➀ Beelink launches the SER9 mini-PC with AMD Ryzen AI 9 HX 370 processor; ➁ Priced at $999 with 32GB LPDDR5X-7500 RAM and 1TB SSD; ➂ Features 12 cores, four Zen 5 cores, eight Zen 5c cores, and 24 threads.

➀ Tesla's BEV market share dropped from 19% to 17% in the first five months of 2024; ➁ BYD is just one point behind Tesla at 16%; ➂ The BEV portfolio of legacy automakers like Volkswagen and Geely-Volvo stood at 7 and 8 percent, respectively.

➀ Biwin has launched its fastest DDR5 memory kits to date with the DW100 RGB DDR5 OC; ➁ The memory features CUDIMM technology and operates up to 9200 MT/s with CL42; ➂ It received Red Dot 2024 and French Design Gold Awards for its design.

➀ Malcolm Penn, CEO of Future Horizons, highlights the uncertainty in the chip industry, with a strong Q4 2023 followed by a minus 5.7% Q1 2024 and an unexpected 6.5% growth in Q2 2024. ➁ The industry faces challenges such as weak global economy, low unit demand, excess capacity, and declining ASPs. ➂ Future Horizons forecasts a median annual growth of 15% for 2024 with a bull forecast of 17% and a bear forecast of 13%.

➀ This article discusses the importance of fully populating memory channels on CPUs featuring AMD EPYC Genoa; ➁ The author tests different memory configurations and finds that filling all memory channels maximizes memory bandwidth; ➃ The article concludes that filling memory channels is a good idea, especially for servers, to maximize performance.

➀ The author discusses the limitations of Intel's new Lunar Lake laptop CPUs, particularly the inability to upgrade RAM, which is a deal-breaker for power users; ➁ The author evaluates alternative options for lightweight, high-performance laptops with 64GB of RAM, including AMD Ryzen AI 300 CPUs and Snapdragon processors; ➂ The article concludes with the author's preference for the ThinkPad X1 Carbon and the potential impact of Intel's design choices on the laptop market.

➀ Micron has launched its second-generation HBM3 memory, HBM3e, with a capacity of 36GB, doubling the previous 24GB limit; ➁ The new memory features a 12-layer design, up from the previous eight layers, and is aimed at the AI market; ➂ Despite the increased capacity, Micron claims to have reduced power consumption by 30% compared to competitors' eight-layer HBM3e products; ➃ The new memory is expected to be used in upcoming AI accelerators from AMD, Nvidia, and other hardware vendors; ➄ The demand for high-bandwidth memory has surged with the AI boom, leading to intense competition for higher capacity and bandwidth.

➀ Adata's XPG gaming brand introduces the Lancer Neon RGB DDR5 memory kits with 60% RGB illumination and heat-dissipating layers; ➁ The modules feature a triangular pyramid design and a 50% PCR plastic heatsink; ➂ The memory supports Intel XMP 3.0 and AMD EXPO with various speed options.

➀ This article provides an overview of the NVIDIA GH200, a high-performance computing platform; ➁ Discusses the key features and innovations of the GH200, such as its LPDDR5X memory and NVLink-C2C interface; ➂ Explains the different configurations available for the GH200, including memory size, bandwidth, and GPU options.

➀ Jiangbolong showcased its self-developed 28nm eMMC master control chip with a unique QLC algorithm, offering up to 512GB storage capacity and technical capability for 1TB. ➁ The company also displayed its 28nm SLC NAND flash memory, featuring a 166MHz operating frequency and innovative circuit design to reduce noise interference. ➂ Jiangbolong's LPCAMM2 memory for AI applications supports LPDDR5/5x颗粒 and has been adopted by AI PC manufacturers like Lenovo.

➀ The spot price for consumer memory fell by 30% in Q2, creating a dislocation with contract prices. ➁ Module makers experienced a 40% year-over-year decline in consumer NAND shipments through retail channels, suggesting weak demand. ➂ Next year, DRAM prices are expected to rise gradually each quarter, driven by the increasing adoption of HBM3e.

➀ SK Hynix has announced the development of a Gen 6 10-nanometer (nm) 16Gb DDR5 DRAM, marking the first in the industry. ➁ This development positions SK Hynix ahead of its domestic competitor, Samsung, which began manufacturing Gen 5 DRAM in May. ➂ The competition between SK Hynix and Samsung continues to drive advancements in DRAM technology.

➀ SK Hynix introduced its in-memory computing advancements for LLM inference with AiMX-xPU and LPDDR-AiM, focusing on enhanced power efficiency and speed. ➁ The company showcased a GDDR6 Accelerator-in-Memory card utilizing Xilinx Virtex FPGAs and GDDR6 AiM package. ➂ SK Hynix aims to scale memory capacity from 32GB to 256GB per card and explore on-device AI applications.

➀ Apple is reportedly testing base-level Mac computers with at least 16GB of RAM. ➁ All new Macs are M4 Apple Silicon models, with even the lowest-end base model featuring 16GB of RAM. ➂ Apple is preparing a smaller Mac Mini, new MacBook Pro, and iMacs built around M4 chips for release later this year.

➀ All KIOXIA flash memory products are manufactured in Japan, leveraging the reputation for high-quality Japanese-made goods. ➁ KIOXIA, formerly Toshiba, invented flash memory, giving them a deep understanding of its technology and internal structure. ➂ KIOXIA focuses on educating users about their brand and flash memory technology to enhance brand recognition.

1. Kioxia showcased a 2Tbit NAND flash memory with QLC technology at the Future Memory and Storage (FMS) event, achieving the highest capacity to date. 2. The company also discussed the development roadmap for its next-generation 3D NAND technologies, focusing on performance improvements for the 9th generation and increased memory density for the 10th generation. 3. Kioxia's exhibition at FMS included a large booth with various models and displays, highlighting the advancements in its 3D NAND technology and the introduction of the 2Tbit NAND flash memory.

➀ CUDIMM, or Clocked Unbuffered DIMM, is designed to improve signal integrity in high-frequency DDR5 memory modules by introducing a Clock Driver (CKD). ➁ The CKD splits the clock domain into DCK (connected to the CPU) and QCK (connected to devices), similar to the RCD in RDIMM but simplified. ➂ For laptop memory modules (SODIMM), a similar approach is taken with CSODIMM, which also incorporates a CKD for enhanced clock signal management. ➃ JEDEC recommends CUDIMM for UDIMM modules above PC5-6400, and CKD solutions are available from various manufacturers, including Lanqi in China.

➀ Q2 IC sales increased by 27% YoY and are expected to grow by 29% in Q3 2024. ➁ Q2 installed fab capacity reached 40.5 million wafers per quarter, projected to rise by 1.6% in Q3. ➂ Memory capacity increased by 0.7% in Q2 and is forecast to grow by 1.1% in Q3, supported by demand for HBM and improving memory pricing.

➀ SK hynix plans to develop a new memory product with 20-30x the performance of current HBM; ➁ The company is focusing on custom HBM solutions for major tech companies; ➂ SK hynix is working on its 6th generation HBM, HBM4, expected to ship in the second half of 2025.

➀ During sleep, the brain resets memory by silencing specific neurons in the hippocampus, particularly in the CA2 region. ➁ This process is crucial for memory consolidation and allows for continuous learning without overloading. ➂ The mechanism could be targeted to enhance memory or potentially erase traumatic memories.