➀ MinebeaMitsumi has announced a tender offer to acquire thermistor specialist Shibaura Electronics to save it from a hostile takeover bid from Taiwan's Yageo Corp.;
➁ Shibaura Electronics, with a 13.5% world market share in thermistors, is a key player in vehicles, wind turbines, and industrial robots;
➂ Yageo Corp. plans to make a takeover bid on May 7th, offering $29 per share, but MinebeaMitsumi is offering $31 per share, totaling $485 million for the company.
➀ Ed在日记中透露，关税问题让他感到自豪，他预见到这将是Liz Truss故事的翻版，并相应地应对。
➁ 到周二晚上，关税已使全球股市价值蒸发10万亿美元，而到周四早上，股市又上涨了6万亿美元。
➂ 所有金融人士都说，当政府债券开始抛售时，总统将改变方向，就像Liz在她预算后大量出售金边债券时那样。
➀ Silex Technology has launched the AMC Edge System-on-Module (SoM), EP-200Q, which is powered by the Qualcomm Dragonwing™ QCS6490 processor and offers high-performance edge AI capabilities in a very small form factor.
➁ The EP-200Q integrates Wi-Fi 7 drivers and is optimized for industrial and healthcare IoT devices requiring power efficiency and rapid deployment.
➂ It features an octa-core CPU, Hexagon DSP, and a 12-TOPS AI engine, along with long-term availability through the Qualcomm Product Longevity Program.
➀ Siemens Digital Industries Software has acquired DownStream Technologies, a provider of manufacturing data preparation tools for PCB design.
➁ The acquisition aims to expand Siemens' presence in the small and medium-sized business (SMB) market.
➂ DownStream Technologies' CAM350 suite of tools allows customers to verify and automatically prepare PCB design data for fabrication, reducing errors and streamlining the transition from design to production.
➀ Smiths Interconnect 在突尼斯的工厂增加了电缆组件生产能力；
➁ 制造流程包括切割、剥皮、压接、焊接、灌封、标识和测试等环节；
➂ 该工厂专注于制造和测试信号、数据传输、混合、装甲和电源电缆，以及用于航空航天、国防、交通和工业应用的信号、同轴、双轴、三轴和四轴，以及Mil-Spec和D-sub连接器。
➀ Hamamatsu Photonics Europe has launched NZConnectMD Scan, an image acquisition platform for digital pathology workflows.
➁ The software allows for centralized control of multiple NanoZoomer MD Series scanners.
➂ Key features include barcode-based slide tracking, workflow balancing, and space optimization.
➀ Cyient, a global engineering and technology solutions provider, has launched its fully owned semiconductor subsidiary, Cyient Semiconductors.
➁ The move aims to strengthen Cyient's commitment to innovation and excellence in the global semiconductor market.
➂ Cyient Semiconductors will leverage Cyient's expertise in semiconductor design.
➀ A research team from Peking University and other institutions has developed a new method to integrate 2D semiconductors with dielectric materials, opening the door to smaller and faster electronics.
➁ The method involves growing an ultra-thin dielectric film on a copper surface covered with graphene, allowing the film to be transferred to different substrates with minimal defects.
➂ This advancement could lead to the scalable production of high-performance, low-power microelectronics and optoelectronics based on 2D materials, with future efforts focusing on precise alignment and stacking of 2D materials.
➀ Microchip Technology introduces a comprehensive audio-to-haptic reference design tailored for next-generation VR, AR, and gaming devices. This design provides immersive haptic feedback by converting audio input into tactile sensations.
➁ The system features a low-voltage board containing a Bluetooth module (BM83) for wireless synchronization of stereo audio and a microcontroller with DSP for processing and conditioning audio signals. A high-voltage board with amplifiers and a Boost regulator drives up to four haptic actuators.
➂ The reference design is pre-programmed with firmware for immediate use and offers flexibility for customization. It supports battery-powered applications, making it ideal for portable VR and gaming devices.
➀ Keysight Technologies has introduced KAI Data Center Builder, a new software suite designed to emulate real-world AI training workloads, aiding in assessing the impact of changes to algorithms, components, and protocols on AI system performance.
➁ The tool helps align hardware design with training algorithms, improving overall system performance by integrating training workloads from large language models (LLMs) and other AI models.
➂ KAI Data Center Builder allows AI operators, cloud providers, and infrastructure vendors to test realistic workloads in lab environments, validate new AI cluster designs, refine partitioning strategies, and optimize performance before full deployment.
➀ U.S. President Donald Trump has signed an executive order to create the United States Investment Accelerator Office;
➁ The office aims to negotiate better deals for taxpayers;
➂ There are concerns about the impact on existing contracts and awards.
➀ The article discusses a reference design for a wireless M-Bus communication module developed by Texas Instruments (TI). This design uses the CC1310 and CC1350 wireless MCUs and is compatible with the Open Metering System (OMS) v3.0.1 specification.
➁ The design supports various metering applications, including heat cost allocators, gas and water meters, and energy meters. It also supports unidirectional and bidirectional RF communication in S-, T-, and C-modes within the 868 MHz band.
➂ The reference design offers a single-chip solution with excellent RF performance and ultra-low power consumption, making it suitable for battery-powered sub-meters and other metering devices.
➀ This article discusses a reference design for secure telehealth solutions, offering a robust framework for building advanced connected medical devices.
➁ The design features a WBZ350 module with Bluetooth LE 5.2 capability, ensuring efficient communication and enhanced security with the ATECC608C cryptographic co-processor.
➂ The design supports multiple connectivity options, including AWS or Azure cloud connectivity, and also includes bio-signal and temperature sensors for accurate health monitoring.
➀ Cover Story: Quantum Chips - The latest developments in quantum computing.
➁ Future: How AI will transform everyday life.
➂ Strategy: Global chip race shifts, spotlight moment for India?
➀ A recent study introduces a Janus membrane for water purification and energy generation, aiming to address water scarcity and energy needs;
➁ The membrane uses cellulose nanofibers (CNF) and a modified MXene to improve performance over longer periods;
➂ The Janus membrane demonstrates better performance than traditional membranes, achieving a high evaporation rate and photothermal conversion efficiency, and effectively preventing salt buildup.
➀ This article introduces a reference design for a programmable 100V high-current regulator by Texas Instruments (TI), named TIDA-01371. The design supports output voltages ranging from ±2.5V to ±100V and is suitable for specialized imaging applications such as shear wave imaging and elastography.
➁ The design incorporates a floating and tracking regulator with low-noise LDO regulators and a current-sharing scheme using low RDS(ON) power MOSFETs. It also supports programmable output voltages via DAC-generated control signals.
➂ The reference design can be applied to medical ultrasound scanners, sonar imaging equipment, and non-destructive evaluation systems. TI provides comprehensive documentation including BOM, schematics, and PCB layouts for this design.
➀ The webinar discusses the impact of generative AI on technology evolution and the rise in compute power demand.
➁ It covers the trends in larger compute chips, multi-die systems, advanced packaging, and memory architectures.
➂ Key technologies like die-to-die communication, custom HBMs, and 3D stacking are explored in detail.
➀ Mach42的发现平台利用机器学习创建一个代理模型，以实现更快的电路设计探索，而无需进行完整的SPICE模拟。
➁ 平台的目标是达到90%的准确率，允许快速迭代，同时保留在最终确认时进行完整准确性的选项。
➂ Mach42正在与Cadence合作开发Spectre，并计划开发Verilog-A模型，这可能会显著增强模拟-数字设计验证。
➀ Toray Engineering Co., Ltd. has developed the UC5000, a high-precision semiconductor packaging system for panel-level packaging (PLP), which is gaining popularity, especially for AI server applications.
➁ The UC5000 achieves chip packaging accuracy of ±0.8μm using thermal compression bonding (TCB) on large panels, supporting both silicon wafers and glass substrates.
➂ Key features include advanced TCB technology, high-accuracy packaging, and warp-correction transfer technology, addressing challenges such as warping and material expansion in glass panel processing.
➀ STMicroelectronics has introduced the STM32U3 microcontrollers with advanced power-saving features for IoT devices, enabling long-term operation with minimal maintenance and power usage.
➁ The STM32U3 series enhances IoT security with hardware protection, including secure storage of secret keys and factory-loaded attestation credentials.
➂ Key features include AI-driven voltage scaling, very low power consumption, high-performance peripherals, and support for operating in extreme temperature ranges.
