➀ Cadence宣布开发并成功流片其首款基于Arm的系统芯片let；➁ 这标志着芯片let技术的重大进步；➂ 强调了Cadence通过其芯片let架构和框架推动行业领先解决方案的承诺。
Recent #Chiplet news in the semiconductor industry
➀ NVIDIA has announced a new Grace Blackwell platform with the NVIDIA GB200 NVL4, which combines two Arm-based Grace CPUs and four Blackwell GPUs. The platform is designed for lower power deployments with a power consumption of just over 6kW. The NVL4 module is targeted to be a large node with up to 1.3TB of combined coherent memory. ➁ The GB200 NVL4 is set to ship in the second half of 2025. ➂ The NVL4 is designed as an alternative to the higher power and higher GPU count platforms offered by NVIDIA, targeting specific deployment needs.
➀ Panmnesia, a Korean startup focusing on CXL switch chips and CXL IP, has raised $60 million in Series A funding, valuing the company at $250 million. The funds will be used for the completion of the CXL 3.1 switch chip manufacturing, advancement of CXL IP, and global IT company collaborations. ➁ Founded in 2022, Panmnesia is led by CEO Myoungsoo Jung, a professor at KAIST, and includes Masters and PhD researchers. ➂ The round was led by InterVest and included new investors like Korea Investment Partners and existing investors such as Daekyo Investment.
➀ Hynix plans to start sampling HBM3e 16hi memory with 48 GB capacity per cube in H1 2025; ➁ HBM3e 16hi offers a high-capacity alternative before the production of HBM4 16hi; ➂ HBM3e 16hi can deliver a maximum capacity of 384 GB per system, surpassing NVIDIA’s Rubin at 288 GB; ➃ Transitioning from HBM3e to HBM4 will double the I/O count and increase die size, but the per-die capacity remains at 24 GB; ➄ HBM3e 16hi will adopt the Advanced MR-MUF stacking process for higher stack counts and computational bandwidth.
➀ Nvidia surpasses Apple in market capitalization for the second time this year; ➁ Nvidia's market cap surged by 214% in one year; ➂ Nvidia's focus on AI and GPU sales drives its growth; ➃ AMD's CDNA3-based MI325X and CDNA4-based MI355X could challenge Nvidia's market dominance.
➀ Researchers from Queen Mary University of London have developed new nanocomposite films from starch, offering a sustainable alternative to petroleum-based materials; ➁ The films are made from abundant natural polymer starch and highly conductive MXene, with potential applications in electronics and sensing; ➂ The nanocomposites can be tailored for various uses, including wearable technology and healthcare, and are biodegradable.
➀ The article discusses the use of laser-based alignment for 3D semiconductor chip manufacturing, achieving precision down to fractions of a nanometer. ➁ Traditional methods using microscopes are limited due to the gap between chip layers, whereas the laser-based method overcomes this by using concentric metalenses to project holograms. ➂ The technology could also benefit advanced displacement sensors and startups in the semiconductor field.
➀ Alchip has taped out a 2nm test chip; ➁ The company expects results by the first quarter of next year; ➂ Alchip is working with customers on high-performance 2nm ASIC development.
➀ TSMC is the leading player in the semiconductor industry.
➁ Advanced packaging is becoming a key technology path for chip performance improvement.
➂ TSMC is expected to become the largest packaging service provider with the rapid adoption of Chiplet architecture.
➃ TSMC has invested heavily in advanced packaging technology, with capacity set to grow significantly.
➄ TSMC's CoWoS, InFO, and SoIC technologies are driving the company's leadership in advanced packaging.
➅ TSMC is expanding its capacity to meet the increasing demand for advanced packaging.
➆ TSMC is also investing in optical packaging technology to meet the growing bandwidth needs.
➀ Arm's Total Design initiative has doubled in size within a year; ➁ Samsung Foundry, ADTechnology, and Rebellions collaborate on a 2nm AI processor; ➂ The AI CPU chiplet platform is designed for AI/ML training, cloud computing, and high-performance computing workloads.
➀ Chiplet technology breaks down components from a single system-on-chip (SoC) into multiple small chips (chiplets) with specific functions, and then interconnects them using advanced packaging technology to form a system-in-package (SiP). Advanced packaging technology enhances Chiplet design and performance in terms of interconnect density, signal transmission optimization, thermal performance improvement, reduction of process dependency, and heterogeneous integration, accelerating chip design and application deployment.
➁ With the continuous improvement of chip performance, Chiplet design requires higher signal transmission speed from the substrate. Traditional substrates struggle to meet this demand, but glass substrates offer faster signal transmission rates, lower dielectric losses, and higher interconnect density, providing faster signal transmission channels for Chiplet chips. Additionally, glass substrates have larger packaging sizes and good mechanical stability, allowing for more chiplets in the same area, facilitating large-scale integration of Chiplets and enabling more complex system-in-package designs to meet the performance requirements of high-performance computing and artificial intelligence.
➂ On October 18th at 19:30, the 11th 'Xing Xing Chiplet and Advanced Packaging Public Lecture' will feature a talk by Ma Xiaobo, President of Hunan YueMo Research Institute, titled 'Glass Substrate Chiplet Advanced Packaging and Multi-Physical Field Simulation'. Ma will discuss the prospects and industry status of Chiplet advanced packaging technology, share the application advantages of glass substrates in advanced packaging, and focus on multi-physical field simulation for glass substrate Chiplet advanced packaging and the application and future development trends of deep learning in advanced packaging simulation.
➀ The research investigates the effects of adding TiC nanoparticles to aluminum alloy 7075, aiming to enhance casting performance and improve fluidity and surface quality; ➁ TiC nanoparticles were introduced in two concentrations, and their impact on fluidity and microstructure was analyzed; ➂ The results showed a significant improvement in fluidity and surface quality, with finer grain sizes and smoother surfaces.
➀ Faraday and Kiwimoore announce the mass production of their jointly developed 2.5D packaging platform; ➁ The platform is a result of collaboration between the two companies; ➂ The platform is designed to enhance ASIC design and AI networking interconnect solutions.
➀ Researchers demonstrate active optical interposers for chiplet connectivity with minimal latency; ➁ CEA-Leti's Starac technology uses silicon photonics for improved performance and reduced latency; ➂ The technology aims to enable direct communication between chiplets, bypassing traditional routing methods.
➀ Researchers are exploring wireless communication at the chip level using terahertz frequencies to overcome the limitations of traditional wired connections. ➁ This approach, which involves Floquet engineering and dual-signaling architecture, promises high-speed and reliable data transfer between chiplets. ➂ The advancement in wireless communication is crucial for more efficient and scalable computing systems.
➀ This research explores the potential of two-dimensional silk fibroin films in electronics; ➁ The study investigates the growth mechanisms of silk fibroin films and their interactions with substrates; ➂ The findings highlight silk fibroin's potential as a versatile biomaterial for electronic applications.
➀ The Intel Xeon 6900P series, with 128 cores and 12 memory channels, marks Intel's return to server CPU leadership after trailing AMD for seven years; ➁ The series features new process technology and accelerators, aiming to compete with AMD's top-end parts; ➂ Intel's design strategy includes integrating memory controllers into compute tiles for better performance.
➀ The Marana 4.2B-6 back-illuminated sCMOS camera has been significantly enhanced for Physical Sciences and Astronomy applications; ➁ A new Low Noise Mode reduces read noise to 1.0e-; ➂ A new High-Speed mode with 2-lane CoaXPress connection allows for 135 fps operation; ➃ A new Long Exposure Mode suppresses amplifier glow; ➄ A 'Global Clear' mode for Rolling Shutter sensors improves synchronization and minimizes exposure 'dead times'.
➀ Sehat Sutardja, the founder of Marvell and the pioneer of Chiplet concept, passed away at the age of 63 due to sudden illness; ➁ Sutardja and his wife Weili Dai were known as the 'Swordsman and Dragoness' of the chip industry; ➂ Sutardja's contribution to the semiconductor industry, including the Marvell MoChi module chip technology in 2015, laid the foundation for the Chiplet concept; ➃ The Chiplet concept involves integrating different types of chips, dividing SoC into smaller chips, and integrating them using advanced packaging technology; ➄ The Chiplet concept is considered a new solution to address the challenges of Moore's Law and advanced process technology.
➀ Enosemi, a provider of silicon photonics chiplets and IP, announced the availability of a portfolio of high-speed electronic and photonic design IP in the GF Fotonix IP catalog; ➁ The silicon-proven design IP enables Fotonix users to accelerate their time-to-market for next-generation photonic integrated circuits; ➂ Enosemi has multiple customers developing photonic integrated circuits.