Recent #3D IC news in the semiconductor industry

8 months ago

➀ Multi Chip Modules (MCM) are emerging as a game-changing solution for faster and more powerful electronics.

➁ Traditional chip designs can no longer meet the growing need for performance and space-saving designs.

➂ MCMs integrate multiple chips into a single package, offering a sophisticated approach to semiconductor architecture.

3D ICChipletsemiconductor
8 months ago

➀ Heterogeneous integration is a solution that allows different materials and components to work together seamlessly, enhancing system performance.

➁ This approach enables the development of sophisticated electronic devices that are smaller, faster, and more efficient.

➂ Understanding heterogeneous integration involves grasping its key concepts and technologies.

3D ICChipletHPC
8 months ago
➀ A research team from Daegu Gyeongbuk Institute of Science & Technology has developed a new technique to regulate doping during the nucleus phase, enhancing the performance of semiconductor nanocrystals; ➁ The study highlights the influence of the choice of doping element on the process and location; ➂ The technology is expected to have wide applications in advanced electronic devices.
3D ICEDAHPCMicrochipsemiconductor
9 months ago
➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusCXLChipletCoolingDDR4DRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonIntelLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIXeonautomotivecpucybersecurityddr5iosmemorymonitorsemiconductorserver
9 months ago
➀ GMG's THERMAL-XR® coated heat sinks demonstrate the potential for miniaturization and efficiency; ➁ The technology could reduce heat sink size by up to 39% while maintaining equivalent thermal performance; ➂ The application of THERMAL-XR® could improve the efficiency of heat sinks, enabling smaller heat sinks and more compact PCB assemblies.
3D ICChipletGPUGaNHBMsemiconductor
9 months ago
➀ Researchers from City University of Hong Kong have observed a new vortex electric field with potential applications in enhancing future electronic, magnetic, and optical devices; ➁ The research, published in Science, could lead to improved memory stability and computing speed, as well as impact quantum computing, spintronics, and nanotechnology fields; ➂ The team developed an innovative ice-assisted transfer technique to create twisted bilayers with a wide range of twist angles, leading to the discovery of a 2D quasicrystal that may enhance various device capabilities.
3D ICAI ChipEDAGaNHPCMicrochipNanotechnologySoftware
10 months ago
➀ Hynix has started mass production of the world's first 321-layer NAND with 1Tb capacity; ➁ The 321-layer device offers a 12% improvement in write time and a 13% improvement in read time compared to the 238-layer device; ➂ Hynix has adopted the '3 plugs' process technology and a low-stress material for stacking more than 300 layers.
3D ICDRAMNANDmemory
6 months ago

➀ Neil Druckmann discussed the evolving role of storytelling in video games with screenwriter Alex Garland, reflecting on the challenges and inspirations around narratives in games.

➁ Games like BioShock and The Last of Us demonstrated the full capability of narrative in gaming, challenging the industry's skepticism.

➂ Druckmann shared his early inspirations for narrative-driven games, including Monkey Island 2 and Half-Life 2.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
6 months ago

➀ Reputable leaker Billbil-Kun reports that Death Stranding 2 pre-orders are expected to start in March, with a release date likely announced at SXSW 2025.

➁ The game will have a Standard Edition at $69.99 and a Collector's Edition at $229.

➂ The leak also confirms that Death Stranding 2 will launch with a physical Standard Edition, priced at $69.99 USD / 69.99 EUR, along with a Collector's Edition planned for North America and Europe, retailing at $229 USD.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
6 months ago

➀ Dr. Prady Gupta is the Founder and Chief Scientist at Infinita Lab and Infinita Materials, focusing on materials testing and specialized chemicals for high-tech industries.

➁ Infinita Lab offers a network of over 2,000 accredited labs for comprehensive materials testing services.

➂ Infinita Materials specializes in custom inorganic chemicals for sectors like semiconductors and batteries.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
6 months ago

➀ This paper discusses the post-silicon validation of the IBM POWER9 processor, highlighting its significance in the context of increasing multi-core processor adoption by hyperscalers.

➁ IBM's Threadmill, a tool for processor verification, has been enhanced since the POWER7, including optimized template allocation and debugging strategies for multi-core write drops.

➂ The validation methodology for POWER9 has significantly improved bug detection rates compared to POWER8, with new techniques like AI prioritization and hardware irritators to induce bugs.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
7 months ago

➀ Traditional RF board design strategies are insufficient for high frequencies and dense layouts;

➁ Keysight and Modelithics collaborate on an advanced RF board simulation workflow;

➂ The use of 3D passive component models enhances simulation accuracy and reduces the risk of board re-spins.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
7 months ago

➀ Anduril Industries, led by Palmer Luckey, is set to take over the US Army's Integrated Visual Augmentation System (IVAS) program, pending Department of Defense approval.

➁ The program includes advanced headgear with AR capabilities, and Anduril will manage production and development with Microsoft Azure as the preferred cloud provider.

➂ Palmer Luckey, the founder of Oculus VR and Anduril Industries, sees this as a deeply personal achievement, emphasizing the potential of the technology to save lives.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware