➀ Toray Engineering Co., Ltd. has developed the UC5000, a high-precision semiconductor packaging system for panel-level packaging (PLP), which is gaining popularity, especially for AI server applications.

➁ The UC5000 achieves chip packaging accuracy of ±0.8μm using thermal compression bonding (TCB) on large panels, supporting both silicon wafers and glass substrates.

➂ Key features include advanced TCB technology, high-accuracy packaging, and warp-correction transfer technology, addressing challenges such as warping and material expansion in glass panel processing.

➀ Researchers at Columbia University have successfully used DNA to create 3D electronic devices with nanoscale precision, which could significantly enhance computing power by transitioning from 2D to 3D architectures.

➁ This bottom-up approach, based on DNA origami, allows for self-assembly of DNA strands into precise nanostructures, offering a more efficient alternative to traditional top-down etching methods.

➂ The integration of electrodes and semiconductor materials like silicon oxide and tin oxide onto DNA-assembled structures demonstrates their potential application in future microchips, potentially revolutionizing semiconductor manufacturing.

➀ Alphawave Semi推出了针对高速互连半导体市场的最新光电子解决方案，预计到2028年市场规模将超过40亿美元。

➁ 新产品包括支持PAM4和Coherent-lite调制的数字信号处理器（DSP），以实现AI驱动的高速数据中心数据传输。

➂ 该解决方案利用了Alphawave的WidEye DSP架构和EyeQ高级诊断技术，并提供800G和1.6T的互连能力。

➀ A student at the University of Applied Sciences in Hagen, Melanie Welp, has developed a contactless timing system for Paralympic swimming to prevent injury from head impacts.

➁ The prototype uses an ultrasonic sensor to measure the time at six meters and 50 centimeters before the edge of the pool.

➂ The system has been tested and shown to be possible without causing injury to swimmers.

➀ Cadence has launched Conformal AI Studio, an advanced AI tool designed to tackle the challenges of increasing SoC design complexity.

➁ Key features include distributed Boolean logic equivalence checking, automated functional ECO generation, and low-power static signoff tools.

➂ Early adopters like MediaTek have reported significant improvements in productivity, including 83% smaller ECO patches and over 100X faster power-state-table analysis, demonstrating its potential for applications in AI infrastructure, hyperscalers, and mobile devices.

➀ A trawler caught 7 1/2 times as much fish as with conventional driftnet methods using new electronic fish-finding equipment developed by Kelvin and Hughes (Marine) limited;

➁ The story dates back to 65 years ago, when CERES (Combined Echo Ranging Echo Sounding) equipment was introduced;

➂ CERES combined echo-ranging and echo-sounding to improve fishing efficiency.

➀ Ed向他的日记透露，执政不到一年的工党政府正在削减福利预算；

➁ 总理认为Ed是一个多面手，经常找他解决问题，Ed成了他的跑腿；

➂ 总理希望Ed帮助解决长期病假人员的问题，以减少福利预算开支，并避免政府形象受损。

➀ ASUS introduced the ASUS Ascent GX10, a petaflop-scale AI supercomputer powered by the NVIDIA Grace Blackwell Superchip. It provides unprecedented computing power, high-speed memory integration, and easy scalability for enterprise-level AI capabilities.

➁ The device delivers 1,000 TOPS of AI processing power, supporting AI models with up to 200 billion parameters. It includes Blackwell GPU with fifth-generation Tensor Cores and Grace 20-core Arm CPU for efficient data orchestration and real-time inferencing.

➂ The supercomputer integrates NVIDIA NVLink-C2C connectivity, offering 5x the bandwidth of PCIe 5.0. It supports seamless transitions between local development and scalable deployment, aiding developers in AI model prototyping and fine-tuning.

➀ Nvidia的年度GPU技术大会（GTC）正在举行，黄仁勋将发表主题演讲。

➁ 预计黄仁勋将宣布Blackwell 300 AI GPU和更多产品。

➂ B300系列AI GPU预计将在今年下半年推出，下一代Rubin AI GPU预计将于2026年推出。

➀ The semiconductor industry is experiencing transformative growth potential.

➁ Chiplets, artificial intelligence, and advanced packaging are driving this growth.

➂ Foundry capacity is being pushed as a result.