI in manufacturing, featuring discussions on digital shopfloor management and aircraft production applications.

➁ Airbus showcased voice-based systems to optimize workflows, while Deloitte highlighted efficiency gains from speech-driven data utilization, emphasizing proactive problem-solving and resource optimization.

➂ Fraunhofer IDMT presented AI-driven speech solutions like LLMs for industrial use, alongside workshops on predictive maintenance, smart hearing protection, and acoustic process management to advance Industry 5.0.

➀ Researchers from Helmholtz-Zentrum Berlin and Hebrew University developed a novel spectroscopic micro-ellipsometry (SME) technique to measure conductivity and optical responses of individual MXene flakes, revealing their intrinsic properties;

➁ The non-invasive, high-resolution method overcomes limitations of conventional approaches, providing nanoscale structural and electronic insights critical for optimizing MXene-based devices;

➂ The breakthrough advances applications in energy storage, flexible electronics, and clean energy technologies by enabling precise material characterization at the single-flake level.

➀ Fraunhofer IOSB introduces the concept of 'data space workshops,' aiming to assist SMEs in rapidly and securely building industrial data ecosystems aligned with initiatives like Manufacturing-X;

➀ The workshops integrate real-world production environments, standardized IT/OT infrastructure, open data platforms, and AI engineering to enable collaborative testing of use cases (e.g., predictive maintenance, CO₂ footprint tracking);

➂ The initiative leverages Fraunhofer's expertise in Industry 4.0 standards, cybersecurity, and partnerships (e.g., Catena-X, IDSA) to accelerate practical implementation of secure and scalable data spaces.

➀ Samtec's CPX (Co-Packaged Copper and Optics) integrates copper and optical interconnects to overcome limitations in high-speed data transmission at 224 Gbps.

➁ Matt Burns will present practical strategies for copper's short-reach superiority (up to 1.5m with CPC) and optical's long-reach scalability (CPO), addressing AI/data center challenges.

➂ Samtec's Si-Fly® HD platform enables hybrid CPX deployment on ultra-dense substrates, exemplified by collaborations with system OEMs and Synopsys.

➀ The EPSILON project, coordinated by Fraunhofer HHI, employs VR technology and wearable sensors to objectively diagnose and differentiate Post-COVID symptoms like cognitive deficits and fatigue;

➁ Data from VR-based cognitive tests, physiological sensors, and digital psychological assessments are integrated into a web-based AI platform for real-time analysis and visualization, aiding personalized treatment;

➂ The developed tools aim to provide a scalable diagnostic framework, with future applications planned for rare diseases such as Rett syndrome.

➀ Fraunhofer EMI, with partners, develops simulation software (VC BlastProtect) to predict fragmentation flight and underground shock waves from WWII bomb detonations, improving safety assessments.

➁ The software integrates 3D city models and dynamic soil behavior analysis to refine evacuation zones and evaluate impacts on underground infrastructure like pipelines and tunnels.

➂ Validation via large-scale tests in Germany demonstrated reduced damage risks, aiding explosive disposal teams in optimizing damping measures and minimizing evacuation ranges.

➀ Fraunhofer EMI and partners are developing simulation software (VC BlastProtect) to model shrapnel dispersion and underground pressure waves from WWII bomb detonations;

➁ The software aims to optimize evacuation zones and assess risks to underground infrastructure, incorporating damping measures like sand/water covers;

➂ Validation experiments in Mecklenburg-Vorpommern demonstrated the accuracy of models in predicting blast effects, aiding bomb disposal teams in damage mitigation planning.

➀ Researchers from TU Ilmenau, alongside partners, won second place in the INNOspace Masters 2025 competition for developing an EEG-based system to monitor astronauts' brain activity during long space missions;

➁ The system uses lightweight, dry-electrode technology and AI to analyze mental states in real-time, aiming to prevent psychological crises in extreme environments like space or Antarctica;

➂ The innovation has dual applications, benefiting space exploration and terrestrial healthcare, including mental health monitoring for conditions like depression and burnout.

➀ Qorvo launched a Ku-band beamformer IC for SATCOM terminals, enabling TDD architecture to reduce system complexity and size through a single antenna array for transmission and reception;

➁ The IC complements Qorvo's existing FDD beamformer portfolio, providing scalable solutions for both TDD and FDD satellite communication systems;

➂ It operates in 13.75-14.5 GHz (transmit) and 10.7-12.75 GHz (receive) ranges, integrates Tx/Rx functions, reduces receive power by 40%, improves signal clarity by 20%, and offers 5x higher transmit efficiency than competitors.

➀ The innovation gap between the US and China narrowed to 5.1 points in 2024, down from 12.6 points in 2015, according to WIPO's Global Innovation Index;

➁ The US dominated late-stage VC deals and software spending (47% global R&D share), while China led in patents, industrial designs, and scientific research (14% growth in research articles);

➂ Global research output reached 2 million articles in 2024, fueled by contributions from China and India.