Recent #HPC news in the semiconductor industry

3 months ago

➀ The International Superconductive Electronics Conference (ISEC) 2025 in Erfurt convenes global experts to advance discussions on quantum computing, energy-efficient electronics, and brain-inspired computing.

➁ Thuringia positions itself as a technological innovation hub, with applications spanning secure communication, environmental sciences, and AI data center energy challenges.

➂ Forschungszentrum Jülich introduces the QSolid project, targeting scalable quantum computing through qubit integration and novel control electronics.

AIHPCsemiconductor
3 months ago

➀ Marco Stucki won the Berlin University Alliance's ideas competition with a novel method for creating diamond nanostructures for quantum technologies, enabling future quantum computing and secure communication networks;

➁ The competition showcased Berlin's diverse research fields, attracting over 80 submissions spanning global health, climate, and quantum technologies;

➂ Stucki's "Sawfish Cavity" uses diamond-based optical resonators to trap and amplify light, with artistic visualizations displayed publicly in Berlin as part of the campaign.

HPCPhysicssemiconductor
3 months ago

➀ Fraunhofer IAF developed a miniaturized diamond-based quantum magnetometer using nitrogen-vacancy (NV) centers, achieving high sensitivity (picotesla range) and robustness for applications in biomedicine, materials testing, and navigation;

➁ The sensor enables vector magnetic field measurements with reduced calibration, supports autonomous GNSS-free navigation in challenging environments, and aids in geological mineral exploration;

➂ Ongoing advancements aim to further reduce sensor size by 5x and enhance sensitivity for sub-picotesla measurements, while expanding diamond wafer production to industrial 4-inch scales.

HPCautomotivesemiconductor
3 months ago

➀ SiTime Corporation introduces the SiT5977 Super-TCXO, a single-chip timing device with 80 femtosecond phase jitter and support for 800G+ interconnects, designed for AI clusters and datacenters;

➁ The device consolidates multiple timing components, reduces board complexity, and simplifies power supply design by eliminating external LDOs;

➂ Enhances AI cluster efficiency through precise synchronization, dynamic frequency adjustment, and improved energy utilization while addressing datacenter scalability challenges.

AIHPCsemiconductor
3 months ago

➀ The Q1 enterprise WLAN market grew 10.6% quarter-over-quarter to $2.3 billion, driven by adoption of WiFi 6E (31.9% of AP revenues) and WiFi 7 (11.8%);

➁ Regional growth varied: Americas surged 15.2% YoY (led by the U.S. at 21%), EMEA rose 11% YoY, and APAC grew 1% YoY, with China declining 4.2%;

➂ Key players included Cisco (39.5% market share, $904.5M), HPE Aruba (15.9%, $363.9M), and Ubiquiti (11.7%, $267.4M with 50.9% YoY growth), while Huawei’s revenue dropped 10.7%.

HPCSoftwaresemiconductor
3 months ago

➀ PI unveiled advanced industrial-grade solutions at LASER World of PHOTONICS 2025, including the AI-driven F-141 PINovAlign 6-axis alignment system for high-volume photonics and semiconductor manufacturing.

➁ The H-815 hexapod and B-421 BIX nanopositioning stages were highlighted for their robustness, compact design, and precision, targeting 24/7 industrial automation in photonics and semiconductor sectors.

➂ Future technologies like magnetic levitation (MagLev) stages and novel hexapod concepts showcased PI’s innovation in picometer-level precision and high-speed applications.

AIHPCsemiconductor
3 months ago

➀ The UK and Japan plan to sign a nuclear fusion collaboration agreement on Thursday, targeting a viable technology demonstration by the 2030s;

➁ Japan will contribute its manufacturing expertise, while the UK provides remote robotics capabilities for nuclear facilities and fusion reactor management;

➂ Both nations previously collaborated on Fukushima's decommissioning using robots, and UK's Tokamak Energy recently established a subsidiary in Tokyo to advance fusion research.

HPCautomotivesemiconductor
3 months ago

➀ Panmnesia, a Korean CXL specialist, launched a full-stack HPC system using CXL 3.x switches and IP, enabling flexible resource scaling and enhanced parallel computing performance;

➁ The composable hardware architecture allows independent scaling of compute and memory nodes via CXL switches, reducing costs by eliminating redundant resources;

➂ The software stack replaces network-based communication with CXL memory sharing, cutting latency by 44% in a fluid dynamics simulation demonstration.

CXLHPCmemory
3 months ago

➀ Phlux Technology launches a 30µm optical window version of its Aura Noiseless InGaAs APDs, offering 12X higher sensitivity and GHz-level response for high-speed optical communications and LiDAR applications;

➁ The new sensors reduce laser power requirements by up to 40%, lower system costs, and enhance reliability with MIL-STD-883 compliance and extended operating temperatures;

➂ Enhanced performance stems from antimony alloy integration in semiconductor manufacturing, enabling internal gain up to 120 for superior signal detection.

HPCOptical Communicationssemiconductor
3 months ago

➀ Botfellows GmbH introduces 'Botfellows Dynamic Safety,' a robotics software integrated into control systems, replacing physical safety fences with dynamic zones that adjust robot movements based on human proximity;

➁ The solution enables human-robot collaboration (HRC) in shared workspaces, enhancing productivity and flexibility in tasks like palletizing through coexistence, cooperation, and collaboration scenarios;

➂ Developed in partnership with Estun Automation, the software eliminates complex interfaces, reduces costs, and supports seamless industrial automation.

AIHPCSoftware
3 months ago

➀ A fictional dialogue depicts Ed advising the UK Prime Minister against large-scale government investment in AI data centers, likening it to the 1980s semiconductor industry debate;

➁ Ed argues that AI factories primarily create temporary construction jobs, rely on imported equipment, and location-independent AI training, suggesting the UK should instead focus on niche expertise in chip applications;

➂ He recommends encouraging private AI infrastructure by easing regulations and ensuring utility access, while securing contractual provisions for emergency capacity use.

AIHPCsemiconductor
3 months ago

➀ PCI-SIG released PCIe 7.0 specifications, delivering 128 GT/s raw bit rate and up to 512GB/s bidirectional bandwidth in x16 slots using PAM4 signaling and flit-based encoding;

➁ A new optical PCIe interconnect solution (PCIe 6.4/7.0) was introduced, enabling extended reach and multiplexing for applications like NVMe storage pools and CXL memory shelves in hyperscale AI data centers;

➂ PCIe Gen8 development is already underway, with adoption expected to accelerate in high-performance computing and AI-driven infrastructure.

AI ChipHPCPCIe
3 months ago

➀ Dr. Lutz Stobbe received the 2025 Fraunhofer IZM Research Award for pioneering work on ecological life cycle assessments of ICT infrastructure, focusing on data centers and network technologies;

➁ His research provides granular data on energy, materials, and production processes, enabling eco-design improvements like modular chip manufacturing;

➂ Stobbe advocates for circular economy principles in microelectronics, emphasizing reusability and recyclability while bridging technical analysis with stakeholder communication.

Fraunhofer IZMHPCsemiconductor
3 months ago

➀ The article recounts Grace Hopper's journey from a curious child dismantling alarm clocks to a pioneering computer scientist;

➁ She contributed to groundbreaking projects like the Harvard Mark 1 and Univac 1, with a supercomputer and IC later named in her honor;

➂ The fable emphasizes that curiosity opens doors, culminating in her becoming a Rear-Admiral and leaving a lasting legacy in computing.

HPCsemiconductor
3 months ago

➀ PCI-SIG finalized PCIe 7.0 spec with 128 GT/s per lane, doubling PCIe 6.0 speeds and enabling up to 512GB/s bidirectional bandwidth for data centers.

➁ PCIe 8.0 pathfinding began, targeting 1TB/s bidirectional bandwidth by 2030 through potential 256 GT/s per lane, though optical interconnects remain uncertain.

➂ PCIe 6.0 compliance tests delayed to 2025, while PCIe 7.0 devices are expected to launch between 2028–2029 after rigorous signal integrity challenges at 32 GHz frequencies.

Data centerHPCPCIe
3 months ago

➀ TU Darmstadt publishes an insights paper addressing power grid stability amid increasing renewable energy integration and phase-out of traditional power plants;

➁ The paper highlights key technologies like grid-forming inverters, storage systems, and control methods to maintain system functions such as frequency stability;

➂ It provides policy recommendations for regulators and grid operators to advance the energy transition without compromising grid reliability.

HPCSoftware
3 months ago

➀ Fraunhofer IPMS created a TSN (Time-Sensitive Networking) testbed integrated with Li-Fi technology, enabling wireless real-time data transmission for industrial applications like autonomous robots and factory automation;

➁ The solution supports critical TSN standards for precise synchronization and redundancy, ensures low latency, and provides a modular testing environment for complex networks;

➂ It offers benchmarking for energy efficiency, addressing the growing power demands of telecom infrastructure, and enables industries to validate TSN/Li-Fi performance for reliability and innovation.

HPCautomotivesemiconductor
3 months ago

➀ Fraunhofer IWU has commissioned Saxony's first mobile quantum computer, developed by Leipzig-based startup SaxonQ, featuring 4 qubits and room-temperature operation;

➁ The device, part of the SAX-QT research network, will advance Industry 4.0 solutions and cognitive production, with applications in automotive, aerospace, and energy-efficient AI;

➂ Its diamond-chip-based design eliminates complex cooling systems, offering portability and industrial suitability while boosting computational performance and sustainability.

AIHPCsemiconductor
3 months ago

➀ Most commodity components (standard logic, MCUs, etc.) have stabilized in lead times and pricing due to inventory adjustments and conservative procurement, while AI/ML/HPC-related components (DDR5, HBM, SSDs) face tightening supply and rising prices;

➁ Lead times vary across categories: volatile memory (2-22 weeks), storage (6-12 weeks), advanced analog (7-48 weeks), with interconnect prices expected to rise;

➂ External risks like tariffs could disrupt the stabilized supply chain, and procurement remains cautious about long-term orders amid fluctuating demand.

HBMHPCInfineon