<p>➀ A research team from Peking University and other institutions has developed a new method to integrate 2D semiconductors with dielectric materials, opening the door to smaller and faster electronics.</p><p>➁ The method involves growing an ultra-thin dielectric film on a copper surface covered with graphene, allowing the film to be transferred to different substrates with minimal defects.</p><p>➂ This advancement could lead to the scalable production of high-performance, low-power microelectronics and optoelectronics based on 2D materials, with future efforts focusing on precise alignment and stacking of 2D materials.</p>