➀ Multi-die design and heterogeneous integration are crucial for semiconductor technology scaling.

➁ Synopsys offers a comprehensive suite of solutions for multi-die design challenges.

➂ Detailed insights into multi-die system architecture, verification, implementation, and testing are provided by Synopsys white papers.

➀ The article introduces free-to-use Circuit Design Calculators for Engineers and Students.

➁ These calculators simplify complex equations, saving time and effort in circuit design.

➂ It lists various calculators including 555 Timer, Ohm's Law, Voltage Divider, LED Series Resistor, and more, all available for free use.

➀ Teradyne and Infineon Technologies have announced a strategic partnership;

➁ The partnership aims to advance power semiconductor testing;

➂ The collaboration is part of a strengthened relationship between the companies.

➀ Jayesh Ranjan, from Telangana's IT and Commerce Department, discusses how Telangana's electronics and semiconductor ecosystem has grown and the challenges it faces.

➁ Despite the lack of a wet port, Telangana offers incentives such as land allotment discounts, subsidies, and employment-based incentives to attract semiconductor and ESDM companies.

➂ The state aims to position itself as a global hub for electronics and semiconductor manufacturing with policies that focus on high-growth segments and fostering innovation.

➀ LUBIS EDA is a company that specializes in automating formal verification to enhance the reliability of high-risk silicon designs.

➁ Their cloud-based product, LUBIS-on-cloud, simplifies the setup process and uses AI for quick bug detection.

➂ In 2023, they completed over 50 projects, uncovering more than 250 bugs, demonstrating the effectiveness of their verification process.

➀ PSS and UVM work together for system-level verification, with PSS ideal for system-level testing and UVM for block-level testing.

➁ The Siemens EDA white paper explains methods to enhance collaboration between PSS, UVM, and C, facilitating detailed testing using randomization and coordination across components.

➂ PSS is perfect for building and randomizing scenarios at the system level, connecting to DUT-level testbench components through UVM virtual sequences or high-level C models.

➀ NVIDIA's stock price dropped 17% after Chinese startup DeepSeek launched its R1 model.

➁ The R1 model, developed in just two months and costing $6 million, rivals OpenAI's ChatGPT.

➂ NVIDIA responded to the development, emphasizing the importance of Test Time Scaling and the need for NVIDIA GPUs.

➀ The adoption of multi-die solutions in HPC chip designs is driven by advancements in interconnect technology, thermal management, and power delivery.

➁ Multi-die architectures offer higher performance, design flexibility, and cost efficiency compared to traditional monolithic designs.

➂ The current market demand for scalable, energy-efficient computing, especially in AI and HPC applications, positions multi-die solutions as a crucial component for future semiconductor developments.

➀ The semiconductor industry is expected to see significant expansion in 2025 with plans to start construction on 18 new fabrication plants (fabs).

➁ According to SEMI's World Fab Forecast, the industry is projected to grow to $697 billion in 2025, marking an 11.2% increase from 2024.

➂ Some of these fabs are scheduled for production in 2026 or later.

➀ Modern IC design increasingly uses advanced packages that integrate multiple ICs and high-bandwidth memory, creating complex connectivity that challenges traditional verification methods.

➁ Traditional verification relies on manual processes and spreadsheets, which are inadequate for modern designs with over 500,000 connections, leading to potential errors.

➂ Formal verification offers a powerful alternative by mathematically analyzing all interconnections, ensuring comprehensive and efficient verification of IC packages, thus improving quality and reducing time to market.

➀ Innova's PDM tool helps optimize resource tracking and management, potentially reducing costs by 15-30%.

➁ A holistic approach to chip design enhances cost, schedule, sustainability, and ecological impact management.

➂ The webinar, presented by Dr. Chouki Aktouf, details how Innova tools help monitor ecological impacts like carbon emissions.

➀ The Physical-Technical Federal Agency (PTB) has established a new Competence Center 'Artificial Intelligence and Metrology' (KI-Met) to consolidate its activities related to artificial intelligence.

➁ PTB has been involved in research questions related to AI for several years and is focusing on creating synergies and exchanging knowledge with stakeholders from politics, industry, and standardization.

➂ The new competence center aims to improve the perception of PTB as a competent partner in AI and potentially become the first metrology institute worldwide to offer certification for AI algorithms.

➀ The project 'DynaviL' has been launched at Hochschule Kempten to research wireless dynamic charging for electric vehicles, which will be designed for a spatially extended area for the first time.

➁ The project is funded by the Bavarian State Ministry of Economic Affairs, Regional Development and Energy under the 'Electrical Systems' program with around €436,000.

➂ Two use cases are being demonstrated: autonomous shuttles and industrial vehicles. The goal is to develop a cost-effective solution that can be applied to both use cases.

➀ High-speed digital designers face challenges in achieving GHz frequencies and multi-level signaling.

➁ Crosstalk analysis tools like Keysight's Crosstalk Analyzer can save time and cost by automating complex simulations.

➂ Power integrity analysis is crucial for managing power delivery networks in high-power applications like AI chips.

➀ The January 2025 issue of Electronics For You features a cover story titled 'What Does 2025 Hold In Store For Us?'

➁ The issue includes articles on direct-to-mobile technology solutions, illuminating fashion with electronic track printed dresses, choosing the right cloud platform for IoT protocols, and interviews with industry leaders.

➂ It also covers DIY projects like an IoT smart meter with a dashboard, op-amp-based vehicle theft detector, and an ESP32-powered audio-visual siren.

➀ Leading Chinese semiconductor equipment makers reported significant revenue growth in 2024.

➁ AMEC, ACM, and Naura saw increases in sales and profitability despite increased R&D spending.

➂ The growth is attributed to the increasing demand for chipmaking tools and the construction of new fabs in China.

➀ The Fraunhofer Institute for Microstructure of Materials and Systems IMWS is working on a project called FA2IR with partners to develop solutions for using digital tools for fault analysis.

➁ The project aims to automate AI-assisted analysis to reduce subjectivity, shorten development times, and improve product quality.

➂ The initiative seeks to create comprehensive and fully integrated environments for processing and managing digital data, algorithms, methods, and models for machine learning that are globally applicable and can be dynamically expanded.

➀ Infinisim, founded by Samia Rashid, specializes in SoC clock verification solutions for high-performance designs.

➁ In 2024, Infinisim capitalized on the growing demand for AI and data-intensive applications, focusing on clock performance and the challenges of timing jitter and reliability aging.

➂ For 2025, Infinisim anticipates growth driven by the rapid expansion of AI applications, emphasizing the need for precise design methodologies and reducing excessive margins to enhance performance and profitability.

➀ Silicon Creations achieved significant milestones in 2024, including shipping over ten million wafers and reaching 1000 production licenses for its Fractional SoC PLL IP.

➁ The company specializes in mixed-signal IP solutions focusing on clocking and high-speed data interfaces, working with various foundries and advanced process nodes.

➂ In 2025, Silicon Creations anticipates growth in AI accelerator chips, crypto mining, and automotive sectors, driven by customer tapeouts in advanced nodes and early interest in sub-2nm nodes.

➀ Two research projects, KI-AmaR and XRai Vision, are receiving funding to develop AI-assisted systems for complex repairs and the use of XR technologies in industrial processes.

➁ The KI-AmaR project aims to enable complex repairs without specialized training using a mobile smart factory equipped with a 3D printer.

➂ The XRai Vision project focuses on supporting companies in adopting Extended Reality (XR) technologies like AR and VR to improve their workflows and productivity.