<p>➀ SHENMAO America, Inc. introduces PF606-P lead-free solder paste for the advanced 'Reverse Hybrid' assembly process, which enhances product reliability and increases manufacturing yields for cutting-edge electronics.</p><p>➁ The 'Reverse Hybrid' process combines SAC solder paste with BGA components featuring low-temperature solder (LTS) balls, resulting in a homogeneous SAC-LTS solder joint that improves thermal cycling and drop test performance.</p><p>➂ This method offers superior printability, solderability, and minimal voiding, making it ideal for next-generation advanced packages like CPUs, while maintaining standard SAC reflow conditions and simplifying integration.</p>