➀ The shift in MCU design from simple to complex, requiring more sophisticated interconnects like NoC; ➁ The factors driving this change, including power reduction, safety standards, and support for multiple protocols; ➂ The importance of scalability in design and how NoC architectures can support this.

➀ Dr. Tahir Ghani discussed the impact of Moore's Law and the challenges of energy efficiency in semiconductor technology. ➁ He highlighted the evolution of transistor technology over six decades. ➂ He advocated for new transistor designs and collaborations to improve energy efficiency for AI computing.

➀ Park Systems' atomic force microscope (AFM) is in high demand among global chipmakers; ➁ The demand is driven by the necessity of the AFM for hybrid bonding processes; ➂ The company has already supplied test equipment to some chipmakers and is in discussions with others.

➀ TSMC's Mii presented a keynote at the 70th IEDM, discussing the semiconductor industry's growth and the impact of AI, predicting a revenue of one trillion dollars by 2030. ➁ He highlighted the evolution of logic technologies and introduced CFET architectures. ➂ He discussed the importance of advanced silicon stacking and packaging technologies.

➀ The WSTS forecasts a 19% growth in the semiconductor market for 2024, primarily driven by a 81% growth in the memory segment; ➁ Companies in the automotive and industrial sectors are experiencing revenue declines; ➂ Nvidia's revenue grew 135% due to AI processors, while memory companies reported substantial revenue gains.

➀ Chipmetrics is a Finnish company specializing in metrology solutions for high aspect ratio 3D chips; ➁ They provide test chips to accelerate R&D and process control workflows; ➂ The company's PillarHall test chips enable precise measurements of film properties in high aspect ratio cavities.

➀ LB Semicon and its subsidiary LB Lusem are set to provide turn-key packaging services for power management chips used in AI data centers. ➁ They will handle both the front and back sides of wafers. ➂ The announcement was made on Wednesday.

➀ LB Semicon and its subsidiary LB Lusem will provide turn-key packaging services for power management chips used in AI data centers. ➁ The services will include processing for both the front and back sides of wafers. ➂ They will also offer testing for the chips.

➀ 3ALogics, an NFC fabless chip company, plans to launch around ten new NFC-based wireless charging chips next year; ➁ The company's CEO, Park Kwang-beom, stated during a conference that they have selected to focus on approximately 10 categories of NFC chips to achieve success; ➂ The new chips are part of the company's strategy to expand its NFC chip offerings.

➀ 3ALogics is planning to launch around ten new NFC-based wireless charging chips next year; ➁ The company has selected to focus on approximately 10 categories of NFC chips from over a hundred; ➂ CEO Park Kwang-beom emphasized the strategic choice for success.

➀ Samsung Electronics has developed a 400-layer NAND technology, surpassing SK hynix's 321-layer NAND; ➁ The 400-layer NAND will enter mass production in the second half of 2025; ➂ Samsung plans to provide details on its new 1Tb 400-layer TLC NAND at the ISSCC 2025.

➀ The departure of CEO Pat Gelsinger highlights ongoing issues at Intel; ➁ Semiconductor technology and supply chain control are crucial in the AI era; ➂ Intel's board of directors has made a series of poor decisions over the past two decades.

➀ TSMC's 2nm chip yields exceed expectations in trial runs; ➁ Mass production is scheduled for 2025; ➂ The 2nm node introduces nanosheet architecture, a first in the semiconductor industry.

➀ GP Singh co-founded Ambient Scientific to develop high-performance, low-power AI microprocessors; ➁ The company's DigAn® technology enables ultra-low power AI applications without cloud dependency; ➂ GPX10 processor addresses inefficiencies in current AI hardware by offering better performance and lower power consumption; ➃ GP Singh emphasizes the importance of semiconductors in improving human lives.

➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.

➀ FOUP cleaner manufacturer ISTE is expanding into plasma-enhanced chemical vapor deposition (PECVD) equipment; ➁ The CEO of the fab equipment maker, Cho Chang-hyun, mentioned this during the company’s conference; ➂ The PECVD equipment market is 30 times larger than the FOUP market.

➀ LB Semicon and DB Hitek announced a collaboration to co-develop an enhanced redistribution layer (RDL) for high power chips; ➁ The RDL is a metal layer that connects the I/O pad inside the chip to the outside; ➂ The layer is used in high-performance applications.

➀ LB Semicon and DB Hitek have announced a collaboration to co-develop an enhanced redistribution layer (RDL) for high-power chips; ➁ The RDL is a metal layer that connects the I/O pad within the chip to the outside world; ➂ This collaboration aims to improve the performance and connectivity of high-power chips.

➀ The rise of 2.5D and 3D multi-die design in mainstream applications; ➁ Comprehensive design flows provided by Synopsys and Ansys for multi-die projects; ➂ Expert insights from Marc Swinnen and Keith Lanier on technical knowledge and engaging presentation.

➀ Isu Petasys has decided to withdraw from its plan to acquire carbon nanotube manufacturer JEIO; ➁ The decision was personally ordered by Kim Sang Beom, the chairman of Isu Group; ➂ With the cancellation, Isu Petasys will be giving up the 15.8 billion won deposit that has already been paid.