➀ NVIDIA's stock price dropped 17% after Chinese startup DeepSeek launched its R1 model.

➁ The R1 model, developed in just two months and costing $6 million, rivals OpenAI's ChatGPT.

➂ NVIDIA responded to the development, emphasizing the importance of Test Time Scaling and the need for NVIDIA GPUs.

➀ The adoption of multi-die solutions in HPC chip designs is driven by advancements in interconnect technology, thermal management, and power delivery.

➁ Multi-die architectures offer higher performance, design flexibility, and cost efficiency compared to traditional monolithic designs.

➂ The current market demand for scalable, energy-efficient computing, especially in AI and HPC applications, positions multi-die solutions as a crucial component for future semiconductor developments.

➀ High-speed digital designers face challenges in achieving GHz frequencies and multi-level signaling.

➁ Crosstalk analysis tools like Keysight's Crosstalk Analyzer can save time and cost by automating complex simulations.

➂ Power integrity analysis is crucial for managing power delivery networks in high-power applications like AI chips.

➀ Silicon Creations achieved significant milestones in 2024, including shipping over ten million wafers and reaching 1000 production licenses for its Fractional SoC PLL IP.

➁ The company specializes in mixed-signal IP solutions focusing on clocking and high-speed data interfaces, working with various foundries and advanced process nodes.

➂ In 2025, Silicon Creations anticipates growth in AI accelerator chips, crypto mining, and automotive sectors, driven by customer tapeouts in advanced nodes and early interest in sub-2nm nodes.

➀ Okins Electronics announced on Wednesday that it will supply Samsung with over 400,000 units of semiconductor test sockets, valued at 6.65 billion won (approximately 11.7% of the company's revenue in 2023).

➁ A spokesperson for Okins Electronics stated that the majority of these sockets will be used for Samsung's production processes.

➂ This contract highlights the strong partnership between Okins Electronics and Samsung in the semiconductor industry.

➀ Performance validation in SoC designs is distinct from architectural exploration, focusing on evaluating actual performance to meet specifications.

➁ Hardware-Assisted Verification (HAV) platforms play a crucial role in performance validation by enabling real-world traffic testing and firmware performance tuning.

➂ Part 2 of 2 explores the performance validation process across hardware blocks and firmware in SoC designs, emphasizing the critical role of HAV platforms.

➀ Sarcina Technology, led by Founder and CEO Larry Zu, offers comprehensive post-silicon ecosystem services including package design, assembly, testing, qualification, and production services for leading semiconductor companies.

➁ In 2024, Sarcina developed a Bump Pitch Transformer (BPT) to simplify and reduce costs in 2.5D package designs, addressing challenges related to costly silicon TSV interposers.

➂ Sarcina aims to increase awareness of its capabilities, especially its Application Specific Advanced Package (ASAP) Service, through presentations and participation in industry conferences.

➀ Defacto Technologies, led by Dr. Chouki Aktouf, specializes in innovative SoC design solutions and has become a leader in front-end SoC integration.

➁ In 2024, the company focused on incorporating AI technologies into their R&D projects, aiming to introduce AI-based automation in their tools.

➂ For 2025, the company plans to focus on AI-based EDA and attend key industry conferences like DAC and DATE.

➀ NVIDIA CEO Jensen Huang is collaborating with TSMC on robotics and autonomous vehicle development.

➁ NVIDIA's upcoming Jetson Thor SoC and Project GROOT robot are part of this collaboration.

➂ The collaboration includes a joint silicon photonics research project between NVIDIA and TSMC.