➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
Recent #memory news in the semiconductor industry
➀ ATEK Access Technologies has developed the Mini-Bar, a memory token and receptacle system designed for handheld applications, which is 60% smaller than the equivalent Bar receptacle models. The MBRHN model measures 16.3mm x 14.7mm x 13.6mm and the MBRFN model is slightly smaller. The Mini-Bar tokens are larger than microSD cards but thicker and stronger. They use serial EEPROM and are available in 16kb or 256kb capacities. ➁ Next year, ATEK will introduce Mini-Bar tokens using Microchip's secure memory ICs. ➂ The Mini-Bar system aims to balance size reduction with ease of handling credentials in cryptographic products and embedded systems.
➀ Lexar ARES RGB 6400MT/s DDR5 memory kit is on sale for £98.99 until December 2nd; ➁ Lexar THOR RGB 6000MT/s DDR5 memory kit is available for £86.99; ➂ Lexar PCIe 4.0 M.2 SSDs are up to 19% off, with the Lexar NQ790 4TB at £205 and the Lexar NM790 offering speeds up to 7400MB/s read/write.
➀ In this interview, Paul Plitzuweit from Datakey discusses the portable memory system formed by Datakey Mini-Bar receptacles and memory tokens; ➁ The system is designed for small embedded systems requiring a robust credential or removable memory device for harsh environments; ➂ It aims to minimize front panel space and internal volume, targeting applications such as Crypto Ignition Key (CIK).
➀ JEDEC has published JESD230G, a new NAND Flash Interface Interoperability Standard; ➁ The standard supports speeds up to 4,800 MT/s, a significant increase from the previous version; ➂ JESD230G introduces a separate Command/Address Bus Protocol (SCA) for improved efficiency.
➀ NVIDIA is set to use Samsung's new GDDR7 memory chips for its upcoming GeForce RTX 50 series GPUs; ➁ The RTX 50 series will feature both 28Gbps and 32Gbps GDDR7 memory; ➂ Samsung's GDDR7 memory chips will be used by NVIDIA's GeForce RTX 50 series GPUs in early 2025.
➀ Overclocker 'snakeeyes' sets a new memory OC world record with 12,611.6MT/s using Patriot Viper Xtreme 5 RAM; ➁ The record was achieved with LN2 cooling on an ASRock Z890 Taichi OCF motherboard; ➂ The setup now ranks #1 on HWBOT's memory frequency rankings.
➀ Lexar's ARES RGB DDR5 memory range is designed for gamers and PC enthusiasts with speeds up to 7200MT/s. The reviewed kit is a 32GB DDR5-6400 kit with SK hynix A-die ICs and XMP 3.0/EXPO support. ➁ The memory features RGB lighting and an aluminum heat spreader for cooling. ➂ The review covers performance testing on both Intel and AMD platforms, including benchmarks, compute and productivity tests, and gaming performance.
➀ The WSTS reported a $166 billion semiconductor market revenue in Q3 2024, with the highest growth rate since 2021. Nvidia led the market with AI GPU strength. ➁ SK Hynix, Micron, and Kioxia reported double-digit revenue growth, while Renesas Electronics saw a decline. ➂ The outlook for Q4 2024 and 2025 is mixed, with AI driving growth but concerns over automotive market and memory market impact.
➀ The DDR5 era has arrived with the launch of Intel Core Ultra 200 series and AMD Ryzen 9000 series, which only support DDR5 and not DDR4;
➁ Misconceptions about DDR5, such as high latency and low upgrade value, have been resolved, highlighting DDR5's advantages;
➂ Crucial DDR5 Pro OC 6400 utilizes Micron's 1zz process technology and supports both Intel XMP and AMD EXPO standards for better compatibility;
➃ The DDR5 Pro OC can improve game frame rates with a speed of 6400 MT/s, suitable for both gamers and creators involved in data-intensive tasks;
➄ The DDR5 Pro OC 6400 offers 16GB modules with aluminum heat sinks in black or white origami-style designs, enhancing the feel;
➅ Compared to DDR4 3200 MT/s, the DDR5 Pro OC 6400 doubles data transfer capabilities and has a lower real-world latency due to its higher frequency;
➆ The performance of the DDR5 Pro OC 6400 is partly limited by the Ryzen 5 7600 CPU, but it still shows great potential for future upgrades;
➇ DDR5 is becoming a necessity in 2024, and it's time to embrace the new era of DDR5!
➀ Hynix is set to sample HBM3e 16hi memory in the first half of 2025; ➁ Lightsynq Technologies emerges with $18 million in Series A funding for diamond optical interconnects in quantum computing; ➂ DigiKey is optimistic about the future of the electronics market; ➃ Texas Instruments aims to increase in-house manufacturing to 95% by 2030.
➀ SK Hynix has commenced production of its 321-layer NAND chip; ➁ The chip features the highest number of layers in the industry; ➂ The product was first introduced at Flash Summit 2023 in August.
➀ Hynix has started mass production of the world's first 321-layer NAND with 1Tb capacity; ➁ The 321-layer device offers a 12% improvement in write time and a 13% improvement in read time compared to the 238-layer device; ➂ Hynix has adopted the '3 plugs' process technology and a low-stress material for stacking more than 300 layers.
➀ YEST announced that it will supply 11.16 billion won worth of eFurnace to SK Hynix; ➁ The eFurnace is used for purifying wafers and enhancing their electrical properties; ➂ SK Hynix is expected to use the equipment in HBM production.
➀ Thermaltake's ToughRAM XG RGB D5 DDR5 memory is reviewed, highlighting its speeds from 5600MT/s to 8000MT/s and unique heatsink design. The 7200MT/s kit is tested and priced at $199.99. ➁ The memory features SK Hynix A-die ICs, XMP 3.0, and a lifetime warranty. ➂ The review includes benchmarks on Intel and AMD platforms for gaming, productivity, and encoding.
➀ Overclocker AKM sets a new DDR5 memory frequency world record of 12527MHz; ➁ The record is achieved with an Intel Core Ultra 9 285K Processor, ASRock Z890 Taichi OCF motherboard, and V-COLOR Manta XFinity DDR5 memory; ➂ ASRock's design features contribute to the record-breaking performance.
➀ Alliance Memory has expanded its Serial NOR Flash product line with three new 3.3V families; ➁ The new products are designed for high-performance and reliable code storage and execution in embedded systems; ➂ The devices support various interfaces and features, making them versatile for different applications.
➀ Embedded non-volatile memories (eNVM) are memory blocks integrated directly into semiconductor fabrication; ➁ Non-volatile data retention even when power is off; ➂ Reprogrammable and erasable multiple times; ➃ Lower power consumption and quick access compared to external non-volatile memory technologies.
➀ Intel celebrates the arrival of MR DIMMs, a plug and play solution for ultrafast memory with double the memory bandwidth of standard DRAM; ➁ MR DIMMs operate two DDR memory ranks in a multiplexed mode, offering high data transfer rates and low latency; ➂ Intel's Xeon 6 processors support up to 3TB of MR DIMM memory at DDR5-8800 speed, with significant latency and power consumption improvements.
➀ Lenovo showcases a new server, the ThinkSystem SR860 V3, with 128x 128GB DDR5 DIMMs and CXL memory technology; ➁ The server leverages Astera Labs Leo CXL controllers to achieve massive memory capacity; ➂ The system supports up to 16TB of memory and can accommodate four double-width GPUs.