Recent #EDA news in the semiconductor industry

5 months ago

➀ The article discusses a reference design for a wireless M-Bus communication module developed by Texas Instruments (TI). This design uses the CC1310 and CC1350 wireless MCUs and is compatible with the Open Metering System (OMS) v3.0.1 specification.

➁ The design supports various metering applications, including heat cost allocators, gas and water meters, and energy meters. It also supports unidirectional and bidirectional RF communication in S-, T-, and C-modes within the 868 MHz band.

➂ The reference design offers a single-chip solution with excellent RF performance and ultra-low power consumption, making it suitable for battery-powered sub-meters and other metering devices.

EDAIoTMicrocontrollerTIWirelesssemiconductor
5 months ago

➀ This article discusses a reference design for secure telehealth solutions, offering a robust framework for building advanced connected medical devices.

➁ The design features a WBZ350 module with Bluetooth LE 5.2 capability, ensuring efficient communication and enhanced security with the ATECC608C cryptographic co-processor.

➂ The design supports multiple connectivity options, including AWS or Azure cloud connectivity, and also includes bio-signal and temperature sensors for accurate health monitoring.

AIEDAIoTMedicalMicrochip
5 months ago

➀ A recent study introduces a Janus membrane for water purification and energy generation, aiming to address water scarcity and energy needs;

➁ The membrane uses cellulose nanofibers (CNF) and a modified MXene to improve performance over longer periods;

➂ The Janus membrane demonstrates better performance than traditional membranes, achieving a high evaporation rate and photothermal conversion efficiency, and effectively preventing salt buildup.

2nm3D IC3nmAIAI ChipArmChipletCoolingDRAMEDAEMIBEUVGDDRGaNHBMHPCLaptopMicrochipNPUPCIePrivacySSDSoftwareSwitchTIautomotivecybersecuritygamingiosmemorymonitorsemiconductor
5 months ago

➀ This article introduces a reference design for a programmable 100V high-current regulator by Texas Instruments (TI), named TIDA-01371. The design supports output voltages ranging from ±2.5V to ±100V and is suitable for specialized imaging applications such as shear wave imaging and elastography.

➁ The design incorporates a floating and tracking regulator with low-noise LDO regulators and a current-sharing scheme using low RDS(ON) power MOSFETs. It also supports programmable output voltages via DAC-generated control signals.

➂ The reference design can be applied to medical ultrasound scanners, sonar imaging equipment, and non-destructive evaluation systems. TI provides comprehensive documentation including BOM, schematics, and PCB layouts for this design.

AIEDAHPCMicrochipTIautomotivememorysemiconductor
5 months ago

➀ Mach42的发现平台利用机器学习创建一个代理模型,以实现更快的电路设计探索,而无需进行完整的SPICE模拟。

➁ 平台的目标是达到90%的准确率,允许快速迭代,同时保留在最终确认时进行完整准确性的选项。

➂ Mach42正在与Cadence合作开发Spectre,并计划开发Verilog-A模型,这可能会显著增强模拟-数字设计验证。

Analog DesignCadenceEDAMach42SpectreVerilog-Amachine learningverification
5 months ago

➀ Toray Engineering Co., Ltd. has developed the UC5000, a high-precision semiconductor packaging system for panel-level packaging (PLP), which is gaining popularity, especially for AI server applications.

➁ The UC5000 achieves chip packaging accuracy of ±0.8μm using thermal compression bonding (TCB) on large panels, supporting both silicon wafers and glass substrates.

➂ Key features include advanced TCB technology, high-accuracy packaging, and warp-correction transfer technology, addressing challenges such as warping and material expansion in glass panel processing.

AIChipletEDAHPCMicrochipsemiconductor
5 months ago

➀ STMicroelectronics has introduced the STM32U3 microcontrollers with advanced power-saving features for IoT devices, enabling long-term operation with minimal maintenance and power usage.

➁ The STM32U3 series enhances IoT security with hardware protection, including secure storage of secret keys and factory-loaded attestation credentials.

➂ Key features include AI-driven voltage scaling, very low power consumption, high-performance peripherals, and support for operating in extreme temperature ranges.

AI ChipEDAIoTMicrochipsemiconductor
5 months ago

21年前,在Globalpress 'Leading the Recovery'会议中,一个小组讨论了'何时会有量产的90nm SoC'的问题。

来自Cadence Design Systems的高级副总裁Ted Vucurevich表示,预计最早在2004年将出现基于90nm工艺的FPGA设计。

来自Synopsys的Anton Domic认为,到2004年,将会有非FPGA芯片在90nm工艺上实现量产。

台积电的Andrew Moore也提到,公司的发展路线图显示,90nm工艺将在2004年实现。

量产90nm设计面临的挑战包括预期良率问题、客户信心问题、验证问题和成本问题。

Chip TechnologyEDAFoundriesProcess technologyTSMCsemiconductor
5 months ago

➀ Undo's technology enables engineers to see exactly what their code did, facilitating root-cause analysis and improving collaboration.

➁ Undo is prominent in industries such as semiconductor design, databases, and networking, where debugging efficiency is critical.

➂ Undo's solution helps customers overcome challenges like development bottlenecks and missed deadlines by improving debugging processes.

DebuggingEDASEMICONDUCTORsoftwaretechnology
5 months ago

➀ The article discusses a 9.8-GHz wideband, low phase noise, continuous wave (CW) RF signal generator reference design by Texas Instruments (TI). The design uses a programmable clock generator to reduce spurs and optimize system complexity.

➁ Key components include the LMX2592 PLL, LMK61E2 programmable reference clock, and LP38798-ADJ linear regulator. The design can be controlled via a PC or microcontroller.

➂ The reference design is suitable for applications like test and measurement, wireless communications, military and aerospace, radar detection, and microwave backhaul. It offers excellent phase noise performance and low in-band spurious levels.

EDARFTexas Instrumentssemiconductor
5 months ago

➀ Alphawave Semi推出了针对高速互连半导体市场的最新光电子解决方案,预计到2028年市场规模将超过40亿美元。

➁ 新产品包括支持PAM4和Coherent-lite调制的数字信号处理器(DSP),以实现AI驱动的高速数据中心数据传输。

➂ 该解决方案利用了Alphawave的WidEye DSP架构和EyeQ高级诊断技术,并提供800G和1.6T的互连能力。

AIAI ChipAI PCChipletEDAHPCsemiconductor
5 months ago

➀ Rise Design Automation has developed a solution that integrates generative AI with human expertise to improve RTL design productivity.

➁ The webinar hosted by RDA and SemiWiki will showcase how generative AI can enhance semiconductor design through high-level abstraction.

➂ The Rise AI solution translates natural-language intent into high-level design code, reducing manual effort in the design process.

AIEDAGenerative AIHigh-Level AbstractionRTL DesignRise Design AutomationSemiWikiSemiconductor Design
5 months ago

➀ A student at the University of Applied Sciences in Hagen, Melanie Welp, has developed a contactless timing system for Paralympic swimming to prevent injury from head impacts.

➁ The prototype uses an ultrasonic sensor to measure the time at six meters and 50 centimeters before the edge of the pool.

➂ The system has been tested and shown to be possible without causing injury to swimmers.

2nm3D IC3nmAIAI ChipAI PCAMDArmAsusChipletCoolingDRAMDellEDAEMIBEUVGDDRGPUGaNHBMHPCInfineonLaptopLinuxMicrochipNPUNVIDIAPCIePrivacyRaspberry PiSK HynixSSDSoftwareSwitchTIautomotivecpucybersecuritygamingiosmemorymonitorsemiconductor
5 months ago

➀ YES, a global leader in materials and interface engineering equipment solutions, has shipped the first commercial VeroTherm Formic Acid Reflow tool to a global semiconductor manufacturer from its Sulur, Coimbatore facility.

➁ This marks a significant milestone for YES and the Indian semiconductor ecosystem, as it is the first equipment produced in India for advanced semiconductor applications like HBM.

➂ The Sulur facility, which commenced operations in September 2024, is part of YES's strategic expansion plan to serve global customers more efficiently.

EDAEquipmentHPCIndiaManufacturingsemiconductor
5 months ago

➀ Faraday Technology Corporation, a leading provider of ASIC design services, has selected Silvaco's FlexCAN IP for advanced automotive ASIC design.

➁ The collaboration aims to enhance the capabilities of automotive systems through the use of advanced semiconductor technology.

➂ Silvaco's FlexCAN IP is designed to meet the stringent requirements of automotive applications.

ASIC DesignEDAautomotivesemiconductor
5 months ago

➀ This article discusses a reference design for extending SPI communication range using LVDS interface, which improves signal quality, reduces EMI, and maintains robustness against noise.

➁ The design utilizes TI's TIDA-060017 reference design, featuring LVDS driver and receiver modules, to transmit SPI signals over longer distances.

➂ The solution offers advantages such as enhanced speed, lower power consumption, and compatibility with a variety of industrial and medical applications.

DesignEDAMicrochipPCBSignal Integrity
5 months ago

➀ X-FAB, SMART Photonics, and Epiphany Design are collaborating to develop a photonics integration platform that combines InP and SOI technologies for multi tera-bit data rates.

➁ The platform aims to address customer requirements for high-speed data rates and energy efficiency in the manufacturing of optical transceivers.

➂ The collaboration has resulted in the development of a design flow and PDK that enables the design of photonics circuits integrating InP chiplets on an SOI platform.

EDAPhotonicssemiconductor
5 months ago

➀ Researchers at NYU Abu Dhabi have developed an innovative 'off-the-jaw' sensing system that integrates force and angle sensors into laparoscopic handles to provide real-time feedback on gripping forces, tissue thickness, and stiffness.

➁ This system enhances the safety and precision of minimally invasive surgery (MIS) by restoring tactile feedback, which is crucial for differentiating tissues and applying appropriate force.

➂ The technology has potential applications beyond laparoscopic surgery, including telemedicine, endoscopy, and robotic-assisted surgery, with early trials showing a 30% improvement in surgical task efficiency.

AIEDAMedicalrobotics