➀ SK Hynix Chairman Chey Tae-won is rumored to meet with NVIDIA CEO Jensen Huang at CES 2025 to discuss HBM4 memory for future AI GPUs; ➁ NVIDIA has requested expedited HBM4 production for its Rubin R100 AI GPUs; ➂ NVIDIA's CES keynote will highlight advancements, including the GeForce RTX 50 series.

➀ NVIDIA is set to unveil its GB300 AI server platform at GTC 2025; ➁ The new B300 AI GPUs will offer up to 1400W power and 1.5x FP4 performance over the B200; ➂ The GB300 will feature 288GB HBM3E memory, improved connectivity, and a slot design.

➀ Rambus details its new HBM4 memory controller with speeds up to 10Gb/s and bandwidth of 2.56TB/sec; ➁ HBM4 offers 33% faster bandwidth than HBM3E and twice the speed of HBM3; ➂ SK hynix and Samsung are expected to mass produce HBM4 memory by the end of 2025.

➀ SK hynix has begun mass production of the world's first 12-layer HBM3E memory with a capacity of up to 36GB and a bandwidth of 9.6Gbps; ➁ The new memory is designed for AI GPUs and is set to be supplied to NVIDIA within 12 months; ➂ SK hynix aims to maintain its leadership in AI memory with the introduction of this new technology.

1. NVIDIA seeks to bypass US sanctions by obtaining an export license to sell AI GPUs to telecom companies in the Middle East. 2. The company has reportedly signed a deal with Ooredoo to introduce its AI technology in datacenters across five Middle Eastern countries. 3. Ooredoo plans to invest $1.4 billion to expand its datacenter capacity, aiming to triple it by 2030.

1. Samsung is preparing to launch 3D packaging services for HBM4 within the next 12 months. 2. The technology is intended for next-gen AI GPUs, which will be released in 2025. 3. The new 3D packaging technology, called SAINT-D, will be used to stack HBM chips vertically on top of a GPU for increased speed, without the need for a silicon interposer.