➀ ZOTAC GAMING推出GeForce RTX 50系列显卡，包括改进的AMP Extreme和新的SOLID设计；➁ 新的RTX 5090和5080型号提供不同的时钟速度和功率评级，具有现代设计，以青铜色调为特色；➂ ZOTAC的GeForce RTX 5090 SOLID OC的默认时钟速度为2422 MHz，而非OC变体的2407 MHz。

➀ PNY推出首款基于Blackwell的GeForce RTX 50系列GPU，包括RTX 5080和旗舰RTX 5090；➁ 新款GeForce RTX 5080和RTX 5090将于1月30日发布，RTX 5070和RTX 5070 Ti将于2月发布；➂ 所有四款显卡都将采用NVIDIA的最新AI技术，包括全新的DLSS 4多帧生成技术。

➀ 35ELEMENTS致力于通过开发立方氮化镓半导体材料来帮助实现碳中和；➁ 公司计划在两年内在兼容CMOS的Si(100)衬底上扩大其材料规模，并寻求与代工厂的合作；➂ 35ELEMENTS拥有立方氮化镓材料的独家专利，并计划制造高效的光发射器，如创新型绿色发光二极管。

➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.

➀ 3D design with HBM is critical for advanced semiconductor systems; ➁ Large system designs require multi-chiplet integration; ➂ Multiphysics and ML are essential for optimizing performance and reliability.

➀ The shift in MCU design from simple to complex, requiring more sophisticated interconnects like NoC; ➁ The factors driving this change, including power reduction, safety standards, and support for multiple protocols; ➂ The importance of scalability in design and how NoC architectures can support this.

➀ Chipmetrics is a Finnish company specializing in metrology solutions for high aspect ratio 3D chips; ➁ They provide test chips to accelerate R&D and process control workflows; ➂ The company's PillarHall test chips enable precise measurements of film properties in high aspect ratio cavities.

➀ Synopsys addresses the challenges of multi-die integration with its 3DIO IP Solution and 3DIC tools; ➁ The 3DIO IP Solution includes synthesis-friendly Tx/Rx cells and a high data rate solution; ➂ Synopsys' tools enable faster timing closure and reduced bit error rates in multi-die designs.

➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.

➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.

➀ MZ Technologies is addressing complex challenges in 2.5D and 3D IC design with advanced EDA software, GENIO; ➁ The company has announced a roadmap for GENIO with enhancements for 2025, focusing on thermal and mechanical stress issues; ➂ GENIO is designed to facilitate the design and optimization of complex IC systems.

➀ Samsung has significantly reduced the amount of photoresist (PR) used in the photolithography process for its 3D NAND flash production. ➁ The company plans to use only half the amount of PR in future NAND production. ➂ The move is part of Samsung's effort to enhance its manufacturing efficiency and reduce costs.

➀ The Substrate Vision Summit in Santa Clara is expected to attract a large crowd, focusing on semiconductor substrates and their impact on 3D IC performance. ➁ AI's role in transforming the semiconductor value chain will be discussed, highlighting its impact on scaling, complexity, and high-performance chip demands. ➂ Keynote speakers and panel discussions will explore advancements in semiconductor materials, AI computing, and the role of universities in technology development.

➀ Alchip presents at TSMC OIP Ecosystem Forum; ➁ Challenges in 3D IC design overcome; ➂ Collaboration with Synopsys and TSMC for 3D design innovation

➀ The rise of 2.5D and 3D multi-die designs driven by high-performance computing and AI; ➁ Challenges in architecture and early prototyping, including thermal management and mechanical reliability; ➂ The importance of early verification to prevent costly delays and suboptimal performance; ➃ The role of AI in optimizing design processes and outcomes; ➄ The significance of sign-off tools for ensuring reliability and longevity of multi-die designs.

➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.

➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices

➀ TSMC's 3DBlox framework addresses complexities in 3DIC design; ➁ Innovations in 2024 focus on simplifying 3D design challenges; ➂ TSMC's strategies for managing electrical and physical constraints in 3DIC systems.

➀ Kioxia showcased its BiCS 8 3D NAND technology at FMS 2024, featuring 218 layers and a new CMOS Bonded Array (CBA) process. ➁ The CBA process allows independent parallel processing of CMOS wafer and cell array wafer, improving reliability and performance. ➂ Despite fewer layers compared to competitors, Kioxia's lateral scaling enables competitive bit density and operating speeds.

➀ The panel discussed the challenges of power efficiency in AI and data centers, highlighting the need for 3D hybrid bonding for denser and more power-efficient interconnects. ➁ Intel Foundry emphasized a systems approach to integrating 3D IC products, aiming for CAD agnostic tool flows and System Technology Co-Optimization (STCO). ➂ Qualcomm focused on co-optimization and shift-left strategies, staying EDA vendor-agnostic to tackle multi-physics challenges.