<p>➀ Fraunhofer IZM-ASSID celebrated its 15th anniversary as a global innovation leader in 3D system integration and wafer-level packaging, driving advancements in hybrid bonding and chiplet architectures;</p><p>➁ Key projects like CEASAX and the APECS pilot line under the EU Chips Act strengthen Europe's semiconductor ecosystem, enabling modular chip design and industrial collaboration;</p><p>➂ The institute fosters partnerships with industry giants (e.g., Infineon, GlobalFoundries) and academia, supporting critical research in edge AI, quantum computing, and automotive electronics.</p>