Recent #memory news in the semiconductor industry

10 months ago
➀ 35ELEMENTS致力于通过开发立方氮化镓半导体材料来帮助实现碳中和;➁ 公司计划在两年内在兼容CMOS的Si(100)衬底上扩大其材料规模,并寻求与代工厂的合作;➂ 35ELEMENTS拥有立方氮化镓材料的独家专利,并计划制造高效的光发射器,如创新型绿色发光二极管。
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10 months ago
➀ Patriot celebrates its 40th anniversary with the Viper Xtreme 5 40 Years RGB memory at CES 2025, offering speeds up to 8000 MT/s and 48GB kits; ➁ The memory features RGB sync with major apps and a special edition heatshield; ➂ Other announcements include the Viper Xtreme 5 CKD Non-RGB DRAM and the iLuxe Stick C for Apple devices.
CES 2025DDR5Patriot MemoryRGB Lightinggamingmemory
10 months ago
➀ The article discusses the current state of server technology in 2025, including CPU core counts, networking speeds, SSD and HDD capacities, server memory, and AI-specific GPUs. It mentions the latest offerings from AMD, Intel, NVIDIA, Broadcom, and others. ➁ It highlights the trends in server technology, such as the increasing number of CPU cores, the rise of 400Gbps networking, and the growth in SSD capacities. ➂ The article also touches on the future of server technology, including the expected advancements in CPU performance, networking, and storage.
AIAMDBroadcomGPUHDDIntelKioxiaMarvellMicronNVIDIANetworkingSSDcpumemoryserver
10 months ago
➀ Researchers at the Advanced Institute for Materials Research (WPI-AIMR) have developed a cobalt-manganese-iron alloy thin film with high perpendicular magnetic anisotropy (PMA), crucial for MRAM devices; ➁ This alloy demonstrates a strong large PMA for the first time, addressing the challenges of current alloys; ➂ The research contributes to the development of innovative spintronics-based memory technologies for a sustainable future.
memory
10 months ago
➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
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11 months ago

➀ SRAM has been used in high-performance computing architectures as embedded cache for decades, but its bit density expansion has slowed down and is affected by standby power issues.

➁ Spin Orbit Torque (SOT) MRAM offers advantages like low standby power, GHz-level switching speed, negligible leakage, almost infinite endurance, high reliability, and scalability, making it a promising alternative to SRAM.

➂ SOT-MRAM uses magnetic tunnel junctions (MTJ) as its basic building block, where the magnetic orientation can be vertical or in-plane, affecting the read and write operations.

➃ Recent advancements in SOT-MRAM technology, including improvements by imec, have demonstrated high switching speeds and durability, addressing key challenges in cache applications.

➄ Imec has developed innovative solutions for field-free switching, low dynamic power consumption, and scaling SOT-MRAM devices to the limit, making it a milestone for high-density SRAM applications.

➅ Further optimization of performance and reliability parameters, such as retention rate and write error rate, is being explored to bring SOT-MRAM closer to real-world specifications.

➆ Imec has also presented a novel composite free layer for MTJ, which improves the reliability of SOT-MRAM devices and reduces sensitivity to external magnetic disturbances.

ImecSRAMmemory
11 months ago

➀ SRAM has been used in high-performance computing architectures as embedded cache for decades, but its bit density expansion has slowed down and is affected by standby power issues.

➁ Spin Orbit Torque (SOT) MRAM offers advantages like low standby power, GHz-level switching speed, negligible leakage, almost infinite endurance, high reliability, and scalability, making it a promising alternative to SRAM.

➂ SOT-MRAM uses magnetic tunnel junctions (MTJ) as its basic building block, where the magnetic orientation can be vertical or in-plane, affecting the read and write operations.

➃ Recent advancements in SOT-MRAM technology, including improvements by imec, have demonstrated high switching speeds and durability, addressing key challenges in cache applications.

➄ Imec has developed innovative solutions for field-free switching, low dynamic power consumption, and scaling SOT-MRAM devices to the limit, making it a milestone for high-density SRAM applications.

➅ Further optimization of performance and reliability parameters, such as retention rate and write error rate, is being explored to bring SOT-MRAM closer to real-world specifications.

➆ Imec has also presented a novel composite free layer for MTJ, which improves the reliability of SOT-MRAM devices and reduces sensitivity to external magnetic disturbances.

ImecSRAMmemory
11 months ago
➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
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