➀ Raspberry Pi introduces the new AI HAT+ with two variants, 13 and 26 TOPS; ➁ The HAT+ is based on Hailo-8 neural network inference accelerators; ➂ The 26 TOPS variant is designed for larger networks and can run multiple networks simultaneously.

➀ Asus shares official die shots of the Core Ultra 9 285K; ➁ Intel's Arrow Lake architecture and 3D Foveros packaging technology; ➂ Detailed breakdown of each tile's layout and functionality

➀ An innovative pilot line for vacuum coating and thermal post-treatment of flexible ultra-thin glass is established at Fraunhofer FEP. The process chain addresses issues from cleaning to in-line sputter coating and thermal post-treatment.➁ The technology aims to enhance the material properties of ultra-thin glass through flash lamp tempering and other methods.➂ Strength testing methods for ultra-thin glass are developed to optimize the material's performance.

➀ Cambridge GaN Devices will demonstrate its ICeGaN products at the IEEE Energy Conversion Congress and Expo in Phoenix. The demos include a 3 kW PFC reference design, a QORVO motor drive evaluation kit, and a slim 100W adapter among others.➁ The company's ICeGaN products are monolithic GaN ICs with power HEMT and support circuitry.➂ The demo also features a comparison of ICeGaN versus discrete GaN circuits.

➀ The research investigates the effects of adding TiC nanoparticles to aluminum alloy 7075, aiming to enhance casting performance and improve fluidity and surface quality; ➁ TiC nanoparticles were introduced in two concentrations, and their impact on fluidity and microstructure was analyzed; ➂ The results showed a significant improvement in fluidity and surface quality, with finer grain sizes and smoother surfaces.

➀ A human player achieves the first 'Rebirth' in NES Tetris; ➁ The player, Michael Khanh, reaches a line count overflow; ➂ The achievement marks a new milestone in Tetris gaming.

➀ Dell is offering the Alienware Aurora R16 gaming desktop with the 14th Gen Core i7 and RTX 4070 Ti Super for $1,399; ➁ The Aurora R16 features a new styling theme with a cleaner aesthetic and generous RGB lighting; ➂ It comes equipped with a Core i7-14700KF processor, GeForce RTX 4070 Ti Super GPU, 16GB DDR5, and a 1TB SSD.

➀ An exploration of the 3D printing filament manufacturing process; ➁ The role of raw plastic pellets and colorants; ➂ The drying, mixing, extrusion, cooling, and winding processes; ➃ The quality control measures and cost-saving strategies of filament production.

➀ The top three wafer fabs, Intel, Samsung, and TSMC, are making key moves to attract more orders for future generations of chip technology and improve performance and reduce delivery times for custom designs; ➁ The three giants are heading in the same direction, adopting 3D transistors and packaging, a series of enabling and scalable technologies, and larger, more diverse ecosystems, but there are significant differences in methodology, architecture, and third-party support; ➂ The expansion of transistors is expected to last at least until the 18/16/14nm range, possibly starting with nanosheet and forksheet FETs and eventually leading to complementary FETs (CFETs).

➀ The Mecpow X4 Pro offers a powerful 22-watt diode laser for engraving and cutting; ➁ It comes with an array of safety features and an integrated webcam; ➂ The device lacks an integrated display and has issues with the acrylic enclosure and software experience.

➀ PI has completed the construction of a new manufacturing building at its Eschbach, Germany site, investing around $22M. ➁ The expansion triples the production capacity of precision motion control and nanopositioning technology products. ➂ The new building aims to meet the demands of customers from the semiconductor, photonics, and life sciences industries.

➀ A Guinness World Record has been set for a stunning drone display, with 8,100 drones participating in the event at the Universiade Stadium in Longgang, Shenzhen, China. The display was designed by the lighting designer behind the recent Paris Olympics. ➁ The company behind the display, Shenzhen HighGreat Innovation Technology Development Company, has been developing drones since 2014 and has a fleet of over 60,000 drones. ➂ The show was even more impressive than the drone display at the 20-18 Winter Olympics in South Korea.

➀ This research explores the potential of two-dimensional silk fibroin films in electronics; ➁ The study investigates the growth mechanisms of silk fibroin films and their interactions with substrates; ➂ The findings highlight silk fibroin's potential as a versatile biomaterial for electronic applications.

➀ An entrepreneur is selling a 3D-printed piggy bank styled like an Nvidia GeForce RTX Founders Edition graphics card. ➁ The piggy bank is a tool to save money for future high-end GPUs. ➂ The savings required for various RTX 40 GPUs are calculated based on daily €2 coin deposits.

➀ The Marana 4.2B-6 back-illuminated sCMOS camera has been significantly enhanced for Physical Sciences and Astronomy applications; ➁ A new Low Noise Mode reduces read noise to 1.0e-; ➂ A new High-Speed mode with 2-lane CoaXPress connection allows for 135 fps operation; ➃ A new Long Exposure Mode suppresses amplifier glow; ➄ A 'Global Clear' mode for Rolling Shutter sensors improves synchronization and minimizes exposure 'dead times'.

➀ Intel's ability to catch up with TSMC in process technology is questioned; ➁ Malcolm Penn, CEO of Future Horizons, suggests it could take 10 years to catch up; ➂ Intel's process capability is about a year behind TSMC; ➃ TSMC has been running its 3nm process for a year, while Intel's best process in volume production is Intel 4 at Leixlip.

➀ Chiplets are small, modular chips that can be combined to form a complete system, offering flexibility and cost-effectiveness. ➁ They optimize technology by using reliable legacy nodes for IO and bus chiplets and cutting-edge technology for compute chiplets. ➂ Chiplets are expected to expand into various applications, including automotive and high-performance computing, due to their modular design and potential to keep pace with Moore’s Law.

➀ Introduction to UCIe 2.0 specification; ➁ Potential to solve technical and business challenges in chiplet integration; ➂ Impact on the future of chiplet technology.