➀ The Sovol SV06 ACE is a budget-friendly 3D printer with high speeds and quality features; ➁ It is inspired by Prusa's i3 machines and features Klipper firmware and a built-in camera; ➂ The printer offers auto bed leveling, high flow nozzle, and a variety of materials support.

➀ Imec proposes a 3D integrated CCD with IGZO channel for CXL buffer memory; ➁ The memory operates on a planar proof-of-concept structure with a storage capacity of 142 bits; ➂ Imec expects the 3D CCD memory density to scale beyond DRAM limits, with potential for five times more bit density than 2D DRAM by 2030.

➀ Chipmetrics is a Finnish company specializing in metrology solutions for high aspect ratio 3D chips; ➁ They provide test chips to accelerate R&D and process control workflows; ➂ The company's PillarHall test chips enable precise measurements of film properties in high aspect ratio cavities.

➀ GMG's THERMAL-XR® coated heat sinks demonstrate the potential for miniaturization and efficiency; ➁ The technology could reduce heat sink size by up to 39% while maintaining equivalent thermal performance; ➂ The application of THERMAL-XR® could improve the efficiency of heat sinks, enabling smaller heat sinks and more compact PCB assemblies.

➀ Synopsys addresses the challenges of multi-die integration with its 3DIO IP Solution and 3DIC tools; ➁ The 3DIO IP Solution includes synthesis-friendly Tx/Rx cells and a high data rate solution; ➂ Synopsys' tools enable faster timing closure and reduced bit error rates in multi-die designs.

➀ Researchers from City University of Hong Kong have observed a new vortex electric field with potential applications in enhancing future electronic, magnetic, and optical devices; ➁ The research, published in Science, could lead to improved memory stability and computing speed, as well as impact quantum computing, spintronics, and nanotechnology fields; ➂ The team developed an innovative ice-assisted transfer technique to create twisted bilayers with a wide range of twist angles, leading to the discovery of a 2D quasicrystal that may enhance various device capabilities.

➀ Broadcom unveils its 3.5D XDSiP platform for AI and HPC processors; ➁ The platform utilizes TSMC's CoWoS and advanced packaging technologies; ➂ It allows for SiPs with up to 6000mm² of 3D-stacked silicon and 12 HBM modules, set to arrive in 2026.

➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.

➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.

➀ MZ Technologies is addressing complex challenges in 2.5D and 3D IC design with advanced EDA software, GENIO; ➁ The company has announced a roadmap for GENIO with enhancements for 2025, focusing on thermal and mechanical stress issues; ➂ GENIO is designed to facilitate the design and optimization of complex IC systems.

➀ Samsung has significantly reduced the amount of photoresist (PR) used in the photolithography process for its 3D NAND flash production. ➁ The company plans to use only half the amount of PR in future NAND production. ➂ The move is part of Samsung's effort to enhance its manufacturing efficiency and reduce costs.

➀ Introduces the best 3D printers for children and teenagers; ➁ Discusses the benefits of 3D printing for young learners; ➂ Reviews specific models like Bambu Lab A1 Mini, ToyBox, and AOSEED X-Maker, highlighting their features and suitability for kids and teens.

➀ Hynix has started mass production of the world's first 321-layer NAND with 1Tb capacity; ➁ The 321-layer device offers a 12% improvement in write time and a 13% improvement in read time compared to the 238-layer device; ➂ Hynix has adopted the '3 plugs' process technology and a low-stress material for stacking more than 300 layers.

➀ The Substrate Vision Summit in Santa Clara is expected to attract a large crowd, focusing on semiconductor substrates and their impact on 3D IC performance. ➁ AI's role in transforming the semiconductor value chain will be discussed, highlighting its impact on scaling, complexity, and high-performance chip demands. ➂ Keynote speakers and panel discussions will explore advancements in semiconductor materials, AI computing, and the role of universities in technology development.

➀ Alchip presents at TSMC OIP Ecosystem Forum; ➁ Challenges in 3D IC design overcome; ➂ Collaboration with Synopsys and TSMC for 3D design innovation

➀ Tanaka claims to have developed the world's first bulk platinum with controlled crystal grain size in the nano scale; ➁ This new technology enables the development of pure platinum with 99.9% or higher purity, offering 10 times the hardness and 4 times the strength of typical platinum materials; ➂ The developed platinum has unique properties due to its high density of small-angle grain boundaries, large-angle grain boundaries, dislocations, and other lattice defects, which may lead to its application in various industries.

➀ The Raspberry Pi 5 has been successfully used with a Radeon GPU to run modern AAA games like Doom Eternal at 4K resolution; ➁ The performance improvements are thanks to new drivers for AMD Radeon GPUs; ➂ The combination showcases the potential of eGPU setups with Raspberry Pi.

➀ Test Research, Inc. (TRI) has launched the TR7600 SIII Plus, a high-throughput 3D SEMI CT AXI system for the semiconductor and advanced packaging industries. ➁ The system is designed for high throughput and integrates AI-powered inspection algorithms for precise defect detection. ➂ It offers versatile inspection capabilities and is suitable for advanced packaging, automotive, aerospace, and medical industries.

➀ Gii, a nanomaterial, is found to be highly detective in broadband photodetectors, potentially leading to faster fiber optic networks, more detailed medical imaging, and better environmental monitoring; ➁ The research suggests Gii can replace multiple materials, reducing costs and improving device designs; ➂ Gii's versatile applications include telecommunications, medical diagnostics, environmental monitoring, and more.

➀ The Ayaneo 3 is announced as the latest flagship device by Ayaneo, featuring the AMD Ryzen AI 9 HX 370 CPU. ➁ The device includes a 7-inch high-refresh LCD or OLED HDR display and additional buttons for user control. ➂ The Ayaneo 3 will compete with other handheld consoles such as the ROG Ally 2 and MSI Claw 8 AI+.