➀ This article provides an overview of the NVIDIA GH200, a high-performance computing platform; ➁ Discusses the key features and innovations of the GH200, such as its LPDDR5X memory and NVLink-C2C interface; ➂ Explains the different configurations available for the GH200, including memory size, bandwidth, and GPU options.

➀ Jiangbolong showcased its self-developed 28nm eMMC master control chip with a unique QLC algorithm, offering up to 512GB storage capacity and technical capability for 1TB. ➁ The company also displayed its 28nm SLC NAND flash memory, featuring a 166MHz operating frequency and innovative circuit design to reduce noise interference. ➂ Jiangbolong's LPCAMM2 memory for AI applications supports LPDDR5/5x颗粒 and has been adopted by AI PC manufacturers like Lenovo.

➀ The spot price for consumer memory fell by 30% in Q2, creating a dislocation with contract prices. ➁ Module makers experienced a 40% year-over-year decline in consumer NAND shipments through retail channels, suggesting weak demand. ➂ Next year, DRAM prices are expected to rise gradually each quarter, driven by the increasing adoption of HBM3e.

➀ SK Hynix introduced its in-memory computing advancements for LLM inference with AiMX-xPU and LPDDR-AiM, focusing on enhanced power efficiency and speed. ➁ The company showcased a GDDR6 Accelerator-in-Memory card utilizing Xilinx Virtex FPGAs and GDDR6 AiM package. ➂ SK Hynix aims to scale memory capacity from 32GB to 256GB per card and explore on-device AI applications.

➀ Apple is reportedly testing base-level Mac computers with at least 16GB of RAM. ➁ All new Macs are M4 Apple Silicon models, with even the lowest-end base model featuring 16GB of RAM. ➂ Apple is preparing a smaller Mac Mini, new MacBook Pro, and iMacs built around M4 chips for release later this year.

➀ All KIOXIA flash memory products are manufactured in Japan, leveraging the reputation for high-quality Japanese-made goods. ➁ KIOXIA, formerly Toshiba, invented flash memory, giving them a deep understanding of its technology and internal structure. ➂ KIOXIA focuses on educating users about their brand and flash memory technology to enhance brand recognition.

➀ CUDIMM, or Clocked Unbuffered DIMM, is designed to improve signal integrity in high-frequency DDR5 memory modules by introducing a Clock Driver (CKD). ➁ The CKD splits the clock domain into DCK (connected to the CPU) and QCK (connected to devices), similar to the RCD in RDIMM but simplified. ➂ For laptop memory modules (SODIMM), a similar approach is taken with CSODIMM, which also incorporates a CKD for enhanced clock signal management. ➃ JEDEC recommends CUDIMM for UDIMM modules above PC5-6400, and CKD solutions are available from various manufacturers, including Lanqi in China.

➀ Q2 IC sales increased by 27% YoY and are expected to grow by 29% in Q3 2024. ➁ Q2 installed fab capacity reached 40.5 million wafers per quarter, projected to rise by 1.6% in Q3. ➂ Memory capacity increased by 0.7% in Q2 and is forecast to grow by 1.1% in Q3, supported by demand for HBM and improving memory pricing.

➀ During sleep, the brain resets memory by silencing specific neurons in the hippocampus, particularly in the CA2 region. ➁ This process is crucial for memory consolidation and allows for continuous learning without overloading. ➂ The mechanism could be targeted to enhance memory or potentially erase traumatic memories.

1. G.Skill has introduced DDR5-6400 memory kits with a CAS latency of 30, offering faster performance compared to standard DDR5-4800 modules. 2. These kits are designed for both Intel and AMD systems, supporting XMP and EXPO profiles respectively. 3. The modules are expected to be particularly beneficial for AMD's Ryzen 7000 and 9000 series CPUs, aligning with their memory speed limits.

1. G.Skill introduces ultra-low latency DDR5-6000 memory designed for AMD Ryzen AM5 builds. 2. The memory features EXPO support, offering optimized settings for overclocked performance. 3. Available in various capacities with CAS latency of 28, aiming to enhance performance on compatible AMD platforms.

1. The article discusses a humorous comic t-shirt depicting the evolution of storage devices. 2. It highlights the missing elements like the big floppy and tape reels. 3. The piece also includes comments from a tweet, emphasizing the concept of 'the cloud' as someone else's computer.

1. G.Skill introduces the Trident Z5 Royal Neo memory kit, featuring 32GB of DDR5-8000 memory for AMD platforms. 2. The kit operates in 1:2 clock divider mode and supports AMD EXPO. 3. The new AGESA update enables DDR5-8000 profiles and real-time memory overclocking on current AM5 chipsets.

1. JEDEC has released JESD405-1B, a standard for CXL memory module labels, detailing information like memory type, protocol revision, and capacity. 2. The standard supports SNIA EDSFF form factors E1.S and E3.S, and includes connector and I/O configuration details. 3. JESD405-1B, along with JESD317A, aims to support and expand the CXL market by ensuring multiple sourcing options for CMMs.

1. AMD's upcoming Ryzen 9000 series with Zen 5 architecture will support DDR5 memory, focusing on performance and compatibility. 2. The article discusses the importance of memory type, capacity, transfer rate, and CAS latency when selecting DDR5 RAM. 3. Recommendations for DDR5 memory kits suitable for the Ryzen 9000 processors are provided, ranging from affordable to high-performance options.