➀ Alchip has taped out a 2nm test chip; ➁ The company expects results by the first quarter of next year; ➂ Alchip is working with customers on high-performance 2nm ASIC development.

➀ Rapidus is planning to build a second factory for 1.4nm process wafers; ➁ The first factory is being constructed in Chitose City, Hokkaido; ➂ The goal is to mass-produce 2nm wafers in 2027.

➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.

➀ Raspberry Pi introduces the new AI HAT+ with two variants, 13 and 26 TOPS; ➁ The HAT+ is based on Hailo-8 neural network inference accelerators; ➂ The 26 TOPS variant is designed for larger networks and can run multiple networks simultaneously.

➀ Google's next-gen Tensor G6 processor, codenamed 'Malibu', will be built on TSMC's 2nm process node; ➁ The Tensor G6 is expected to power the upcoming Pixel 11 smartphone series; ➂ The new processor promises major performance and power improvements.

➀ Analog Bits showcased its on-die sensing IP and power management solutions at TSMC OIP; ➁ The company highlighted its progress in 3nm and 2nm technology nodes; ➂ Collaborations with Arm were discussed, focusing on power management and clocking IPs.

➀ Samsung Foundry faces challenges as it delays EUV orders; ➁ The low yields of Samsung's 3nm and 2nm processes may have led to cancelled orders; ➂ Samsung's pushback on equipment deliveries may impact its leading-edge foundry capability.

➀ Imec spin-off Brailsports is developing a platform for optimizing athlete training volumes and schedules based on data analysis; ➁ The platform uses AI models to estimate individual athlete fitness and fatigue, improving performance and reducing injury risk; ➂ The platform is currently operational at cycling team Lotto Dstny, with positive results.

➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices

➀ Electron Beam Probing (EBP) has become a powerful method for security analyzing of sub-7nm ICs. ➁ It offers better spatial resolution than optical probing and is suitable for sub-7nm flip-chips and advanced 3D architectures. ➂ The research focuses on the importance of EBP in failure analysis and hardware assurance.

➀ The research investigates the effects of adding TiC nanoparticles to aluminum alloy 7075, aiming to enhance casting performance and improve fluidity and surface quality; ➁ TiC nanoparticles were introduced in two concentrations, and their impact on fluidity and microstructure was analyzed; ➂ The results showed a significant improvement in fluidity and surface quality, with finer grain sizes and smoother surfaces.

➀ Rapidus, the Japanese startup aiming for 2nm manufacturing capability, faces a $7 billion funding gap. Three Japanese banks are investing $35 million each, with the Development Bank of Japan adding $70 million. ➁ Rapidus originally estimated a $14 billion cost for its 2nm pilot line and $7 billion for volume production. Now, the company forecasts another $7 billion is needed to establish the pilot line, with the total estimated at $35 billion. ➂ Rapidus is seeking additional investment from corporate backers and government support for its expansion plans.

1. Applied Materials introduces a new deposition tool that allows copper wires to be used in 2nm and more advanced process technologies. 2. The tool uses a binary RuCo liner to improve surface properties for copper reflow, reducing resistance by 25%. 3. The company also introduces an upgraded Black Diamond Low-K film to further reduce dielectric constant and increase mechanical strength for 3D stacking.

1. Samsung has unveiled its updated roadmap at the Samsung Foundry Forum U.S., detailing the evolution of its 2nm-class nodes through 2027. 2. The roadmap includes the introduction of BSPDN technology and the development of a 1.4nm-class node by 2027. 3. Samsung also rebranded its SF3P node to SF2, aiming at high-performance devices with improved PPA benefits.

As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that it remains on track to meeting its goal of starting mass production of chips on its SF3 (3 nm-class, 2nd Generation) technology in the second half of the year. Meanwhile in June, Samsung Foundry will formally unveil its SF2 (2 nm-class) process technology, which will offer a mix of performance and efficiency enhancements. Finally, the company the company is preparing a variation of its 4 nm-class technology for integration into stacked 3D designs. SF2 To Be Unveiled In June Samsung plans to disclose key details about its SF2 fabrication technology at the VLSI Symposium 2024 on June 19. This will be the company's second major process node based upon gate-all-around (GAA) multi-bridge channel field-effect transistors (MBCFET). Improving over its predecessor, SF2 will feature a 'unique epitaxial and integration process,' which will give the process node higher performance and lower leakage than traditional FinFET-based nodes (though Samsung isn't disclosing the specific node they're comparing it to). Samsung says that SF2 increases performance of narrow transistors by 29% for N-type and 46% for P-type, and wide transistors by 11% and 23% respectively. Moreover, it reduces transistor global variation by 26% compared to FinFET technology, and cuts product leakage by approximately 50%. This process also sets the stage for future advancements in technology through enhanced design technology co-optimization (DTCO) collaboration with its customers. One thing that Samsung has not mentioned in context of SF2 is backside power delivery, so at least for the moment, there is no indication that Samsung will be adopting this next-gen power routing feature for SF2. Samsung says that the design infrastructure for SF2 – the PDK, EDA tools, and licensed IP – will be finalized in the second quarter of 2024. Once this happe