<p>➀ 十九年前,在2006年的DATE会议上,飞利浦半导体首席技术官Rene Penning de Vries表示,当前的EDA技术无法处理被称为‘More than Moore’的新一代多样化技术;</p><p>➁ de Vries提到,为了将这些非CMOS技术在系统级封装(SiP)中集成,“需要我们今天不拥有的EDA环境”。“我们离那还很远,”他说;</p><p>➂ 然而,Cadence和Synopsys都对开发能够应对这一挑战的设计工具充满信心。</p>
Related Articles
- IPLM Today and Tomorrow from Perforce11 days ago
- Better Automatic Generation of Documentation from RTL Code12 days ago
- The Rise, Fall, and Rebirth of In-Circuit Emulation: Real-World Case Studies (Part 2 of 2)15 days ago
- “It’s Not Just A Coating – It’s The Next Generation Of ESD Flooring”- Madhusudan Marepalli, Praveen Kumar Munipally, SCH Coating Solutions27 days ago
- CHIIPS #18 – Chip design insights from Ras Attale of Tessent Embedded Analytics28 days ago
- GaN Device Design and Optimization with TCAD28 days ago
- Creonic Updates Doppler Channel IP Core with Extended Frequency Band and Sampling Range28 days ago
- ASIC North Enters Strategic Channel Partnership with GlobalFoundries28 days ago
- MIN PULSE WIDTH TIMING CHECK The Silent Timing Trap Lurking In Every Sub-5nm Design30 days ago
- CEO Interview with David Zhi LuoZhang of Bronco AIabout 1 month ago