1. G.Skill has introduced DDR5-6400 memory kits with a CAS latency of 30, offering faster performance compared to standard DDR5-4800 modules. 2. These kits are designed for both Intel and AMD systems, supporting XMP and EXPO profiles respectively. 3. The modules are expected to be particularly beneficial for AMD's Ryzen 7000 and 9000 series CPUs, aligning with their memory speed limits.

➀ G.Skill has introduced ultra-low-latency DDR5-6400 memory modules with CL30 timings, the most aggressive yet for DDR5-6400 sticks. ➁ These modules are designed for both AMD and Intel systems, offering a significant reduction in latency compared to JEDEC standards. ➂ The new memory kits will be available starting late August 2024, targeting high-end motherboards and properly cooled CPUs.

1. G.Skill introduces ultra-low latency DDR5-6000 memory designed for AMD Ryzen AM5 builds. 2. The memory features EXPO support, offering optimized settings for overclocked performance. 3. Available in various capacities with CAS latency of 28, aiming to enhance performance on compatible AMD platforms.

1. The article discusses a humorous comic t-shirt depicting the evolution of storage devices. 2. It highlights the missing elements like the big floppy and tape reels. 3. The piece also includes comments from a tweet, emphasizing the concept of 'the cloud' as someone else's computer.

1. G.Skill introduces the Trident Z5 Royal Neo memory kit, featuring 32GB of DDR5-8000 memory for AMD platforms. 2. The kit operates in 1:2 clock divider mode and supports AMD EXPO. 3. The new AGESA update enables DDR5-8000 profiles and real-time memory overclocking on current AM5 chipsets.

1. NVIDIA, TSMC, and SK hynix have formed a 'triangular alliance' to lead the development of next-gen AI GPUs and HBM4 memory. 2. SK hynix president Kim Joo-sun is expected to discuss next-generation HBM collaboration plans with TSMC executives at SEMICON Taiwan. 3. The alliance aims to dominate the AI GPU market with HBM4 entering mass production in 2026.

1. JEDEC has released JESD405-1B, a standard for CXL memory module labels, detailing information like memory type, protocol revision, and capacity. 2. The standard supports SNIA EDSFF form factors E1.S and E3.S, and includes connector and I/O configuration details. 3. JESD405-1B, along with JESD317A, aims to support and expand the CXL market by ensuring multiple sourcing options for CMMs.

1. Neosem has become the first company to supply inspection equipment for CXL 2.0 memory production. 2. The equipment is used to determine the operability of CXL 2.0 memory modules. 3. The customer for this new equipment is Samsung.

1. AMD's upcoming Ryzen 9000 series with Zen 5 architecture will support DDR5 memory, focusing on performance and compatibility. 2. The article discusses the importance of memory type, capacity, transfer rate, and CAS latency when selecting DDR5 RAM. 3. Recommendations for DDR5 memory kits suitable for the Ryzen 9000 processors are provided, ranging from affordable to high-performance options.

1、G.Skill展示了一个DDR5内存模块，具有10,600 MT/s的数据传输率，这比现在流行的内存模块要高很多。 2、该模块使用AMD的Ryzen 5 8500G处理器和ASUS ROG Crosshair X670E Gene主板， cooling system是自定义的液冷系统。 3、G.Skill计划将这个模块用于未来市场，但还需要与各种CPU进行测试以确保稳定性。

1、SK海力士在2024年第一季度的客户存款再次上涨，达到56.1亿韩元。 2、这是由于Nvidia给予的先期支付，确保稳定的高带宽存储器(HBM)供应。 3、SK海力士已经售出2024年的HBM生产能力，2025年的生产能力也基本售出。

1、TSMC 将生产基于 12nm 和 5nm 节点的下一代 HBM4 基底_die。 2、该公司正在与 Micron、Samsung 和 SK Hynix 等 MEMORY 厂商合作，使用高级逻辑 process 制作 HBM4 基底_die。 3、HBM4 基底_die 将采用 N12FFC+ 和 N5 两种制程技术，提供更高的性能和更低的功耗