<p>➀ Anthony Paul Bellezza developed two solderless interconnect processes for advanced ICs, addressing challenges with traditional soldering; </p><p>➁ The fusion-based method uses low-temperature bonding (200-400°C) and martensitic substrates to create durable, ultra-low-resistance interconnects with environmental benefits; </p><p>➂ A secondary 2D graphene deposition process offers CMOS compatibility but is less durable, making it suitable for consumer electronics requiring frequent upgrades.</p>