Recent #Chiplet news in the semiconductor industry

5 months ago

➀ Navitas Semiconductor发布了首款量产的650V双向氮化镓(GaN)快充IC,结合了隔离式栅极驱动器。

➁ 这些IC支持单阶段双向系统(BDS),可取代传统的两阶段功率转换设计,适用于电动汽车充电、太阳能逆变器和电机驱动等应用。

➂ 使用这些IC的制造商报告称,成本降低了10%,能源节约20%,体积减少了50%。

ChipletGaNPowerautomotivesemiconductor
5 months ago

➀ Magnachip Semiconductor Corporation has launched 25 new 6th-generation Super Junction (SJ) MOSFETs, which are designed for various applications such as AI TVs, smart appliances, industrial equipment, and electric vehicle (EV) chargers.

➁ These new MOSFETs offer improved switching speeds (up to 23% faster), reduced size (about 30% smaller), and enhanced reliability compared to the previous generation.

➂ The products support voltage ratings of 600V, 650V, and 700V, and are available in multiple package types including TO220, TO220FT, SOT223, and others.

AIChipletHPCPowersemiconductor
5 months ago

➀ Keysight Technologies has introduced KAI Data Center Builder, a new software suite designed to emulate real-world AI training workloads, aiding in assessing the impact of changes to algorithms, components, and protocols on AI system performance.

➁ The tool helps align hardware design with training algorithms, improving overall system performance by integrating training workloads from large language models (LLMs) and other AI models.

➂ KAI Data Center Builder allows AI operators, cloud providers, and infrastructure vendors to test realistic workloads in lab environments, validate new AI cluster designs, refine partitioning strategies, and optimize performance before full deployment.

AIAI PCChipletEDAHPCKeysight
5 months ago

➀ U.S. President Donald Trump has signed an executive order to create the United States Investment Accelerator Office;

➁ The office aims to negotiate better deals for taxpayers;

➂ There are concerns about the impact on existing contracts and awards.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
5 months ago

➀ A recent study introduces a Janus membrane for water purification and energy generation, aiming to address water scarcity and energy needs;

➁ The membrane uses cellulose nanofibers (CNF) and a modified MXene to improve performance over longer periods;

➂ The Janus membrane demonstrates better performance than traditional membranes, achieving a high evaporation rate and photothermal conversion efficiency, and effectively preventing salt buildup.

2nm3D IC3nmAIAI ChipArmChipletCoolingDRAMEDAEMIBEUVGDDRGaNHBMHPCLaptopMicrochipNPUPCIePrivacySSDSoftwareSwitchTIautomotivecybersecuritygamingiosmemorymonitorsemiconductor
5 months ago

FMD has launched the Chiplet Application Hub, a central platform for chiplet technology development and application. The hub aims to bridge the gap between research and industry, accelerate the development of German-made chiplets, and reinforce Germany's technological resilience. It complements FMD's role in the Chips for Europe Initiative and builds on the APECS pilot line infrastructure.

The hub is designed to foster collaboration with industry partners, develop new chiplet solutions, and drive innovation in chiplet technologies. It is expected to enhance energy efficiency, performance, and the reusability of high-cost design components, particularly in the automotive and high-performance computing sectors.

ChipletGermanyHeterogeneous IntegrationHigh-Performance ComputingMicroelectronicsTechnology Transferautomotiveinnovationresearchsemiconductor
5 months ago

➀ Toray Engineering Co., Ltd. has developed the UC5000, a high-precision semiconductor packaging system for panel-level packaging (PLP), which is gaining popularity, especially for AI server applications.

➁ The UC5000 achieves chip packaging accuracy of ±0.8μm using thermal compression bonding (TCB) on large panels, supporting both silicon wafers and glass substrates.

➂ Key features include advanced TCB technology, high-accuracy packaging, and warp-correction transfer technology, addressing challenges such as warping and material expansion in glass panel processing.

AIChipletEDAHPCMicrochipsemiconductor
5 months ago

➀ Researchers at Columbia University have successfully used DNA to create 3D electronic devices with nanoscale precision, which could significantly enhance computing power by transitioning from 2D to 3D architectures.

➁ This bottom-up approach, based on DNA origami, allows for self-assembly of DNA strands into precise nanostructures, offering a more efficient alternative to traditional top-down etching methods.

➂ The integration of electrodes and semiconductor materials like silicon oxide and tin oxide onto DNA-assembled structures demonstrates their potential application in future microchips, potentially revolutionizing semiconductor manufacturing.

3D ICAI ChipChipletDNAsemiconductor
5 months ago

➀ Alphawave Semi推出了针对高速互连半导体市场的最新光电子解决方案,预计到2028年市场规模将超过40亿美元。

➁ 新产品包括支持PAM4和Coherent-lite调制的数字信号处理器(DSP),以实现AI驱动的高速数据中心数据传输。

➂ 该解决方案利用了Alphawave的WidEye DSP架构和EyeQ高级诊断技术,并提供800G和1.6T的互连能力。

AIAI ChipAI PCChipletEDAHPCsemiconductor
5 months ago

➀ A student at the University of Applied Sciences in Hagen, Melanie Welp, has developed a contactless timing system for Paralympic swimming to prevent injury from head impacts.

➁ The prototype uses an ultrasonic sensor to measure the time at six meters and 50 centimeters before the edge of the pool.

➂ The system has been tested and shown to be possible without causing injury to swimmers.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
5 months ago

➀ Cadence has launched Conformal AI Studio, an advanced AI tool designed to tackle the challenges of increasing SoC design complexity.

➁ Key features include distributed Boolean logic equivalence checking, automated functional ECO generation, and low-power static signoff tools.

➂ Early adopters like MediaTek have reported significant improvements in productivity, including 83% smaller ECO patches and over 100X faster power-state-table analysis, demonstrating its potential for applications in AI infrastructure, hyperscalers, and mobile devices.

AIAI ChipASICCadenceChipletEDAHPC
5 months ago

➀ A trawler caught 7 1/2 times as much fish as with conventional driftnet methods using new electronic fish-finding equipment developed by Kelvin and Hughes (Marine) limited;

➁ The story dates back to 65 years ago, when CERES (Combined Echo Ranging Echo Sounding) equipment was introduced;

➂ CERES combined echo-ranging and echo-sounding to improve fishing efficiency.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
6 months ago

➀ Ed向他的日记透露,执政不到一年的工党政府正在削减福利预算;

➁ 总理认为Ed是一个多面手,经常找他解决问题,Ed成了他的跑腿;

➂ 总理希望Ed帮助解决长期病假人员的问题,以减少福利预算开支,并避免政府形象受损。

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
6 months ago

➀ ASUS introduced the ASUS Ascent GX10, a petaflop-scale AI supercomputer powered by the NVIDIA Grace Blackwell Superchip. It provides unprecedented computing power, high-speed memory integration, and easy scalability for enterprise-level AI capabilities.

➁ The device delivers 1,000 TOPS of AI processing power, supporting AI models with up to 200 billion parameters. It includes Blackwell GPU with fifth-generation Tensor Cores and Grace 20-core Arm CPU for efficient data orchestration and real-time inferencing.

➂ The supercomputer integrates NVIDIA NVLink-C2C connectivity, offering 5x the bandwidth of PCIe 5.0. It supports seamless transitions between local development and scalable deployment, aiding developers in AI model prototyping and fine-tuning.

AIAI ChipAI PCChipletEDAGPUHPCMicrochipNVIDIAcpu
6 months ago

➀ Automotive electronics is advancing rapidly, focusing on autonomy, electrification, and car cockpit improvements.

➁ The need for advanced functionality is high, but OEMs aim to minimize costs and maximize software-driven features.

➂ Modern cars are equipped with multiple sensors, including cameras, radar, and lidar, requiring advanced fusion and processing techniques.

AIChipletConnectivityEDAHardwareInnovationSEMICONDUCTORSafetySafety StandardsSensingautomotivesoftware
6 months ago

➀ Nvidia的年度GPU技术大会(GTC)正在举行,黄仁勋将发表主题演讲。

➁ 预计黄仁勋将宣布Blackwell 300 AI GPU和更多产品。

➂ B300系列AI GPU预计将在今年下半年推出,下一代Rubin AI GPU预计将于2026年推出。

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