➀ Researchers from Queen Mary University of London have developed new nanocomposite films from starch, offering a sustainable alternative to petroleum-based materials; ➁ The films are made from abundant natural polymer starch and highly conductive MXene, with potential applications in electronics and sensing; ➂ The nanocomposites can be tailored for various uses, including wearable technology and healthcare, and are biodegradable.

➀ The story is about an ambitious startup that entered the DRAM, SRAM, E2PROM, and microprocessor markets; ➁ The company built two fabs and produced successful memories and a unique microprocessor that was not adopted by major applications; ➂ Despite spawning many startups that adopted its approach, the company could not survive independently and was taken over. The moral is that uniqueness can be a negative.

➀ The UK has developed the world's first computer-controlled gas cutting machine, marking a significant step towards automation in shipyards; ➁ The machine, built by British Oxygen-Ferranti, can reduce steel plate cutting time by at least 50% compared to conventional methods; ➂ The technology is applicable to structural engineering, locomotive building, and atomic reactor construction.

➀ Korea’s September semiconductor exports reached a record high of $13.63 billion, up 36.3% year-on-year. Memory exports grew 60.7% year-on-year and 20% month-on-month to $8.72 billion. SoC exports rose 5.2% year-on-year to $4.37 billion. ➁ The overall Information and Communication Technology exports in September 2024 increased by 24% year-on-year to $22.36 billion. ➂ HBM had a significant impact on DRAM export values, and TrendForce forecasts that memory price growth will slow in Q4.

➀ Wolfspeed wins $750m Chips Act award; ➁ Vietnam semi plan; ➂ China to have 11% of global DRAM capacity this year; ➃ Kioxia’s route from $30bn to $5bn; ➄ Intel sets up second high-NA EUV machine

➀ China's DRAM manufacturer Changxin Memory Technologies is expected to have 11% of the global DRAM capacity this year; ➁ Changxin's capacity has increased from 120k wpm at the end of 2023 to 160k wpm in Q1 2024, aiming for 200k wpm by the end of the year; ➂ This rapid expansion could lead to oversupply and a decrease in ASPs for older DRAM types.

➀ HBM is expected to take 10% of the DRAM units but 30% of the revenues due to its higher ASP; ➁ Sourcengine reports that HBM supply is booked out to the end of 2025, with conflicting views on a potential shortage or oversupply next year; ➂ Regular DRAM ASPs are low and may not improve until H2 2025.

Hynix has started mass production of a 36GB 12-layer HBM3E memory, marking the largest capacity HBM to date. The company achieved this by stacking 12 layers of 3GB DRAM chips, making each chip 40% thinner than before and using TSV4 technology. The new product offers improved heat dissipation performance and stability compared to the previous generation, and is designed to excel in speed, capacity, and stability, crucial for AI memory.

➀ SK hynix has begun mass production of its 36GB HBM3E with 12 high dies; ➁ The new HBM3E is designed for next-generation high-performance computing and gaming applications; ➂ This marks a significant advancement in memory technology.

➀ A new research project led by Professor Matthias Jung aims to address the bottleneck caused by memory in computer applications, particularly in AI. ➁ The project involves developing the DRAMSys simulation tool to make it ready for the latest DRAM semiconductor memory standards like HBM4, DDR6, and CXL. ➂ The tool will help developers simulate new applications early in the development stage, identifying potential bottlenecks and optimizing memory usage.

➀ Samsung and SK Hynix are expanding their DRAM business due to the rapid growth of AI, which is expected to make the global DRAM market surpass the foundry sector. ➁ Samsung plans to build a new production line for DRAM and HBM chips in Pyeongtaek, while SK Hynix is set to triple its investment in DRAM chips. ➂ The global memory chip market, including DRAM and NAND flash, is forecast to nearly double to $175 billion this year, driven by investments in AI data centers.

➀ The spot price for consumer memory fell by 30% in Q2, creating a dislocation with contract prices. ➁ Module makers experienced a 40% year-over-year decline in consumer NAND shipments through retail channels, suggesting weak demand. ➂ Next year, DRAM prices are expected to rise gradually each quarter, driven by the increasing adoption of HBM3e.

➀ SK Hynix has developed the industry's first 6th generation 10nm-class DRAM chip, named 1c 16Gb DDR5, featuring lower power consumption and higher efficiency. ➁ The new DDR5 chip operates at 8Gbps, a 11% increase in speed and over 9% improvement in energy efficiency compared to its predecessor. ➂ SK Hynix plans to start mass production of the 1c DDR5 DRAM by the end of this year and begin supplying it next year, aiming to reduce data center power costs by up to 30%.

➀ SK Hynix has developed the world's first sixth-generation 10nm-class DDR5 DRAM, featuring a 16Gb module. ➁ The new 1c process is reported to be 11% faster and 9% more energy-efficient than its predecessor. ➂ SK Hynix claims this technology can reduce data center electricity bills by up to 30% due to its enhanced power efficiency.

➀ Infineon has settled outstanding claims with Qimonda's insolvency administrator by paying $800 million, 15 years after Qimonda's bankruptcy. ➁ The administrator had previously sued Infineon for $3.35 billion, alleging inflated transfer prices. ➂ The settlement will impact Infineon's earnings and cash flow negatively, utilizing the provisions set aside for the legal dispute.

➀ A company once dominated the worldwide DRAM market with an 85% share; ➁ It was acquired for $345 million in 1979 but sold for only $71 million in 1985; ➂ The moral of the story is that circumstances can change rapidly in the chip industry.

➀ No significant rebound in demand in the DRAM spot market; ➁ DDR4 spot prices could weaken further due to passive buyer behavior; ➂ Ample supply of reball DDR4 chips prevents price hikes; ➃ NAND flash spot prices drop as traders anticipate demand revival in Q3 2024.

➀ Samsung has formed a new HBM development team and is targeting to tape-out HBM4 by the end of the year. ➁ The HBM4 will use Samsung's 4nm foundry process for the logic die and 10nm 6th-generation (1c) DRAM for the memory chip. ➂ Samsung's HBM4 test products are expected to be released next year, with mass production slated for the end of 2025.

➀ DRAM market is expected to recover faster than previously predicted, with revenues projected to surge in 2024 and 2025. ➁ Major players like Samsung, SK Hynix, and Micron are competing fiercely, focusing on advanced technologies such as EUV lithography and HBM. ➂ The introduction of EUV technology is crucial for achieving smaller node sizes and higher efficiency in DRAM production.