Hanwha Precision Machinery is on the verge of officially securing orders from SK Hynix for thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM). Sources indicate that the equipment manufacturer is in the final stages of verification with the chip-maker.
Recent #Chiplet news in the semiconductor industry
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➀ NVIDIA's stock price dropped 17% after Chinese startup DeepSeek launched its R1 model.
➁ The R1 model, developed in just two months and costing $6 million, rivals OpenAI's ChatGPT.
➂ NVIDIA responded to the development, emphasizing the importance of Test Time Scaling and the need for NVIDIA GPUs.
➀ The adoption of multi-die solutions in HPC chip designs is driven by advancements in interconnect technology, thermal management, and power delivery.
➁ Multi-die architectures offer higher performance, design flexibility, and cost efficiency compared to traditional monolithic designs.
➂ The current market demand for scalable, energy-efficient computing, especially in AI and HPC applications, positions multi-die solutions as a crucial component for future semiconductor developments.
➀ High-speed digital designers face challenges in achieving GHz frequencies and multi-level signaling.
➁ Crosstalk analysis tools like Keysight's Crosstalk Analyzer can save time and cost by automating complex simulations.
➂ Power integrity analysis is crucial for managing power delivery networks in high-power applications like AI chips.
➀ Silicon Creations achieved significant milestones in 2024, including shipping over ten million wafers and reaching 1000 production licenses for its Fractional SoC PLL IP.
➁ The company specializes in mixed-signal IP solutions focusing on clocking and high-speed data interfaces, working with various foundries and advanced process nodes.
➂ In 2025, Silicon Creations anticipates growth in AI accelerator chips, crypto mining, and automotive sectors, driven by customer tapeouts in advanced nodes and early interest in sub-2nm nodes.
➀ Okins Electronics announced on Wednesday that it will supply Samsung with over 400,000 units of semiconductor test sockets, valued at 6.65 billion won (approximately 11.7% of the company's revenue in 2023).
➁ A spokesperson for Okins Electronics stated that the majority of these sockets will be used for Samsung's production processes.
➂ This contract highlights the strong partnership between Okins Electronics and Samsung in the semiconductor industry.
➀ Performance validation in SoC designs is distinct from architectural exploration, focusing on evaluating actual performance to meet specifications.
➁ Hardware-Assisted Verification (HAV) platforms play a crucial role in performance validation by enabling real-world traffic testing and firmware performance tuning.
➂ Part 2 of 2 explores the performance validation process across hardware blocks and firmware in SoC designs, emphasizing the critical role of HAV platforms.
➀ Sarcina Technology, led by Founder and CEO Larry Zu, offers comprehensive post-silicon ecosystem services including package design, assembly, testing, qualification, and production services for leading semiconductor companies.
➁ In 2024, Sarcina developed a Bump Pitch Transformer (BPT) to simplify and reduce costs in 2.5D package designs, addressing challenges related to costly silicon TSV interposers.
➂ Sarcina aims to increase awareness of its capabilities, especially its Application Specific Advanced Package (ASAP) Service, through presentations and participation in industry conferences.
➀ Defacto Technologies, led by Dr. Chouki Aktouf, specializes in innovative SoC design solutions and has become a leader in front-end SoC integration.
➁ In 2024, the company focused on incorporating AI technologies into their R&D projects, aiming to introduce AI-based automation in their tools.
➂ For 2025, the company plans to focus on AI-based EDA and attend key industry conferences like DAC and DATE.
➀ NVIDIA CEO Jensen Huang is collaborating with TSMC on robotics and autonomous vehicle development.
➁ NVIDIA's upcoming Jetson Thor SoC and Project GROOT robot are part of this collaboration.
➂ The collaboration includes a joint silicon photonics research project between NVIDIA and TSMC.
➀ Hanmi Semiconductor has signed a 10.8 billion won deal with SK Hynix for HBM production equipment; ➁ The deal involves tuning bonders supplied by Hanmi to SK Hynix; ➂ Details of the deal were not disclosed.
➀ 35ELEMENTS致力于通过开发立方氮化镓半导体材料来帮助实现碳中和；➁ 公司计划在两年内在兼容CMOS的Si(100)衬底上扩大其材料规模，并寻求与代工厂的合作；➂ 35ELEMENTS拥有立方氮化镓材料的独家专利，并计划制造高效的光发射器，如创新型绿色发光二极管。
➀ The automotive industry is rapidly evolving towards intelligent, connected, and autonomous vehicles with SoC technology; ➁ Chiplet-based architectures offer modular, scalable, and customizable solutions for automotive SoC design; ➂ Cadence provides tools and frameworks to enhance the design process and ensure safety, performance, and reliability.
➀ TSMC has developed co-packaged optics (CPO) technology; ➁ The technology integrates a chiplet and an optical device; ➂ It aims to ease overheating in GPUs, particularly Nvidia’s GPUs.
➀ According to Liberty Times, citing Financial Times, major tech companies have significantly increased capital expenditures in recent years to acquire AI chips and build data centers. ➁ However, global investment in data centers has recently slowed, raising concerns about whether the AI boom might be losing steam. ➃ Qualcomm's Snapdragon 8 Elite 2 is set to use TSMC's N3P process, while Samsung reportedly lost orders.
➀ Intel's shift to a more transparent strategy in technology announcements; ➁ The competition between Intel's PowerVia and TSMC's Super Power Rail; ➂ Andy Grove's philosophy of maintaining a 'healthy amount of paranoia'.
➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.
➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.
➀ DeepX is set to receive the production wafer for its DX-M1 chip from Samsung Foundry by the end of the year; ➁ The chip's multi-project wafers are being produced in collaboration with design house Gaonchips and Samsung Foundry; ➂ DeepX has entered into a 7.2 billion won production deal with Gaonchi.