➀ YEST announced that it will supply 11.16 billion won worth of eFurnace to SK Hynix; ➁ The eFurnace is used for purifying wafers and enhancing their electrical properties; ➂ SK Hynix is expected to use the equipment in HBM production.

➀ SK Hynix is scheduled to provide samples of its Gen 5 HBM, HBM3E 16H, in early 2025; ➁ The HBM3E 16H features 16 stacked DRAM dies and will utilize mass reflow molding technology; ➂ SK Hynix CEO Kwak Noh-jung announced this at an event hosted by SK Group.

➀ Samsung Electronics reported a better-than-expected profit in its third-quarter earnings, despite a significant decline in profits. ➁ The company highlighted its advancement in high-bandwidth memory (HBM) supply. ➂ Samsung hinted at a potential partnership with TSMC, indicating a strategic move in the semiconductor industry.

➀ Samsung's chip division experienced a 40% profit decline in Q3 2024; ➁ Despite this, sales reached a record high; ➂ Concerns over HBM progress and yield issues on advanced nodes were highlighted.

➀ SK hynix posts record-high Q3 2024 profit; ➁ Sales of AI memory, HBM, and eSSDs see 'explosive' demand; ➂ SK hynix solidifies its position as the world's No.1 AI memory technology provider.

➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.

➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices

➀ SK Hynix has placed a significant order for thermal compression bonders from ASMPT; ➁ The equipment is for the production of HBM3E 12H, SK Hynix's newest high-bandwidth memory; ➂ The order includes over 30 units of the equipment.

➀ Rambus details its new HBM4 memory controller with speeds up to 10Gb/s and bandwidth of 2.56TB/sec; ➁ HBM4 offers 33% faster bandwidth than HBM3E and twice the speed of HBM3; ➂ SK hynix and Samsung are expected to mass produce HBM4 memory by the end of 2025.

➀ Samsung is expected to tape-out its next-generation HBM4 memory in Q4 2024. ➁ Mass production of HBM4 is scheduled for Q4 2025, targeting NVIDIA's next-gen Rubin R100 AI GPU. ➂ The AI industry's demand is driving the growth of HBM memory, with SK hynix and Samsung investing heavily in production capabilities.

➀ South Korea's memory chip exports to Taiwan surged 225% in the first half of 2025. ➁ The surge is due to the high demand for HBM memory in AI GPUs. ➂ Taiwan became the third-largest importer of South Korean memory chips, surpassing Vietnam and the United States.

1. SK Hynix achieved its highest operating profit in six years during the second quarter of 2023. 2. The company reported revenue of 16.42 trillion won and operating profit of 5.46 trillion won. 3. Net income for the quarter was 4.12 trillion won.

1. Genesem, a semiconductor packaging firm, has provided next-generation hybrid bonding equipment to SK Hynix. 2. The equipment is intended for use in the production of high-bandwidth memory (HBM). 3. Two units of the equipment have been installed at SK Hynix’s pilot fab for testing purposes.

1. Micron announced that its High Bandwidth Memory (HBM) production capacity is fully booked until 2025. 2. This follows SK Hynix's earlier statement that its HBM capacity is sold out until next year. 3. Micron reported a revenue of $6.811 billion for the fiscal quarter from March to May, marking an increase.

1. SK hynix is accelerating the development of HBM4 and HBM4E memory, originally planned for mass production in 2026 and 2027 respectively. 2. Now, HBM4 is set for mass production in 2025, and HBM4E will enter mass production in 2026, aligning with NVIDIA's accelerated AI accelerator release cycle. 3. The next-generation HBM4 offers a 40% increase in bandwidth and a 70% reduction in power consumption compared to HBM3E, which is the fastest memory in the world.

1. Micron Technology is building new test production lines for advanced HBM in the US; 2. The company is also considering HBM manufacturing in Malaysia for the first time; 3. Micron aims to triple its market share for HBM by 2025, targeting a 'mid-20' percentage range.

1. Samsung has emphasized the necessity of hybrid bonding for the production of a 16-stack High Bandwidth Memory (HBM) in a recent paper. 2. The paper was presented at the 2024 IEEE 74th Electronic Components and Technology Conference in Colorado, discussing D2W (die to wafer) copper bonding.

SK Hynix is planning to start mass production of HBM4E in 2026, a company research said.The South Korean memory maker originally planned to start mass production of the Gen 7 high-bandwidth memory (HBM) in 2027.But SK Hynix team leader and researcher Kwi Wook Kim said during International Memory Wee

Samsung is taking a two-track approach to its development of high-bandwidth memory (HBM).The company’s newly formed HBM development team, which was turned into a permanent office from a task force in March, is focusing on the development of HBM4, sources said. HBM4 is the sixth-generation iteration

SK Hynix expects to hit an accumulated revenue of mid-US$10 billion in high-bandwidth memory (HBM) sales by the end of 2024.The memory maker has already sold out its HBM capacity for the year as well as those for 2025, SK Hynix CEO Kwak Noh-jung said during a press conference on Thursday at the comp