Recent #Technology Integration news in the semiconductor industry

5 months ago

➀ 十九年前,在2006年的DATE会议上,飞利浦半导体首席技术官Rene Penning de Vries表示,当前的EDA技术无法处理被称为‘More than Moore’的新一代多样化技术;

➁ de Vries提到,为了将这些非CMOS技术在系统级封装(SiP)中集成,“需要我们今天不拥有的EDA环境”。“我们离那还很远,”他说;

➂ 然而,Cadence和Synopsys都对开发能够应对这一挑战的设计工具充满信心。

Design ToolsEDAMoore's LawTechnology Integration
10 months ago
➀ The BMBF is funding a three-year project at the Hochschule Kempten with around 660,000 Euros to integrate Industry 4.0 technologies like Digital Twins into existing production plants. ➁ Existing plants ('Brownfield') make up 80% of production sites in Germany and often lack digital construction information. ➂ The project aims to develop an automated method for creating Digital Twins to reduce the cost and time of project and product development.
Industry 4.0Technology Integrationdigital twin
about 1 year ago
➀ RISC-V's flexibility and scalability make it an ideal choice for AI chip design, allowing customization of AI accelerators. ➁ Two main models of RISC-V AI chips are identified: Integrated mode for low power and Attached mode for high computational power. ➂ Challenges in the RISC-V+AI ecosystem include fragmentation and insufficient resources, addressed through international standards and open-source software. ➃ Focus on edge computing and smart terminals to build a competitive software ecosystem against NVIDIA's CUDA. ➄ International collaboration and open-source community development are crucial for RISC-V's global market positioning.
AIRISC-VTechnology Integration