Recent #2nm news in the semiconductor industry

9 months ago

➀ Traditional RF board design strategies are insufficient for high frequencies and dense layouts;

➁ Keysight and Modelithics collaborate on an advanced RF board simulation workflow;

➂ The use of 3D passive component models enhances simulation accuracy and reduces the risk of board re-spins.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
9 months ago

➀ The GeForce RTX 5060's launch has been pushed back to April 2025 due to 'chip supply constraints';

➁ The delay affects the RTX 5070, RTX 5080, and RTX 5090, with limited supply expected leading to instant sellouts;

➂ The AI boom is increasing semiconductor demand, impacting the availability of the new GeForce RTX 50 Series.

2nm3nmAIAI PCAI chipAMDASUSArmChipletDellEDAGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
9 months ago

➀ Anduril Industries, led by Palmer Luckey, is set to take over the US Army's Integrated Visual Augmentation System (IVAS) program, pending Department of Defense approval.

➁ The program includes advanced headgear with AR capabilities, and Anduril will manage production and development with Microsoft Azure as the preferred cloud provider.

➂ Palmer Luckey, the founder of Oculus VR and Anduril Industries, sees this as a deeply personal achievement, emphasizing the potential of the technology to save lives.

2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
9 months ago

➀ Intel's upcoming Nova Lake CPUs have been spotted in shipping manifests, indicating progress on their next-gen consumer platform.

➁ The next CPU architecture from Intel will be Panther Lake, showcased at CES 2025, and will be the company's first consumer platform on its new Intel 18A process node.

➂ Intel's next-gen Nova Lake CPUs are expected to be fabricated on Intel 14A or TSMC 2nm, and will not feature on-package memory.

2nmCPUIntelNova LakePanther LakeTSMC
10 months ago
➀ 35ELEMENTS致力于通过开发立方氮化镓半导体材料来帮助实现碳中和;➁ 公司计划在两年内在兼容CMOS的Si(100)衬底上扩大其材料规模,并寻求与代工厂的合作;➂ 35ELEMENTS拥有立方氮化镓材料的独家专利,并计划制造高效的光发射器,如创新型绿色发光二极管。
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
10 months ago
➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
11 months ago
➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusCXLChipletCoolingDDR4DRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonIntelLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIXeonautomotivecpucybersecurityddr5iosmemorymonitorsemiconductorserver
11 months ago
➀ Fujitsu unveils its Monaka processor, a 144-core Armv9-based chip designed for future data centers; ➁ The chip is built on TSMC's N2 process and features a CoWoS system-in-package with SRAM tiles and hybrid copper bonding; ➂ Fujitsu aims for superior energy efficiency by 2026-2027, using air cooling.
2nm3D-stacking5nmAMD EPYCArmCPUChipletsData centerEnergy efficiencyFujitsuIntel XeonMonaka
11 months ago
➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
11 months ago
➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
2nm3D IC3nmAIAI PCAI chipAMDASUSArmCPUChipletDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLinuxNPUNVIDIAPCIePrivacyRaspberry PiSEMICONDUCTORSK hynixSSDSwitchTIautomotivecoolingcybersecuritygamingiOSlaptopmemorymicrochipmonitorsoftware
12 months ago
➀ TSMC will start producing 2nm GAA-based wafers in Q4 2025 at Fab 20 in Hsinchu; ➁ The production will be followed by Fab 22 in Kaohsiung in Q1 2026; ➂ N2P production will start in late 2026 without backside power delivery; ➃ N2 and N2P will use TSMC's NanoFlex technology; ➄ N2 is 15% denser than N3E and improves performance by 10% to 15%; ➅ N2E will be followed by N2P and N2X in 2026; ➆ TSMC's planned capacity for 2nm is more than for 3nm; ➇ 2nm wafers are expected to cost $30k+.
2nmGAAPower ConsumptionProcess technologyProductionTSMCperformancesemiconductor
12 months ago
➀ Introducing the Elegoo Neptune 4 Pro 3D printer at an affordable price; ➁ Review highlights fast print speeds and excellent quality; ➂ Special discount available on Elegoo's website
2nm3D IC3D printingAI ChipAMDArmAsusCoolingDellEDAEMIBEUVGDDRGaNHPCInfineonLaptopLinuxMicrochipPCIePrivacyRaspberry PiSoftwareSwitchTIautomotivecybersecuritygamingiosmemorymonitorsemiconductor
about 1 year ago
➀ Researchers from Queen Mary University of London have developed new nanocomposite films from starch, offering a sustainable alternative to petroleum-based materials; ➁ The films are made from abundant natural polymer starch and highly conductive MXene, with potential applications in electronics and sensing; ➂ The nanocomposites can be tailored for various uses, including wearable technology and healthcare, and are biodegradable.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor