➀ The research investigates the effects of adding TiC nanoparticles to aluminum alloy 7075, aiming to enhance casting performance and improve fluidity and surface quality; ➁ TiC nanoparticles were introduced in two concentrations, and their impact on fluidity and microstructure was analyzed; ➂ The results showed a significant improvement in fluidity and surface quality, with finer grain sizes and smoother surfaces.

➀ Kioxia, the third-largest manufacturer of NAND flash, has seen its valuation drop from $30 billion to $5 billion over the past seven years. Initial bids for Toshiba's memory business reached $30 billion, but the current market value is significantly lower. ➁ Toshiba's memory unit was previously owned by a Bain-led consortium that included Hynix, Apple, Dell, Kingston, and Seagate. ➂ With the latest valuation of $5 billion, Toshiba could potentially re-integrate its former memory unit at a low price.

➀ TrendForce expects Q4 memory prices to see a significant slowdown in growth; ➁ DRAM ASPs will increase by 8% to 13% due to the rising share of HBM; ➂ PC DRAM prices will remain flat compared to the previous quarter; ➃ Server DRAM bit shipments are expected to improve in Q4; ➄ Mobile DRAM prices are projected to decline by 5-10% in Q4; ➅ Graphics DRAM prices are expected to remain flat; ➆ Consumer DRAM demand remains weak.

➀ Micron has introduced a new corporate logo, replacing the orbit around the M with new curves. The company's mission statement emphasizes staying ahead of the curve and driving the next generation of technology. ➁ The new logo is designed to embody Micron's technology leadership and innovation. ➂ The author expresses a neutral stance on the change, noting that it is less drastic than previous redesigns and invites readers to share their opinions in the comments section.

➀ The G.Skill Trident Z5 Royal DDR5-6400MT/s 64GB is reviewed, highlighting its luxury-class design and performance. It features mirror-finished aluminum heat spreaders and a crystalline light bar. The kit is tested for its speed, timings, and compatibility with Intel and AMD platforms. It is backed by a lifetime warranty and comes with a variety of configurations. ➁ The review includes benchmarks and real-world usage tests, showcasing the memory's performance in gaming, productivity, and encoding tasks. ➂ The summary concludes with overall impressions and recommendations.

➀ Micron Technology is investing $50 billion in U.S. memory chip manufacturing; ➁ The investment is supported by a $6.1 billion grant from the CHIPS and Science Act; ➂ The goal is to strengthen domestic memory chip production and U.S. economic and national security.

➀ NVIDIA's next-gen GeForce RTX 5090 Laptop GPU rumored to have 24GB of ultra-fast GDDR7 memory on a 256-bit memory bus; ➁ Expected to launch in Q1 2025; ➂ Speculation on the overall lineup and potential configurations.

➀ HBM is expected to take 10% of the DRAM units but 30% of the revenues due to its higher ASP; ➁ Sourcengine reports that HBM supply is booked out to the end of 2025, with conflicting views on a potential shortage or oversupply next year; ➂ Regular DRAM ASPs are low and may not improve until H2 2025.

➀ Contract prices of DRAM and NAND dropped by over 10% in September; ➁ The decline was due to low demand for PCs and consumer electronics; ➂ DDR4 8Gb 1Gx8 prices fell by 17.07% to US$1.7.

➀ G.Skill has announced a new DDR5-9000 memory kit, the Trident Z5 Royal Neo, targeting AMD Ryzen desktops; ➁ The kit is available in a 48GB (2x24GB) configuration with timings of CL44-56-56; ➂ It is optimized for use with ASUS ROG Crosshair X870E Hero motherboards and AMD Ryzen 7 8700G processors.

➀ AMD confirms support for one-click AMD EXPO DDR5-8000 memory kits; ➁ The support is available for new X870 and X870E motherboards; ➂ AMD updates its AGESA BIOS firmware for Ryzen 9000 Series CPU performance and latency improvements.

➀ AMD officially boosts the TDP of Zen 5 Ryzen 9000 processors to 105W; ➁ Fixes Ryzen 9000's core-to-core latency issue; ➂ Launches 800-series chipsets

➀ August chip inventories in Korea fell at the fastest rate for five years due to demand for memory; ➁ Inventories were down 42.6% year-on-year; ➂ Production increased by 10.3% and shipments by 16.1%.

Hynix has started mass production of a 36GB 12-layer HBM3E memory, marking the largest capacity HBM to date. The company achieved this by stacking 12 layers of 3GB DRAM chips, making each chip 40% thinner than before and using TSV4 technology. The new product offers improved heat dissipation performance and stability compared to the previous generation, and is designed to excel in speed, capacity, and stability, crucial for AI memory.

➀ MSI confirms CUDIMMs are compatible with AMD Ryzen 8000 and 9000 processors; ➁ X870 motherboards optimized for ultra-fast memory modules; ➂ Ryzen 7000 series CPUs incompatible due to unresolved booting issue

➀ KLEVV introduces the GENUINE G560 PCIe Gen5x4 NVMe M.2 SSD with speeds up to 14,000 MB/s; ➁ The SSD features passive cooling and is designed for gamers and content creators; ➂ KLEVV also announces the CRAS C715 PCIe Gen3 SSD with capacities up to 1TB.

➀ SK hynix has begun mass production of the world's first 12-layer HBM3E memory with a capacity of up to 36GB and a bandwidth of 9.6Gbps; ➁ The new memory is designed for AI GPUs and is set to be supplied to NVIDIA within 12 months; ➂ SK hynix aims to maintain its leadership in AI memory with the introduction of this new technology.

➀ Memory manufacturers are competing to win over server operating system developers; ➁ Samsung is collaborating with Red Hat; ➂ SK Hynix appears to be aiming to win over the entire ecosystem.

➀ Q2 semiconductor revenue reached a record high of $162.1 billion; ➁ Omdia attributes the growth to Nvidia and AI demand; ➂ Over 50% of tracked companies saw lower semiconductor revenue year-over-year.

➀ Researchers have successfully laser-inscribed the human genome onto a '5D' memory crystal; ➁ The technology could potentially preserve humanity for a far-off future; ➂ The '5D' designation refers to the use of birefringence in existing 3D optical storage technologies.