➀ EUV和DUV在20nm间距下都是可行的选项；
➁ 在20nm间距下，EUV和DUV方法可以实现类似的特征尺寸和分辨率；
➂ 即使在EUV光刻中，2nm节点的任何双曝光方案仍然需要成像10nm线宽。
Recent #EDA news in the semiconductor industry
➀ Alpha Design AI is revolutionizing chip design and verification with ChipAgents, an AI tool that automates debugging and verification processes.
➁ The company is led by CEO and founder Dr. William Wang, who is also a professor at UC Santa Barbara.
➂ ChipAgents addresses industry challenges by integrating with existing EDA tools and reducing design cycle time.
Applied Materials demonstrated its new inspection kit SEMVision H20 on Thursday, equipped with the company's second-generation cold fusion emission (CFE) technology, which is three times faster than thermal fusion emission (TFE) equipment for analysis.
➀ MIT researchers have developed a chip-based terahertz wave generator that doesn't require bulky silicon lenses, making it scalable and cost-effective.
➁ The system uses a thin, patterned sheet attached to the back of the chip to improve efficiency, leveraging Intel's high-power transistors.
➂ This technology could be integrated into various applications such as security scanners and environmental monitors due to its scalability and high peak radiation power of 11.1 dBm.
➀ Arteris, Inc. introduces FlexGen, a revolutionary NoC interconnect IP;
➁ FlexGen accelerates chip development and optimizes performance efficiency;
➂ The solution addresses the growing demand for faster and more sustainable innovation in the automotive, datacenter, and consumer electronics sectors.
➀ Applications for the third cohort of ChipStart UK, a government-funded early-stage semiconductor incubator, are now open.
➁ Eligible startups include those developing semiconductor technologies and are incorporated in the UK with less than $1.5 million in private VC or Angel funding.
➂ The incubation programme, focused on investor readiness, is funded by the DSIT UK Government department and is free for participants.
➀ Traditional RF board design strategies are insufficient for high frequencies and dense layouts;
➁ Keysight and Modelithics collaborate on an advanced RF board simulation workflow;
➂ The use of 3D passive component models enhances simulation accuracy and reduces the risk of board re-spins.
➀ The VTT Technical Research Centre of Finland has been awarded €29 million for chip packaging development under the EU APECS pilot line project.
➁ VTT will focus on radio frequency technologies for 6G networks and the development of optical microsystems and chip packaging methods.
➂ VTT is involved in FAMES and NanoIC pilot line projects and will operate in Kvanttinova, a microelectronics and quantum technology RDI Hub.
➀ Siemens Digital Industries Software has introduced an automated and certified workflow for TSMC's InFO packaging technology.
➁ The workflow is driven by Innovator3D IC and includes Xpedition Package Designer software, HyperLynx DRC, and Calibre nmDRC technologies.
➂ Siemens Digital's svp AJ Incorvaia highlights the expansion of design avenues for customers.
➀ Alchip预计2024年营收将超过10亿美元，实现重大里程碑；
➁ 公司专注于先进技术，包括2nm测试车间的发布和3DIC设计流程的准备工作；
➂ Alchip通过灵活且强大的3DIC设计流程应对先进封装的挑战，优化功率传输、互连和热特性。
Siemens Partners with Alphawave to Accelerate Customer Time-to-Market with Advanced Semiconductor IP
➀ Siemens Digital Industries Software announces an exclusive OEM agreement with Alphaw Semi to market its high-speed interconnect silicon IP product portfolio through its sales channels.
➁ The agreement includes Alphawave Semi's leading IP platform for connectivity and memory protocols such as Ethernet, PCIe, CXL, HBM, and UCIeDie-to-Die).
➂ The collaboration will provide comprehensive Spec to Silicon Solutions by leveraging the combined capabilities and strengths of both companies.
➀ The GeForce RTX 5060's launch has been pushed back to April 2025 due to 'chip supply constraints';
➁ The delay affects the RTX 5070, RTX 5080, and RTX 5090, with limited supply expected leading to instant sellouts;
➂ The AI boom is increasing semiconductor demand, impacting the availability of the new GeForce RTX 50 Series.
➀ OpenAI, the creator of ChatGPT, is about to finalize its first in-house AI chip design;
➁ The company plans to send the chips to TSMC for fabrication with an aim for mass production in 2026;
➂ This move is a significant step towards reducing reliance on NVIDIA.
➀ Anduril Industries, led by Palmer Luckey, is set to take over the US Army's Integrated Visual Augmentation System (IVAS) program, pending Department of Defense approval.
➁ The program includes advanced headgear with AR capabilities, and Anduril will manage production and development with Microsoft Azure as the preferred cloud provider.
➂ Palmer Luckey, the founder of Oculus VR and Anduril Industries, sees this as a deeply personal achievement, emphasizing the potential of the technology to save lives.
➀ Thalia Design Automation has announced the latest version of the AMALIA Suite;
➁ The new version includes a 'Device-Stretching' algorithm and Flip Well Intelligence;
➂ Enhancements are particularly within the Layout Automation Suite.
➀ Silicon Creations successfully tape-outs a chip on the TSMC N2P process;
➁ The chip includes a novel temperature sensor design;
➂ The expanded portfolio of clocking IP supports next-generation semiconductor products.
➀ Molex推出了一款新型MMCX同轴电缆供电（PoC）解决方案，适用于多种应用领域，包括航空航天、国防、农业、汽车等。
➁ 该解决方案具有专利连接技术，确保了稳定的连接和电气接地连续性。其工作频率范围为DC到6GHz，并且在-65°C至+125°C的温度范围内运行。
➂ 这一解决方案还支持产品升级，保持与IEC 61169-52 MMCX插座的兼容性，减少重新设计成本。
➀ Madhuparna Datta from Cadence Design Systems has joined the UK Electronics Skill Foundation (UKESF) board as a Trustee.
➁ She has over 25 years of experience in the semiconductor industry and is currently the Application Engineer Director at Cadence.
➂ Madhuparna brings extensive expertise and a commitment to inspiring young people to pursue electronics, particularly addressing the gender imbalance in the sector.
➀ NVIDIA CEO Jensen Huang introduced new tools at CES 2025 aimed at democratizing AI access for everyone, not just researchers or large enterprises.
➁ These tools include Project DIGITS, NEMO, and Blackwell GPUs, which are designed to be portable, scalable, and easy to use, reducing the barriers to AI adoption.
➂ The introduction of these tools aims to simplify workflows, lower the barrier to entry, and empower individuals and small teams with AI capabilities.
➀ proteanTecs提供先进的电子设备，具备自监控功能，以优化性能、降低功耗并防止故障；
➁ proteanTecs的AVS Pro™解决方案为客户实现了显著的节能效果，最高可达14%；
➂ proteanTecs通过生产测试和深度数据可见性解决方案，帮助公司优化芯片性能并缩短上市时间。