➀ Imec's CMOS 2.0 leverages wafer-to-wafer hybrid bonding (250nm pitch) and backside power delivery networks (BSPDNs) to enable heterogeneous stacking of logic/memory tiers;

➁ Backside connectivity with 120nm-pitch TDVs and extreme wafer thinning optimizes power distribution, reducing IR drops by 122mV in 2nm mobile SoCs;

➂ System-technology co-optimization (STCO) allows specialized functional layers, offering 22% area savings while boosting performance density beyond traditional Moore’s Law scaling.