Recent #EDA news in the semiconductor industry

6 months ago

➀ A consortium of 12 European partners, coordinated by imec, launches the EU Chips Design Platform under the EU Chips Act to support fabless semiconductor startups and SMEs with cloud-based design resources, training, and funding;

➁ The platform offers access to EDA tools, IP libraries, fabrication pilot lines, and mentorship programs, aiming to reduce costs and accelerate time-to-market for chip innovations;

➂ Integrated with Europe’s broader semiconductor strategy, the initiative complements national competence centers and pilot lines like APECS and WBG, strengthening the continent’s industrial competitiveness through 2028.

EDAFraunhofer
6 months ago

➀ The article emphasizes optimizing the RTL-to-GDSII flow to address increasing chip complexity and design challenges;

➁ Key strategies include improving RTL quality, leveraging AI-driven automation, streamlined synthesis, and early congestion analysis;

➂ Benefits include reduced turnaround time, enhanced power-performance-area metrics, and scalability for advanced semiconductor development.

AIEDAsemiconductor
6 months ago

➀ Atum Works claims its nanoscale 3D printing method can replace current production flows and reduce chip fabrication costs by 90%;

➁ The method uses a nanoscale 3D printer to fabricate multi-material 3D structures with a 100 nm resolution at wafer scale;

➂ While not suitable for high-performance processors, the technology may be beneficial for packaging, photonics, sensors, and non-logic elements.

3D ICChipletEDAHPCNanotechnologyStartupsemiconductor
6 months ago

➀ Ethan Wilkinson, a UKESF Scholar at the University of Birmingham, is highlighted for his exceptional technical skills and commitment to excellence at EDA Solutions.

➁ His significant achievements include contributing to the development of the first electro-optical co-simulator and his role in training and supporting customers.

➂ Wilkinson is also recognized for his community engagement, particularly in inspiring young students to pursue careers in electronics and semiconductor technologies.

EDAEW BrightSparks
6 months ago

➀ Etimol DFX 82 RAN and Etimol DFX 83 RSN are two innovative flux removers introduced by Emil Otto, which have been tested and approved by leading electronics manufacturers.

➁ Both cleaners are non-hazardous, with high flash points, making them suitable for use in both automated and manual systems while ensuring occupational safety.

➂ Etimol DFX 82 RAN is solvent- and water-based, whereas Etimol DFX 83 RSN is solvent-only based, both formulated to effectively clean flux and paste residues.

EDASoftwareelectronics
6 months ago

➀ Analog Bits, a mixed-signal IP specialist, is demonstrating its latest LDO, power supply droop detectors, and embedded clock LC PLLs on the TSMC N3P process.

➁ The company is also showcasing clocking PVT and droop detectors on the TSMC N2P process at the TSMC 2025 North America Technology Symposium.

➂ CEO Mahesh Tirupattur emphasizes the importance of power management in architectural design, especially for advanced datacenters, AI/ML applications, and automotive SoC's.

2nmEDAPower ManagementTSMCsemiconductor
7 months ago

➀ The transition from silicon-based components to GaN technology is reshaping the electronics industry;

➁ GaN HEMTs provide superior efficiency and improved thermal management over traditional semiconductors;

➂ This guide is tailored for engineers and enthusiasts in modern electronics.

EDAGaNsemiconductor
7 months ago

➀ In the fast-evolving field of electronic design, ensuring the correct operation of complex mixed-signal designs is more critical than ever.

➁ Mixed-signal verification, or AMS verification, is at the core of this challenge, bridging the gap between analog and digital designs in a more digital world.

➂ As these technologies become more complex, understanding AMS verification becomes increasingly important.

EDAVerification
7 months ago

➀ TSMC has chosen a 310x310mm substrate for its initial panel-level packaging (PLP) production, instead of the 510x515mm substrate initially tested.

➁ A source told Nikkei that the decision was made to start with a slightly smaller square shape rather than a larger one used in earlier trials, due to the difficulty of evenly coating the entire substrate with chemicals.

➂ The first production will take place on a pilot line in Taoyuan City in 2017.

EDAPackagingTSMCsemiconductor
7 months ago

➀ SHENMAO America, Inc. introduces PF606-P lead-free solder paste for the advanced 'Reverse Hybrid' assembly process, which enhances product reliability and increases manufacturing yields for cutting-edge electronics.

➁ The 'Reverse Hybrid' process combines SAC solder paste with BGA components featuring low-temperature solder (LTS) balls, resulting in a homogeneous SAC-LTS solder joint that improves thermal cycling and drop test performance.

➂ This method offers superior printability, solderability, and minimal voiding, making it ideal for next-generation advanced packages like CPUs, while maintaining standard SAC reflow conditions and simplifying integration.

AI ChipEDAHPCMicrochipsemiconductor
7 months ago

➀ 十九年前,在2006年的DATE会议上,飞利浦半导体首席技术官Rene Penning de Vries表示,当前的EDA技术无法处理被称为‘More than Moore’的新一代多样化技术;

➁ de Vries提到,为了将这些非CMOS技术在系统级封装(SiP)中集成,“需要我们今天不拥有的EDA环境”。“我们离那还很远,”他说;

➂ 然而,Cadence和Synopsys都对开发能够应对这一挑战的设计工具充满信心。

Design ToolsEDAMoore's LawTechnology Integration
7 months ago

➀ The DFN (Dual Flat No-leads) and QFN (Quad Flat No-leads) packages are gaining popularity in high-performance applications due to their compact size and advanced circuitry support.

➁ These packages are used in a wide range of applications, from consumer electronics to automotive systems.

➂ Understanding their specifications can significantly enhance design strategies and product development.

EDAconsumer electronicssemiconductor
7 months ago

➀ A prototype for an E-Bike terminal has been developed at the Hochschule Karlsruhe (HKA) as part of a project aiming for sustainable mobility;

➁ The terminal is constructed primarily from renewable resources (wood) and is designed to be replicable in other locations;

➂ The project includes a solar power system to charge the E-bikes and features social components such as a meeting point for students and staff.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
7 months ago

➀ This study explores the development of chitosan-silanized hexagonal boron nitride (hBN) nanocomposite films;

➁ It focuses on their structural, mechanical, and barrier properties;

➂ The research aims to enhance the performance of biodegradable polymer films, overcoming limitations of chitosan.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
7 months ago

➀ Researchers have developed a molecular nanocage that can capture a wide range of PFAS from water, significantly outperforming conventional filtration methods like activated carbon.

➁ The nanocage system removed 80% of PFAS from sewage and 90% from groundwater in study tests.

➂ The material shows promise for more efficient, safer, and sustainable water remediation.

3D ICEDAHPCMicrochipPrivacyautomotivecybersecuritysemiconductor
7 months ago

➀ Keysight Technologies推出新一代嵌入式安全测试台,提供可扩展和高性能的PXIe解决方案,简化现代半导体和嵌入式系统的安全性测试工作流程。

➁ 测试台通过模块化设计整合关键组件,如示波器、信号接口、放大器和触发生成器,提升效率并减少复杂性。

➂ 该平台支持未来扩展,能够适应不断变化的测试需求,同时确保测试结果的一致性和重复性。

AI ChipEDAHPCSoftwaresecuritysemiconductor