Recent #3D IC news in the semiconductor industry

8 months ago

➀ This paper discusses the post-silicon validation of the IBM POWER9 processor, highlighting its significance in the context of increasing multi-core processor adoption by hyperscalers.

➁ IBM's Threadmill, a tool for processor verification, has been enhanced since the POWER7, including optimized template allocation and debugging strategies for multi-core write drops.

➂ The validation methodology for POWER9 has significantly improved bug detection rates compared to POWER8, with new techniques like AI prioritization and hardware irritators to induce bugs.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
9 months ago

➀ Traditional RF board design strategies are insufficient for high frequencies and dense layouts;

➁ Keysight and Modelithics collaborate on an advanced RF board simulation workflow;

➂ The use of 3D passive component models enhances simulation accuracy and reduces the risk of board re-spins.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
9 months ago

➀ Researchers from Rice University studied relaxor ferroelectric materials, finding that their fundamental properties change unexpectedly when reduced to thin films at a scale comparable to their internal polarization structures;

➁ The study focused on lead magnesium niobate-lead titanate (PMN-PT), a widely used ceramic material, and observed an unexpected effect: the material exhibits enhanced performance before losing its unique properties;

➂ The research could inform the development of next-generation nanoelectronic devices and has potential applications in low-voltage magnetoelectrics, pyroelectric energy conversion, capacitive energy storage, and nanoelectromechanical systems.

3D ICMaterials Scienceceramicenergy harvestingsemiconductorsensor
9 months ago

➀ Anduril Industries, led by Palmer Luckey, is set to take over the US Army's Integrated Visual Augmentation System (IVAS) program, pending Department of Defense approval.

➁ The program includes advanced headgear with AR capabilities, and Anduril will manage production and development with Microsoft Azure as the preferred cloud provider.

➂ Palmer Luckey, the founder of Oculus VR and Anduril Industries, sees this as a deeply personal achievement, emphasizing the potential of the technology to save lives.

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9 months ago

➀ A research team from Seoul National University of Science and Technology has developed a bioink using nanocellulose derived from Kombucha SCOBY as a scaffold material.

➁ The bioink is compatible with a portable 'Biowork' biopen, designed for precise application to irregular surfaces.

➂ The technology allows for a quick and easy one-step process for treating large or irregularly shaped wounds.

3D ICNPU
9 months ago

➀ DeepSeek, a Chinese AI software developer, claims it can train leading AI programs at a fraction of the cost compared to top US developers.

➁ DeepSeek recently launched R1, a program trained on 2000 Nvidia GPUs, which outperforms models from OpenAI, Anthropic, and xAI's Grok.

➂ The company also offers V3, which is free but requires payment for integration with its infrastructure. V3 excels in inference speed and competes with the most advanced closed-source models globally.

3D ICAIAI ChipAI PCGPUHPCNVIDIA
10 months ago

➀ Heterogeneous integration is a solution that allows different materials and components to work together seamlessly, enhancing system performance.

➁ This approach enables the development of sophisticated electronic devices that are smaller, faster, and more efficient.

➂ Understanding heterogeneous integration involves grasping its key concepts and technologies.

3D ICChipletHPC
10 months ago
➀ 35ELEMENTS致力于通过开发立方氮化镓半导体材料来帮助实现碳中和;➁ 公司计划在两年内在兼容CMOS的Si(100)衬底上扩大其材料规模,并寻求与代工厂的合作;➂ 35ELEMENTS拥有立方氮化镓材料的独家专利,并计划制造高效的光发射器,如创新型绿色发光二极管。
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
10 months ago
➀ A research team from Daegu Gyeongbuk Institute of Science & Technology has developed a new technique to regulate doping during the nucleus phase, enhancing the performance of semiconductor nanocrystals; ➁ The study highlights the influence of the choice of doping element on the process and location; ➂ The technology is expected to have wide applications in advanced electronic devices.
3D ICEDAHPCMicrochipsemiconductor
11 months ago
➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
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11 months ago
➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusCXLChipletCoolingDDR4DRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonIntelLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIXeonautomotivecpucybersecurityddr5iosmemorymonitorsemiconductorserver