➀ Kingston introduces the FURY Renegade DDR5 RGB Limited Edition, a 48GB kit with 8,000MT/s speed and RGB lighting; ➁ The design is inspired by cars and racing, featuring a carbon fiber look; ➂ The modules support three XMP 3.0 profiles and come with a lifetime warranty.

➀ Memory growth is expected to exceed 24% due to the increasing adoption of high-end products like HBM3 and HBM3e, with HBM4 introduction in H2 2025. Non-memory is projected to grow 13% driven by advanced node ICs for AI servers, high-end mobile phone ICs, and WiFi7. ➁ The Asia-Pacific IC design market is set to grow 15% as inventory levels stabilize, personal device demand rises, and AI computing expands. ➂ TSMC's market share is projected to increase in Foundry 1.0 and 2.0, with the expansion of advanced nodes like 2nm and 3nm. ➃ 2nm and 3nm production is expected to accelerate, with TSMC and Samsung leading the way. ➄ Foundry capacity utilization is expected to increase, and 2025 is critical for 2nm mass production. ➅ China's packaging and testing market share is set to rise, and FOPLP will grow rapidly post-2025.

➀ Nvidia's RTX 5080 rumored to feature 30 Gbps GDDR7 memory for 960 GB/s bandwidth; ➁ Remaining Blackwell lineup to use slower 28 Gbps modules; ➂ Nvidia's RTX 50 series expected to be first with GDDR7 memory

➀ During the first 10 months of 1960, US manufacturers averaged 10 million transistors sold per month, totaling nearly £9 million in value. This represented a 33% increase from the monthly average of 7.5 million units in 1959. ➁ The story from Electronics Weekly's January 25, 1961, issue mentioned that US manufacturers sold nearly 102 million transistors between January and October 1960, with an October total of 12.2 million units. ➂ The value of US factory transistor sales in the first 10 months of 1960 was £88 million, with a projection for the full year to reach around £100 million.

➀ Lexar introduces the ARES DDR5-6000 CL26 memory with ultra-low latency; ➁ Ideal for gaming, especially with the 9800X3D processor; ➂ Offers a 10% performance improvement over existing CL30 memory

➀ Imec proposes a 3D integrated CCD with IGZO channel for CXL buffer memory; ➁ The memory operates on a planar proof-of-concept structure with a storage capacity of 142 bits; ➂ Imec expects the 3D CCD memory density to scale beyond DRAM limits, with potential for five times more bit density than 2D DRAM by 2030.

➀ Bachmann's third-generation MX200 processor series is set to launch in the first half of 2025; ➁ The new MX215 processor module features more Ethernet and CAN interfaces than the MX214 CPU; ➂ The next-generation MX series is based on VxWorks 7 with secure storage capabilities for keys and passwords.

➀ The WSTS forecasts a 19% growth in the semiconductor market for 2024, primarily driven by a 81% growth in the memory segment; ➁ Companies in the automotive and industrial sectors are experiencing revenue declines; ➂ Nvidia's revenue grew 135% due to AI processors, while memory companies reported substantial revenue gains.

➀ CEA-Leti has demonstrated a scalable hafnia-zirconia-based FeRAM platform integrated into the 22 nm FD-SOI node's BEOL. This is a significant advance in ferroelectric memory technology, improving scalability for embedded applications and positioning FeRAM as a competitive memory solution for advanced nodes. ➁ Current embedded FeRAM products use perovskite materials that are not CMOS compatible and cannot scale beyond 130 nm. The new HfO2-based thin films are CMOS compatible and scalable, offering new possibilities for embedded FeRAM. ➂ The technology is expected to enable faster, more energy-efficient, and cost-effective memory solutions in embedded systems like IoT, mobile devices, and edge computing.

➀ Samsung is preparing for 1c DRAM mass production at its Pyeong Plant 4; ➁ The 1c DRAM is a 6th generation 10nm-class technology expected to be fully commercialized in 2025; ➂ Samsung aims to enhance its competitiveness in the AI market with the new technology.

➀ SEMI forecasts semiconductor manufacturing equipment sales to grow 6.5% year-on-year to $113 billion in 2024, with projections of $121 billion for 2025 and $139 billion for 2026. ➁ The wafer fab equipment (WFE) segment is expected to grow 5.4% to $101 billion in 2024, driven by DRAM, HBM, and China. ➂ Back-end equipment sales are projected to surge, with test equipment sales increasing 14.7% in 2025 and 18.6% in 2026.

➀ Samsung Electronics has developed a 400-layer NAND technology, surpassing SK hynix's 321-layer NAND; ➁ The 400-layer NAND will enter mass production in the second half of 2025; ➂ Samsung plans to provide details on its new 1Tb 400-layer TLC NAND at the ISSCC 2025.

➀ Scientists and engineers from UKAEA and the University of Bristol have created the world's first carbon-14 diamond battery; ➁ The battery leverages the radioactive isotope carbon-14 to produce a diamond battery with a potential lifespan of thousands of years; ➂ The technology could be used in medical devices and extreme environments, providing continuous power for decades.

➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.

➀ Team Group's T-Force brand has launched a new high-performance memory kit, the Xtreem CKD DDR5 8800 (2x 24 GB); ➁ The memory module features Client Clock Driver (CKD) technology for enhanced DDR5 speeds and overclocking potential; ➂ The design includes a 2mm-thick aluminium alloy heat spreader and 10-layer PCB for efficient heat dissipation and stability.

➀ Isu Petasys has abandoned its plan to acquire carbon nanotube manufacturer JEIO; ➁ The decision was personally ordered by Kim Sang Beom, the chairman of Isu Group; ➂ Isu Petasys will forgo the 15.8 billion won deposit that was already paid.

➀ X-FAB is supplying 32kByte capacity SONOS embedded Flash IP on its 110nm BCD-on-SOI platform; ➁ The IP includes an additional 4kbit EEPROM; ➂ The solution is designed for automotive, medical, and industrial applications.

1. HBM demand is skyrocketing, projected to grow from $4B in 2023 to over $25B by 2025; 2. Micron's FY2024 revenue rose 62% YoY, driven by AI demand; 3. Reduced industry capacity and AI demand are stabilizing the cyclical market.

➀ Corsair is developing the new Vengeance DDR5 CUDIMM memory modules; ➁ The modules will feature RGB lighting and be available in black and white; ➂ The kits will offer speeds up to 10,000MT/s and are compatible with Z890 motherboards.

➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.