➀ Stochastic effects below 50 nm pitches require reevaluation of EUV lithography resolution limits; ➁ LELE multipatterning does not sufficiently mitigate stochastic effects due to small critical dimensions; ➂ Comparative performance analysis shows slight improvement at 60 nm pitch, but stochastic defect rates remain an issue.

➀ TechInsights offers a preview of the 2025 semiconductor industry with a free webinar; ➁ Discusses major trends like tariff changes, AI accelerators, and 2nm technology breakthroughs; ➂ Features presentations by TechInsights experts on key industry events and implications.

➀ PIMIC is an AI semiconductor startup focusing on ultra-low-power AI solutions with innovative processing-in-memory (PiM) technology. ➁ The company plans to launch two ultra-efficient AI silicon chips at CES 2025 with 10x to 20x power savings. ➂ PIMIC's Jetstreme™ Processing-in-Memory architecture addresses the increasing demand for performance in small to large AI models.

➀ TSMC has developed co-packaged optics (CPO) technology; ➁ The technology integrates a chiplet and an optical device; ➂ It aims to ease overheating in GPUs, particularly Nvidia’s GPUs.

➀ Intel's Foundry Services (IFS) division is struggling with low wafer yields and projected cumulative losses. ➁ Selling IFS could provide Intel with $30 billion to focus on core operations, but might hinder IDM 2.0 strategy. ➂ The decision hinges on whether Intel should continue investing in IFS or sell it to reduce financial risks.

➀ Samsung lost the contract for the Snapdragon 8 Elite 2 processor to TSMC; ➁ TSMC will use its N3P process node for mass production; ➂ This is a setback for Samsung's semiconductor business struggling with high-end chip production.

➀ LB Semicon, a South Korean outsourced semiconductor assembly and test (OSAT) firm, plans to significantly increase its revenue from overseas within the next three years; ➁ The company aims to achieve this by reducing its reliance on display driver ICs (DDIs); ➂ LB Semicon CEO Namseong Kim announced this during a press conference in Seoul.

➀ According to Liberty Times, citing Financial Times, major tech companies have significantly increased capital expenditures in recent years to acquire AI chips and build data centers. ➁ However, global investment in data centers has recently slowed, raising concerns about whether the AI boom might be losing steam. ➃ Qualcomm's Snapdragon 8 Elite 2 is set to use TSMC's N3P process, while Samsung reportedly lost orders.

➀ Intel needs to fill its fabs to remain competitive; ➁ TSMC's rapid expansion with new partnerships; ➂ The potential of a Common Foundry Platform Alliance for Intel.

➀ Agileo Automation specializes in software solutions for semiconductor production equipment control and MES system integration; ➁ Marc Engel has 25 years of engineering experience in software development and equipment setup; ➂ The company's A²ECF-SEMI framework helps customers reduce time-to-market; ➃ Agileo Automation focuses on customer experience and service.

➀ TSMC's dominance in the semiconductor industry prompts South Korea to consider establishing KSMC; ➁ KSMC aims to support local semiconductor industry development; ➂ Challenges include technological gaps and talent shortages.

➀ Nanusens CEO Dr. Josep Montanyà discusses the company's patented NEMS technology and its applications in sensors and AI processors; ➁ The company's focus on RF DTC and its potential to revolutionize smartphone technology; ➂ Challenges faced in fundraising and the company's strategic shift to focus on RF products; ➃ The potential of vacuum transistors in AI processors and Nanusens' plans for future development.

➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.

➀ Micron reports revenue and EPS in line with expectations but provides weak guidance; ➁ AI-driven memory demand surges, while consumer memory struggles; ➂ Market concerns over Micron's stock due to the imbalance between AI and consumer memory growth.

➀ AI laptops like Microsoft's Copilot+ PCs face uncertain future; ➁ Micron's Q3 earnings weaker than expected; ➂ AI PC and smartphone 'supercycle' not materializing as projected

➀ SK Hynix has secured a significant order for HBM from Broadcom; ➁ The chips will be used in an AI computing chip for a major technology company; ➂ The deal is expected to enhance SK Hynix's market position in high-performance memory.

➀ Semicon Japan exhibit high attendance but a muted tone due to concerns over spending; ➁ Rapidus, a Japanese government-backed semiconductor plan, is seen as a fantasy; ➂ Analysts are adjusting their 2025 WFE outlook due to slowing demand; ➃ Chip equipment companies are lobbying for China sales, raising questions about hypocrisy; ➄ Stock market instability and uncertainty about the new administration's semiconductor policies.

➀ TSMC unveiled its 2nm Platform Technology at IEDM, featuring GAA nanosheet transistors for AI, HPC, and mobile applications. ➁ The N2 technology achieves significant improvements in speed and power efficiency compared to the 3nm node. ➂ TSMC's N2 is scheduled for mass production in 2025, with an enhanced version, N2P, targeted for 2026.

➀ 3D design with HBM is critical for advanced semiconductor systems; ➁ Large system designs require multi-chiplet integration; ➂ Multiphysics and ML are essential for optimizing performance and reliability.

➀ The author argues that Intel is not crucial to the industry's success and can be replaced; ➁ Intel faces challenges from competition and the decline of the x86 market; ➂ The author suggests splitting Intel into product and foundry entities to improve focus.