<p>➀ The VTT Technical Research Centre of Finland has been awarded €29 million for chip packaging development under the EU APECS pilot line project.</p><p>➁ VTT will focus on radio frequency technologies for 6G networks and the development of optical microsystems and chip packaging methods.</p><p>➂ VTT is involved in FAMES and NanoIC pilot line projects and will operate in Kvanttinova, a microelectronics and quantum technology RDI Hub.</p>
Related Articles
- Startup aims to 3D print chips and cut production costs by 90% — nanoprinter operates at wafer scale4 months ago
- Prototype of a Particularly Sustainable and Energy-Autonomous E-Bike Terminal Developed at HKA5 months ago
- Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications5 months ago
- White Knight to save Shibaura5 months ago
- Ed Rides The Tariff Roller-Coaster5 months ago
- Image Acquisition Software Launch for Centralized Control of NanoZoomer® MD Series5 months ago
- Trump creates U.S. Investment Accelerator to manage CHIPS Act and 'negotiate much better deals'5 months ago
- April 2025 Issue Of Electronics For You5 months ago
- Water Purification and Energy Generation Using a CNF@CTAB-MXene/PTFE Janus Membrane5 months ago
- High-Precision Panel-Level Packaging System5 months ago