➀ Ed reflects on the sources of €1trn and his strategy to secure a share of it;

➁ Ed discusses the possibility of the US raising €800 billion for 'ReArm Europe' and €200 billion for 'InvestAI';

➂ Ed's assignment to the EU as 'Digital Envoy' and his plan to spend on meals and indulgences to identify influential figures in the spending of the funds.

➀ A research team led by Professor Kyu-Young Park from POSTECH has developed technology to significantly increase the lifespan and energy density of electric vehicle (EV) batteries;

➁ The technology involves a 'nano-spring coating' technique that improves battery stability and performance;

➂ The research is published in ACS Nano and has the potential to revolutionize EV battery technology.

➀ Siemens Digital Industries Software has expanded its cloud platform for systems-of-systems development with PAVE360 technology for Software Defined Vehicle (SDV) development.

➁ PAVE360 requires graphics acceleration for accurate simulation and AI processing, which is provided by AMD Radeon PRO V710 GPUs and AMD EPYC CPUs running on Azure.

➂ PAVE360 running on Azure offers cloud development features and system-aware views, helping to uncover defects early in the design cycle.

➀ JEDEC and OCP announce new Chiplet Design Kits for EDA use;

➁ The kits cover Assembly, Substrate, Material, and Test;

➂ The kits aim to automate SiP design and build using chiplets.

➀ This article discusses how to design and test a voltage/current-controlled switch in PSpice simulation software to ensure compatibility with its analog behavior modeling for high-intensity circuits.

➁ The article provides examples of two electronic switch designs for high-power linear circuits consisting of pure resistors, along with detailed procedures for obtaining their DC equivalents using PSpice's behavioral model options.

➂ It also demonstrates how these switches can be used to simulate high-power electronic circuits, emphasizing their potential applications in power electronics and high-power RF/microwave components.

➀ A new type of miniaturized pumps and valves using ultra-thin silicon films is presented at the Hannover Messe, developed by researchers at Saarland University. These pumps and valves operate without air pressure, motors, and lubricants, and can be operated in clean rooms. The team demonstrates a prototype of a new vacuum pump that can draw a vacuum up to 300 millibars.

➁ The technology is cost-effective, lightweight, and energy-efficient compared to current methods, with a 400 times lower energy consumption compared to conventional air-driven valves.

➂ The researchers have developed a novel actuator and pump technology that can be used in various applications, including robotic grippers, speakers, smart textiles, and haptic feedback.

➀ Synopsys extends its Virtualizer IP suite to Arm hardware, enabling direct execution of virtual prototypes on Arm-based machines.

➁ The Native Element feature reduces boot times for Android from 20 minutes to tens of seconds.

➂ The tool supports hybrid emulation, combining virtual prototyping with hardware-assisted verification (HAV) for improved performance.

➀ Rajasekar Elavarasan, founder of Raana Semiconductors, discusses the company's specialization in manufacturing crystal growth machines for semiconductor-grade silicon wafers and advanced crystals used in defense applications.

➁ The Czochralski technique is highlighted as the dominant method for producing silicon wafers larger than 200mm, emphasizing its importance in reducing impurities and ensuring crystal quality.

➂ Raana Semiconductors aims to become the first company in India to manufacture solar-grade silicon wafers domestically, with plans to produce both solar and semiconductor-grade wafers within the next 36 months.

➀ A team from Saarland University's Faculty of Engineering and Medicine is developing smart implants at the university and university hospital to monitor and promote healing in body bone fractures.

➁ The robotic implants can stiffen and soften through shape-memory technology, allowing for permanent monitoring of fracture healing.

➂ The research team is miniaturizing the technology for use in market screws as part of an EU project.

➀ The article discusses the optimization of voltage stability in circuits, specifically focusing on GPS and wireless communication systems.

➁ It highlights the use of simulation tools like PSpice and the Superposition Theorem to analyze and adjust circuit parameters.

➂ The author provides detailed examples and equations to demonstrate how to achieve the desired voltage and current levels in a circuit using these methods.

➀ The Nvidia GeForce RTX 5070 Founders Edition offers a 20% performance increase over its predecessor and a $549 MSRP.

➁ Concerns over retail availability and pricing, with potential for significantly higher prices in the short term.

➂ AMD's RX 9070 launch scheduled for the same day, posing competition and availability challenges.

➀ Lois Rossmann, a renowned RepairTuber, expresses disappointment with Brother's shift towards becoming an 'anti-consumer printer company';

➁ Brother's recent firmware updates have disabled third-party toner and prevented color registration functionality on color devices;

➂ Older firmware versions are being removed from support portals, making it difficult for users to roll back updates.

➀ The 75th annual IEEE Electronic Components and Technology Conference (ECTC) will take place from May 27-30, 2025, featuring a range of technical sessions, special sessions, and workshops on cutting-edge topics in electronic packaging and microelectronics.

➁ Keynote speaker Samuel Naffziger will discuss achieving efficient zettascale compute in the AI era.

➂ The conference will also feature a Heterogeneous Integration Roadmap (HIR) workshop and 16 Professional Development Courses.

➀ Nanjing EDA company, Xinhua Zhang, has completed a strategic upgrade in early 2025, appointing Xie Zhonghui and Qi Zhenghua as Co-CEOs, and Wang Libin as Chairman, focusing on strategic resource integration and financing.

➁ Xinhua Zhang was established in Nanjing in March 2020, focusing on digital verification, offering verification solutions from chips to systems, and has released over a dozen digital verification products with over 200 independently developed patent applications.

➂ The management change is a key step for Xinhua Zhang's scaling-up development, aiming to strengthen strategic execution, accelerate product and market collaboration, and respond to the increasingly intense semiconductor EDA market competition.

➀ Altair has announced Altair® HyperWorks® 2025, a new simulation and design platform that leverages AI, machine learning, and HPC to enhance engineering processes.

➁ The platform integrates AI-driven models, machine learning solvers, and automation features to accelerate design and testing without the need for physical prototypes.

➂ Altair HyperWorks 2025 also offers cloud-based and SaaS solutions to improve collaboration and scalability.

➀ MIT researchers have developed a chip-based terahertz wave generator that doesn't require bulky silicon lenses, making it scalable and cost-effective.

➁ The system uses a thin, patterned sheet attached to the back of the chip to improve efficiency, leveraging Intel's high-power transistors.

➂ This technology could be integrated into various applications such as security scanners and environmental monitors due to its scalability and high peak radiation power of 11.1 dBm.

➀ Arteris, Inc. introduces FlexGen, a revolutionary NoC interconnect IP;

➁ FlexGen accelerates chip development and optimizes performance efficiency;

➂ The solution addresses the growing demand for faster and more sustainable innovation in the automotive, datacenter, and consumer electronics sectors.

➀ Applications for the third cohort of ChipStart UK, a government-funded early-stage semiconductor incubator, are now open.

➁ Eligible startups include those developing semiconductor technologies and are incorporated in the UK with less than $1.5 million in private VC or Angel funding.

➂ The incubation programme, focused on investor readiness, is funded by the DSIT UK Government department and is free for participants.

➀ The VTT Technical Research Centre of Finland has been awarded €29 million for chip packaging development under the EU APECS pilot line project.

➁ VTT will focus on radio frequency technologies for 6G networks and the development of optical microsystems and chip packaging methods.

➂ VTT is involved in FAMES and NanoIC pilot line projects and will operate in Kvanttinova, a microelectronics and quantum technology RDI Hub.

➀ Siemens Digital Industries Software has introduced an automated and certified workflow for TSMC's InFO packaging technology.

➁ The workflow is driven by Innovator3D IC and includes Xpedition Package Designer software, HyperLynx DRC, and Calibre nmDRC technologies.

➂ Siemens Digital's svp AJ Incorvaia highlights the expansion of design avenues for customers.