➀ Memory growth is expected to exceed 24% due to the increasing adoption of high-end products like HBM3 and HBM3e, with HBM4 introduction in H2 2025. Non-memory is projected to grow 13% driven by advanced node ICs for AI servers, high-end mobile phone ICs, and WiFi7. ➁ The Asia-Pacific IC design market is set to grow 15% as inventory levels stabilize, personal device demand rises, and AI computing expands. ➂ TSMC's market share is projected to increase in Foundry 1.0 and 2.0, with the expansion of advanced nodes like 2nm and 3nm. ➃ 2nm and 3nm production is expected to accelerate, with TSMC and Samsung leading the way. ➄ Foundry capacity utilization is expected to increase, and 2025 is critical for 2nm mass production. ➅ China's packaging and testing market share is set to rise, and FOPLP will grow rapidly post-2025.
Recent #memory news in the semiconductor industry
➀ Nvidia's RTX 5080 rumored to feature 30 Gbps GDDR7 memory for 960 GB/s bandwidth; ➁ Remaining Blackwell lineup to use slower 28 Gbps modules; ➂ Nvidia's RTX 50 series expected to be first with GDDR7 memory
➀ During the first 10 months of 1960, US manufacturers averaged 10 million transistors sold per month, totaling nearly £9 million in value. This represented a 33% increase from the monthly average of 7.5 million units in 1959. ➁ The story from Electronics Weekly's January 25, 1961, issue mentioned that US manufacturers sold nearly 102 million transistors between January and October 1960, with an October total of 12.2 million units. ➂ The value of US factory transistor sales in the first 10 months of 1960 was £88 million, with a projection for the full year to reach around £100 million.
➀ Imec proposes a 3D integrated CCD with IGZO channel for CXL buffer memory; ➁ The memory operates on a planar proof-of-concept structure with a storage capacity of 142 bits; ➂ Imec expects the 3D CCD memory density to scale beyond DRAM limits, with potential for five times more bit density than 2D DRAM by 2030.
➀ Bachmann's third-generation MX200 processor series is set to launch in the first half of 2025; ➁ The new MX215 processor module features more Ethernet and CAN interfaces than the MX214 CPU; ➂ The next-generation MX series is based on VxWorks 7 with secure storage capabilities for keys and passwords.
➀ CEA-Leti has demonstrated a scalable hafnia-zirconia-based FeRAM platform integrated into the 22 nm FD-SOI node's BEOL. This is a significant advance in ferroelectric memory technology, improving scalability for embedded applications and positioning FeRAM as a competitive memory solution for advanced nodes. ➁ Current embedded FeRAM products use perovskite materials that are not CMOS compatible and cannot scale beyond 130 nm. The new HfO2-based thin films are CMOS compatible and scalable, offering new possibilities for embedded FeRAM. ➂ The technology is expected to enable faster, more energy-efficient, and cost-effective memory solutions in embedded systems like IoT, mobile devices, and edge computing.
➀ SEMI forecasts semiconductor manufacturing equipment sales to grow 6.5% year-on-year to $113 billion in 2024, with projections of $121 billion for 2025 and $139 billion for 2026. ➁ The wafer fab equipment (WFE) segment is expected to grow 5.4% to $101 billion in 2024, driven by DRAM, HBM, and China. ➂ Back-end equipment sales are projected to surge, with test equipment sales increasing 14.7% in 2025 and 18.6% in 2026.
➀ Scientists and engineers from UKAEA and the University of Bristol have created the world's first carbon-14 diamond battery; ➁ The battery leverages the radioactive isotope carbon-14 to produce a diamond battery with a potential lifespan of thousands of years; ➂ The technology could be used in medical devices and extreme environments, providing continuous power for decades.
➀ Team Group's T-Force brand has launched a new high-performance memory kit, the Xtreem CKD DDR5 8800 (2x 24 GB); ➁ The memory module features Client Clock Driver (CKD) technology for enhanced DDR5 speeds and overclocking potential; ➂ The design includes a 2mm-thick aluminium alloy heat spreader and 10-layer PCB for efficient heat dissipation and stability.
➀ X-FAB is supplying 32kByte capacity SONOS embedded Flash IP on its 110nm BCD-on-SOI platform; ➁ The IP includes an additional 4kbit EEPROM; ➂ The solution is designed for automotive, medical, and industrial applications.
1. HBM demand is skyrocketing, projected to grow from $4B in 2023 to over $25B by 2025; 2. Micron's FY2024 revenue rose 62% YoY, driven by AI demand; 3. Reduced industry capacity and AI demand are stabilizing the cyclical market.
➀ ATEK Access Technologies has developed the Mini-Bar, a memory token and receptacle system designed for handheld applications, which is 60% smaller than the equivalent Bar receptacle models. The MBRHN model measures 16.3mm x 14.7mm x 13.6mm and the MBRFN model is slightly smaller. The Mini-Bar tokens are larger than microSD cards but thicker and stronger. They use serial EEPROM and are available in 16kb or 256kb capacities. ➁ Next year, ATEK will introduce Mini-Bar tokens using Microchip's secure memory ICs. ➂ The Mini-Bar system aims to balance size reduction with ease of handling credentials in cryptographic products and embedded systems.
➀ Lexar ARES RGB 6400MT/s DDR5 memory kit is on sale for £98.99 until December 2nd; ➁ Lexar THOR RGB 6000MT/s DDR5 memory kit is available for £86.99; ➂ Lexar PCIe 4.0 M.2 SSDs are up to 19% off, with the Lexar NQ790 4TB at £205 and the Lexar NM790 offering speeds up to 7400MB/s read/write.
➀ In this interview, Paul Plitzuweit from Datakey discusses the portable memory system formed by Datakey Mini-Bar receptacles and memory tokens; ➁ The system is designed for small embedded systems requiring a robust credential or removable memory device for harsh environments; ➂ It aims to minimize front panel space and internal volume, targeting applications such as Crypto Ignition Key (CIK).
➀ JEDEC has published JESD230G, a new NAND Flash Interface Interoperability Standard; ➁ The standard supports speeds up to 4,800 MT/s, a significant increase from the previous version; ➂ JESD230G introduces a separate Command/Address Bus Protocol (SCA) for improved efficiency.
➀ Lexar's ARES RGB DDR5 memory range is designed for gamers and PC enthusiasts with speeds up to 7200MT/s. The reviewed kit is a 32GB DDR5-6400 kit with SK hynix A-die ICs and XMP 3.0/EXPO support. ➁ The memory features RGB lighting and an aluminum heat spreader for cooling. ➂ The review covers performance testing on both Intel and AMD platforms, including benchmarks, compute and productivity tests, and gaming performance.
➀ The WSTS reported a $166 billion semiconductor market revenue in Q3 2024, with the highest growth rate since 2021. Nvidia led the market with AI GPU strength. ➁ SK Hynix, Micron, and Kioxia reported double-digit revenue growth, while Renesas Electronics saw a decline. ➂ The outlook for Q4 2024 and 2025 is mixed, with AI driving growth but concerns over automotive market and memory market impact.
➀ The DDR5 era has arrived with the launch of Intel Core Ultra 200 series and AMD Ryzen 9000 series, which only support DDR5 and not DDR4;
➁ Misconceptions about DDR5, such as high latency and low upgrade value, have been resolved, highlighting DDR5's advantages;
➂ Crucial DDR5 Pro OC 6400 utilizes Micron's 1zz process technology and supports both Intel XMP and AMD EXPO standards for better compatibility;
➃ The DDR5 Pro OC can improve game frame rates with a speed of 6400 MT/s, suitable for both gamers and creators involved in data-intensive tasks;
➄ The DDR5 Pro OC 6400 offers 16GB modules with aluminum heat sinks in black or white origami-style designs, enhancing the feel;
➅ Compared to DDR4 3200 MT/s, the DDR5 Pro OC 6400 doubles data transfer capabilities and has a lower real-world latency due to its higher frequency;
➆ The performance of the DDR5 Pro OC 6400 is partly limited by the Ryzen 5 7600 CPU, but it still shows great potential for future upgrades;
➇ DDR5 is becoming a necessity in 2024, and it's time to embrace the new era of DDR5!
➀ Hynix is set to sample HBM3e 16hi memory in the first half of 2025; ➁ Lightsynq Technologies emerges with $18 million in Series A funding for diamond optical interconnects in quantum computing; ➂ DigiKey is optimistic about the future of the electronics market; ➃ Texas Instruments aims to increase in-house manufacturing to 95% by 2030.
➀ Hynix has started mass production of the world's first 321-layer NAND with 1Tb capacity; ➁ The 321-layer device offers a 12% improvement in write time and a 13% improvement in read time compared to the 238-layer device; ➂ Hynix has adopted the '3 plugs' process technology and a low-stress material for stacking more than 300 layers.