➀ This webinar series focuses on 3D passive vendor component models for accurate EM-circuit co-simulation of high-frequency RF board designs.
➁ It explores simulating active circuits on boards using Modelithics models in Keysight EDA software.
➂ The Modelithics COMPLETE Library supports accurate simulations and provides a ready bill of materials.
➀ The organizers of this year's Design and Verification Conference & Exhibition Europe (DVCon Europe) have announced the deadline for abstracts for engineering papers and tutorials for this year's event.
➁ Abstracts need to be submitted by 22 April, with full engineering and research papers required by 30 June.
➂ DVCon Europe will be hosted by Accellera Systems Initiative and will take place at the Holiday Inn Munich, Germany from 14 to 15 October.
➀ A trawler caught 7 1/2 times as much fish as with conventional driftnet methods using new electronic fish-finding equipment developed by Kelvin and Hughes (Marine) limited;
➁ The story dates back to 65 years ago, when CERES (Combined Echo Ranging Echo Sounding) equipment was introduced;
➂ CERES combined echo-ranging and echo-sounding to improve fishing efficiency.
➀ Cadence successfully demonstrates first-pass silicon success of its UCIe™ standard package IP on Samsung Foundry's 5nm automotive process;
➁ This milestone highlights Cadence's commitment to high-performance, automotive-grade IP solutions;
➂ The solution meets the stringent requirements of next-generation automotive and high-performance computing applications.
➀ Achieving design rule compliance and optimal electrical performance in advanced semiconductor designs is crucial for minimizing design iterations and ensuring product reliability.
➁ Siemens Digital Industries Software's Calibre DesignEnhancer (DE) provides analysis-based EMIR solutions that enhance power integrity and reduce IR drop.
➂ Both Google and Intel utilized Calibre DE to address IR drop issues, demonstrating significant improvements in power grid robustness and electrical performance.
➀ Pragmatic Semiconductor and Electronics Weekly are hosting a webinar on the next-gen FlexIC design platform.
➁ The webinar is aimed at IC Designers, ASIC Engineers, and R&D professionals.
➂ It will cover the capabilities of the Pragmatic FlexIC Platform Gen 3, including rapid design and manufacturing of flexible mixed-signal ASICs.
➀ Ed向他的日记透露，执政不到一年的工党政府正在削减福利预算；
➁ 总理认为Ed是一个多面手，经常找他解决问题，Ed成了他的跑腿；
➂ 总理希望Ed帮助解决长期病假人员的问题，以减少福利预算开支，并避免政府形象受损。
➀ The article discusses how 3D NAND flash memory is becoming essential for meeting the increasing data storage needs driven by AI. It highlights the shift from 2D to 3D NAND structures, which allow higher storage density through vertical stacking.
➁ Key players like Samsung, Western Digital, and SK Hynix are mentioned as leaders in 3D NAND technology. The article also explores innovations in cryogenic etching technology, which enhances etching capabilities and addresses scaling challenges.
➂ The global NAND flash memory market is expected to grow significantly, reaching $83 billion by 2036. Lam Research is noted as a market leader in 3D NAND dielectric etching, with advancements like the Lam Cryo™ 3.0 enabling more efficient and precise etching processes.
➀ Jayashankar Narayanankutty, Cadence Design Systems的销售总监，讨论了公司与印度政府合作的计划如何推动其业务增长，特别是在初创公司领域。
➁ Cadence通过灵活的商业模式为不同阶段的初创企业提供支持，包括提供免费或延迟支付的EDA工具，以帮助解决资金和技术挑战。
➂ Cadence正在投资于AI驱动的设计工具和3D集成电路技术，这可能成为印度在半导体行业取得领先地位的机会。
➀ This article discusses a validated reference design for Gigabit Ethernet front-end solutions, which is essential for high-speed data transmission in various applications like industrial, automotive, and consumer electronics.
➁ The design by Wurth Elektronik incorporates key components such as transformers, common-mode chokes, and capacitors to ensure signal integrity and electromagnetic compatibility (EMC).
➂ The reference design is adaptable for multiple applications and includes detailed schematics and layout guidelines to help engineers optimize their designs for signal integrity and thermal management.
➀ ASUS introduced the ASUS Ascent GX10, a petaflop-scale AI supercomputer powered by the NVIDIA Grace Blackwell Superchip. It provides unprecedented computing power, high-speed memory integration, and easy scalability for enterprise-level AI capabilities.
➁ The device delivers 1,000 TOPS of AI processing power, supporting AI models with up to 200 billion parameters. It includes Blackwell GPU with fifth-generation Tensor Cores and Grace 20-core Arm CPU for efficient data orchestration and real-time inferencing.
➂ The supercomputer integrates NVIDIA NVLink-C2C connectivity, offering 5x the bandwidth of PCIe 5.0. It supports seamless transitions between local development and scalable deployment, aiding developers in AI model prototyping and fine-tuning.
➀ MIT's CSAIL has developed Xstrings, a new 3D printing technique that simplifies the creation of cable-driven devices by embedding cables directly into 3D-printed structures, reducing production time by 40%.
➁ The system allows users to specify motion types such as bending, twisting, or coiling through a digital blueprint, enabling seamless design and fabrication in a single step.
➂ Demonstrated applications include robotic fingers, interactive sculptures, and gripping tentacles, showcasing potential in robotics, art, and wearable tech.
➀ Automotive electronics is advancing rapidly, focusing on autonomy, electrification, and car cockpit improvements.
➁ The need for advanced functionality is high, but OEMs aim to minimize costs and maximize software-driven features.
➂ Modern cars are equipped with multiple sensors, including cameras, radar, and lidar, requiring advanced fusion and processing techniques.
➀ Silicon Catalyst, the world's only incubator dedicated to accelerating semiconductor solutions, has announced the 3rd Annual ‘Arm Silicon Startups Contest’;
➁ The contest is in partnership with Arm, known for its high-performance and energy-efficient computing platforms;
➂ Silicon Catalyst will organize and administer the contest, which is set to launch today.
➀ Nvidia的年度GPU技术大会（GTC）正在举行，黄仁勋将发表主题演讲。
➁ 预计黄仁勋将宣布Blackwell 300 AI GPU和更多产品。
➂ B300系列AI GPU预计将在今年下半年推出，下一代Rubin AI GPU预计将于2026年推出。
➀ Cadence has officially joined the Intel Foundry Accelerator Design Services Alliance;
➁ This collaboration aims to drive innovation and support advanced chip design;
➂ The alliance aims to solidify Intel Foundry's leadership in cutting-edge semiconductor solutions.
➀ Researchers developed lipid nanoparticles (LNPs) to deliver mRNA encoding the KRAS G12D neoantigen and cGAMP to reprogram the liver's immune environment and generate an antitumor response against metastatic pancreatic cancer.
➁ The LNPs successfully activated the type I interferon pathway, leading to the generation of CD8+ cytotoxic T cells capable of recognizing and attacking metastatic cancer cells.
➂ The study suggests that combining KRAS mRNA with a STING agonist strengthens the immune response against PDAC and offers a more effective approach than traditional immunotherapies.
➀ Researchers at Technical University of Munich (TUM) have developed an evolving encyclopedia called the 'Tree of Robots' to classify and compare robotic systems.
➁ The encyclopedia focuses on defining specialized capabilities of robots, particularly their tactile fitness and motion fitness, which are crucial for real-world applications.
➂ The 'Tree of Robots' aims to support future research by providing a comprehensive resource for identifying suitable systems for algorithm testing and expanding with new metrics and robotic systems.
➀ Huada Jiutian plans to acquire the controlling stake of Chip and Semiconductor through the issuance of shares and cash payment.
➁ Huada Jiutian is committed to becoming a leading EDA provider in the global market.
➂ Chip and Semiconductor aims to create a full-stack EDA platform for the AI era, covering chip, packaging, module, PCB board-level, interconnection, and整机 system.
➀ Ed reflects on the sources of €1trn and his strategy to secure a share of it;
➁ Ed discusses the possibility of the US raising €800 billion for 'ReArm Europe' and €200 billion for 'InvestAI';
➂ Ed's assignment to the EU as 'Digital Envoy' and his plan to spend on meals and indulgences to identify influential figures in the spending of the funds.
