➀ TrendForce expects Q4 memory prices to see a significant slowdown in growth; ➁ DRAM ASPs will increase by 8% to 13% due to the rising share of HBM; ➂ PC DRAM prices will remain flat compared to the previous quarter; ➃ Server DRAM bit shipments are expected to improve in Q4; ➄ Mobile DRAM prices are projected to decline by 5-10% in Q4; ➅ Graphics DRAM prices are expected to remain flat; ➆ Consumer DRAM demand remains weak.

➀ Micron has introduced a new corporate logo, replacing the orbit around the M with new curves. The company's mission statement emphasizes staying ahead of the curve and driving the next generation of technology. ➁ The new logo is designed to embody Micron's technology leadership and innovation. ➂ The author expresses a neutral stance on the change, noting that it is less drastic than previous redesigns and invites readers to share their opinions in the comments section.

➀ The G.Skill Trident Z5 Royal DDR5-6400MT/s 64GB is reviewed, highlighting its luxury-class design and performance. It features mirror-finished aluminum heat spreaders and a crystalline light bar. The kit is tested for its speed, timings, and compatibility with Intel and AMD platforms. It is backed by a lifetime warranty and comes with a variety of configurations. ➁ The review includes benchmarks and real-world usage tests, showcasing the memory's performance in gaming, productivity, and encoding tasks. ➂ The summary concludes with overall impressions and recommendations.

➀ Micron Technology is investing $50 billion in U.S. memory chip manufacturing; ➁ The investment is supported by a $6.1 billion grant from the CHIPS and Science Act; ➂ The goal is to strengthen domestic memory chip production and U.S. economic and national security.

➀ HBM is expected to take 10% of the DRAM units but 30% of the revenues due to its higher ASP; ➁ Sourcengine reports that HBM supply is booked out to the end of 2025, with conflicting views on a potential shortage or oversupply next year; ➂ Regular DRAM ASPs are low and may not improve until H2 2025.

➀ G.Skill has announced a new DDR5-9000 memory kit, the Trident Z5 Royal Neo, targeting AMD Ryzen desktops; ➁ The kit is available in a 48GB (2x24GB) configuration with timings of CL44-56-56; ➂ It is optimized for use with ASUS ROG Crosshair X870E Hero motherboards and AMD Ryzen 7 8700G processors.

➀ AMD officially boosts the TDP of Zen 5 Ryzen 9000 processors to 105W; ➁ Fixes Ryzen 9000's core-to-core latency issue; ➂ Launches 800-series chipsets

➀ August chip inventories in Korea fell at the fastest rate for five years due to demand for memory; ➁ Inventories were down 42.6% year-on-year; ➂ Production increased by 10.3% and shipments by 16.1%.

Hynix has started mass production of a 36GB 12-layer HBM3E memory, marking the largest capacity HBM to date. The company achieved this by stacking 12 layers of 3GB DRAM chips, making each chip 40% thinner than before and using TSV4 technology. The new product offers improved heat dissipation performance and stability compared to the previous generation, and is designed to excel in speed, capacity, and stability, crucial for AI memory.

➀ MSI confirms CUDIMMs are compatible with AMD Ryzen 8000 and 9000 processors; ➁ X870 motherboards optimized for ultra-fast memory modules; ➂ Ryzen 7000 series CPUs incompatible due to unresolved booting issue

➀ Q2 semiconductor revenue reached a record high of $162.1 billion; ➁ Omdia attributes the growth to Nvidia and AI demand; ➂ Over 50% of tracked companies saw lower semiconductor revenue year-over-year.

➀ Researchers have successfully laser-inscribed the human genome onto a '5D' memory crystal; ➁ The technology could potentially preserve humanity for a far-off future; ➂ The '5D' designation refers to the use of birefringence in existing 3D optical storage technologies.

➀ Beelink launches the SER9 mini-PC with AMD Ryzen AI 9 HX 370 processor; ➁ Priced at $999 with 32GB LPDDR5X-7500 RAM and 1TB SSD; ➂ Features 12 cores, four Zen 5 cores, eight Zen 5c cores, and 24 threads.

➀ Tesla's BEV market share dropped from 19% to 17% in the first five months of 2024; ➁ BYD is just one point behind Tesla at 16%; ➂ The BEV portfolio of legacy automakers like Volkswagen and Geely-Volvo stood at 7 and 8 percent, respectively.

➀ Biwin has launched its fastest DDR5 memory kits to date with the DW100 RGB DDR5 OC; ➁ The memory features CUDIMM technology and operates up to 9200 MT/s with CL42; ➂ It received Red Dot 2024 and French Design Gold Awards for its design.

➀ Malcolm Penn, CEO of Future Horizons, highlights the uncertainty in the chip industry, with a strong Q4 2023 followed by a minus 5.7% Q1 2024 and an unexpected 6.5% growth in Q2 2024. ➁ The industry faces challenges such as weak global economy, low unit demand, excess capacity, and declining ASPs. ➂ Future Horizons forecasts a median annual growth of 15% for 2024 with a bull forecast of 17% and a bear forecast of 13%.

➀ This article discusses the importance of fully populating memory channels on CPUs featuring AMD EPYC Genoa; ➁ The author tests different memory configurations and finds that filling all memory channels maximizes memory bandwidth; ➃ The article concludes that filling memory channels is a good idea, especially for servers, to maximize performance.

➀ The author discusses the limitations of Intel's new Lunar Lake laptop CPUs, particularly the inability to upgrade RAM, which is a deal-breaker for power users; ➁ The author evaluates alternative options for lightweight, high-performance laptops with 64GB of RAM, including AMD Ryzen AI 300 CPUs and Snapdragon processors; ➂ The article concludes with the author's preference for the ThinkPad X1 Carbon and the potential impact of Intel's design choices on the laptop market.

➀ Micron has launched its second-generation HBM3 memory, HBM3e, with a capacity of 36GB, doubling the previous 24GB limit; ➁ The new memory features a 12-layer design, up from the previous eight layers, and is aimed at the AI market; ➂ Despite the increased capacity, Micron claims to have reduced power consumption by 30% compared to competitors' eight-layer HBM3e products; ➃ The new memory is expected to be used in upcoming AI accelerators from AMD, Nvidia, and other hardware vendors; ➄ The demand for high-bandwidth memory has surged with the AI boom, leading to intense competition for higher capacity and bandwidth.

➀ Adata's XPG gaming brand introduces the Lancer Neon RGB DDR5 memory kits with 60% RGB illumination and heat-dissipating layers; ➁ The modules feature a triangular pyramid design and a 50% PCR plastic heatsink; ➂ The memory supports Intel XMP 3.0 and AMD EXPO with various speed options.