Recent #memory news in the semiconductor industry

7 months ago

➀ The Johannes Gutenberg University Mainz (JGU) and Antaios have made a breakthrough in storage technology with SOT-MRAM;

➁ The technology offers an efficient and powerful solution for data processing and storage, potentially replacing cache memory in computer architecture;

➂ The innovation reduces energy consumption by over 50% compared to existing storage technologies, improving efficiency by 30%, and reducing the input current by 20%.

University Researchenergy efficiencyinnovationmemoryresearchsemiconductor
7 months ago
➀ The TeamGroup T-Force XTREEM DDR5 memory kit is reviewed, focusing on its high-speed capabilities and performance. The kit, rated at 7600 MT/s, is priced at £175 and comes with a lifetime warranty. It uses SK Hynix A-die ICs and supports XMP 3.0 profiles. ➁ The review covers testing on both Intel and AMD platforms, including benchmarks and real-world usage scenarios. ➂ The summary highlights the kit's performance in gaming, encoding, and productivity tasks.
ddr5memoryperformance
8 months ago
➀ Imec spin-out Vertical Compute raises €20m to develop a new vertical integrated memory and compute technology; ➁ The company aims to address the memory wall challenge for AI by minimizing data movement and bringing large data closer to computation; ➂ Vertical Compute's chiplet technology could save up to 80% energy, unlock hyper-personalized AI solutions, and protect user privacy.
AIChipletEdge ComputingPrivacymemorysemiconductor
8 months ago
➀ Patriot Memory celebrates its 40th anniversary with the launch of the Viper Xtreme 5 DDR5-9600 CKD memory and iLuxe Stick C for Apple devices; ➁ The anniversary edition features a blue heatsink with '40 Years' label and RGB lighting; ➂ The iLuxe Stick C offers up to 2TB storage for iPhone and iPad, serving as a convenient media backup solution.
AnniversaryCESPC ComponentsRAMddr5memory
8 months ago
➀ The article discusses the current state of server technology in 2025, including CPU core counts, networking speeds, SSD and HDD capacities, server memory, and AI-specific GPUs. It mentions the latest offerings from AMD, Intel, NVIDIA, Broadcom, and others. ➁ It highlights the trends in server technology, such as the increasing number of CPU cores, the rise of 400Gbps networking, and the growth in SSD capacities. ➂ The article also touches on the future of server technology, including the expected advancements in CPU performance, networking, and storage.
AIAMDBroadcomGPUHDDIntelKioxiaMarvellMicronNVIDIANetworkingSSDcpumemoryserver
9 months ago
➀ Researchers at the Advanced Institute for Materials Research (WPI-AIMR) have developed a cobalt-manganese-iron alloy thin film with high perpendicular magnetic anisotropy (PMA), crucial for MRAM devices; ➁ This alloy demonstrates a strong large PMA for the first time, addressing the challenges of current alloys; ➂ The research contributes to the development of innovative spintronics-based memory technologies for a sustainable future.
memory
9 months ago

➀ SRAM has been used in high-performance computing architectures as embedded cache for decades, but its bit density expansion has slowed down and is affected by standby power issues.

➁ Spin Orbit Torque (SOT) MRAM offers advantages like low standby power, GHz-level switching speed, negligible leakage, almost infinite endurance, high reliability, and scalability, making it a promising alternative to SRAM.

➂ SOT-MRAM uses magnetic tunnel junctions (MTJ) as its basic building block, where the magnetic orientation can be vertical or in-plane, affecting the read and write operations.

➃ Recent advancements in SOT-MRAM technology, including improvements by imec, have demonstrated high switching speeds and durability, addressing key challenges in cache applications.

➄ Imec has developed innovative solutions for field-free switching, low dynamic power consumption, and scaling SOT-MRAM devices to the limit, making it a milestone for high-density SRAM applications.

➅ Further optimization of performance and reliability parameters, such as retention rate and write error rate, is being explored to bring SOT-MRAM closer to real-world specifications.

➆ Imec has also presented a novel composite free layer for MTJ, which improves the reliability of SOT-MRAM devices and reduces sensitivity to external magnetic disturbances.

ImecSRAMmemory
9 months ago

➀ SRAM has been used in high-performance computing architectures as embedded cache for decades, but its bit density expansion has slowed down and is affected by standby power issues.

➁ Spin Orbit Torque (SOT) MRAM offers advantages like low standby power, GHz-level switching speed, negligible leakage, almost infinite endurance, high reliability, and scalability, making it a promising alternative to SRAM.

➂ SOT-MRAM uses magnetic tunnel junctions (MTJ) as its basic building block, where the magnetic orientation can be vertical or in-plane, affecting the read and write operations.

➃ Recent advancements in SOT-MRAM technology, including improvements by imec, have demonstrated high switching speeds and durability, addressing key challenges in cache applications.

➄ Imec has developed innovative solutions for field-free switching, low dynamic power consumption, and scaling SOT-MRAM devices to the limit, making it a milestone for high-density SRAM applications.

➅ Further optimization of performance and reliability parameters, such as retention rate and write error rate, is being explored to bring SOT-MRAM closer to real-world specifications.

➆ Imec has also presented a novel composite free layer for MTJ, which improves the reliability of SOT-MRAM devices and reduces sensitivity to external magnetic disturbances.

ImecSRAMmemory
9 months ago
➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.
2nm3D IC3nmAIAI ChipAI PCAMDArmAsusCXLChipletCoolingDDR4DRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonIntelLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIXeonautomotivecpucybersecurityddr5iosmemorymonitorsemiconductorserver
9 months ago
➀ Memory growth is expected to exceed 24% due to the increasing adoption of high-end products like HBM3 and HBM3e, with HBM4 introduction in H2 2025. Non-memory is projected to grow 13% driven by advanced node ICs for AI servers, high-end mobile phone ICs, and WiFi7. ➁ The Asia-Pacific IC design market is set to grow 15% as inventory levels stabilize, personal device demand rises, and AI computing expands. ➂ TSMC's market share is projected to increase in Foundry 1.0 and 2.0, with the expansion of advanced nodes like 2nm and 3nm. ➃ 2nm and 3nm production is expected to accelerate, with TSMC and Samsung leading the way. ➄ Foundry capacity utilization is expected to increase, and 2025 is critical for 2nm mass production. ➅ China's packaging and testing market share is set to rise, and FOPLP will grow rapidly post-2025.
CoWoSFOPLPIC DesignIDCIntelSamsungTSMCfoundrymemorysemiconductor