<p>➀ The back-end semiconductor equipment market is projected to exceed $9 billion by 2030, driven by a 6% CAGR, with key segments like TCB (11.6% CAGR) and hybrid bonding (21.1% CAGR) accelerating growth for HBM and chiplet packaging.</p><p>➁ Geopolitical tensions and export controls are prompting industry leaders like TSMC, Intel, SK Hynix, and Samsung to diversify supply chains and localize manufacturing, while equipment vendors such as BESI and ASMPT drive innovation.</p><p>➂ Hybrid bonding and TCB technologies are critical for 3D integration and AI/memory platforms, while China’s domestic vendors aim to expand but face ecosystem maturity hurdles beyond 2030.</p>