Recent #3D IC news in the semiconductor industry

4 months ago

➀ Heterogeneous integration is a solution that allows different materials and components to work together seamlessly, enhancing system performance.

➁ This approach enables the development of sophisticated electronic devices that are smaller, faster, and more efficient.

➂ Understanding heterogeneous integration involves grasping its key concepts and technologies.

3D ICChipletHPC
5 months ago
➀ A research team from Daegu Gyeongbuk Institute of Science & Technology has developed a new technique to regulate doping during the nucleus phase, enhancing the performance of semiconductor nanocrystals; ➁ The study highlights the influence of the choice of doping element on the process and location; ➂ The technology is expected to have wide applications in advanced electronic devices.
3D ICEDAHPCMicrochipsemiconductor
6 months ago
➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusCXLChipletCoolingDDR4DRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonIntelLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIXeonautomotivecpucybersecurityddr5iosmemorymonitorsemiconductorserver
6 months ago
➀ GMG's THERMAL-XR® coated heat sinks demonstrate the potential for miniaturization and efficiency; ➁ The technology could reduce heat sink size by up to 39% while maintaining equivalent thermal performance; ➂ The application of THERMAL-XR® could improve the efficiency of heat sinks, enabling smaller heat sinks and more compact PCB assemblies.
3D ICChipletGPUGaNHBMsemiconductor
6 months ago
➀ Researchers from City University of Hong Kong have observed a new vortex electric field with potential applications in enhancing future electronic, magnetic, and optical devices; ➁ The research, published in Science, could lead to improved memory stability and computing speed, as well as impact quantum computing, spintronics, and nanotechnology fields; ➂ The team developed an innovative ice-assisted transfer technique to create twisted bilayers with a wide range of twist angles, leading to the discovery of a 2D quasicrystal that may enhance various device capabilities.
3D ICAI ChipEDAGaNHPCMicrochipNanotechnologySoftware
6 months ago
➀ Hynix has started mass production of the world's first 321-layer NAND with 1Tb capacity; ➁ The 321-layer device offers a 12% improvement in write time and a 13% improvement in read time compared to the 238-layer device; ➂ Hynix has adopted the '3 plugs' process technology and a low-stress material for stacking more than 300 layers.
3D ICDRAMNANDmemory
7 months ago
➀ Tanaka claims to have developed the world's first bulk platinum with controlled crystal grain size in the nano scale; ➁ This new technology enables the development of pure platinum with 99.9% or higher purity, offering 10 times the hardness and 4 times the strength of typical platinum materials; ➂ The developed platinum has unique properties due to its high density of small-angle grain boundaries, large-angle grain boundaries, dislocations, and other lattice defects, which may lead to its application in various industries.
3D ICEDAMicrochipsemiconductor
7 months ago
➀ The Raspberry Pi 5 has been successfully used with a Radeon GPU to run modern AAA games like Doom Eternal at 4K resolution; ➁ The performance improvements are thanks to new drivers for AMD Radeon GPUs; ➂ The combination showcases the potential of eGPU setups with Raspberry Pi.
3D ICGPUPC gamingRaspberry Pigaming
7 months ago
➀ Gii, a nanomaterial, is found to be highly detective in broadband photodetectors, potentially leading to faster fiber optic networks, more detailed medical imaging, and better environmental monitoring; ➁ The research suggests Gii can replace multiple materials, reducing costs and improving device designs; ➂ Gii's versatile applications include telecommunications, medical diagnostics, environmental monitoring, and more.
3D ICAIAI ChipMicrochipNVIDIAbroadband
7 months ago
➀ The Ayaneo 3 is announced as the latest flagship device by Ayaneo, featuring the AMD Ryzen AI 9 HX 370 CPU. ➁ The device includes a 7-inch high-refresh LCD or OLED HDR display and additional buttons for user control. ➂ The Ayaneo 3 will compete with other handheld consoles such as the ROG Ally 2 and MSI Claw 8 AI+.
3D ICAMDGPUHandheld GamingOLEDcpugaming
7 months ago
➀ A new 3D imaging technique reveals key details of the magnetic skyrmion, a nanoscale object with potential for new microelectronic devices with high data storage capacity and low power consumption. ➁ Researchers at Lawrence Berkeley National Laboratory have created 3D X-ray images to characterize the spin orientations within skyrmions, which could lead to more efficient quantum computing and data storage devices. ➂ The study demonstrates the importance of understanding the 3D spin texture of skyrmions for the development of advanced spintronic devices.
3D ICDRAMData StorageNVIDIAQuantum Computing
7 months ago
➀ Introducing the Elegoo Neptune 4 Pro 3D printer at an affordable price; ➁ Review highlights fast print speeds and excellent quality; ➂ Special discount available on Elegoo's website
2nm3D IC3D printingAI ChipAMDArmAsusCoolingDellEDAEMIBEUVGDDRGaNHPCInfineonLaptopLinuxMicrochipPCIePrivacyRaspberry PiSoftwareSwitchTIautomotivecybersecuritygamingiosmemorymonitorsemiconductor
7 months ago
➀ Researchers from Queen Mary University of London have developed new nanocomposite films from starch, offering a sustainable alternative to petroleum-based materials; ➁ The films are made from abundant natural polymer starch and highly conductive MXene, with potential applications in electronics and sensing; ➂ The nanocomposites can be tailored for various uses, including wearable technology and healthcare, and are biodegradable.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
7 months ago
➀ The article discusses the use of laser-based alignment for 3D semiconductor chip manufacturing, achieving precision down to fractions of a nanometer. ➁ Traditional methods using microscopes are limited due to the gap between chip layers, whereas the laser-based method overcomes this by using concentric metalenses to project holograms. ➂ The technology could also benefit advanced displacement sensors and startups in the semiconductor field.
3D ICChipletLaser Technologysemiconductor