➀ Samsung has not yet passed NVIDIA's qualification for HBM3E memory; ➁ The delay is due to Samsung's inability to meet NVIDIA's chip performance requirements; ➂ It is 'realistically impossible' for Samsung to supply HBM3E to NVIDIA this year.

➀ Samsung is preparing for 1c DRAM mass production at its Pyeong Plant 4; ➁ The 1c DRAM is a 6th generation 10nm-class technology expected to be fully commercialized in 2025; ➂ Samsung aims to enhance its competitiveness in the AI market with the new technology.

➀ A class-action lawsuit alleges that UnitedHealthcare uses a faulty algorithm to deny patient coverage, filed by two now-deceased individuals. ➁ UnitedHealthcare CEO Brain Thompson was killed in Midtown Manhattan earlier this week, and the suspect is currently on the run. ➂ The lawsuit claims UnitedHealthcare pushed employees to use an algorithm with a 90% error rate to deny coverage.

➀ Samsung is conducting research to modify the packaging method for the LPDDR used in iPhones; ➁ The change is in response to Apple's request to convert the LPDDR IC into a discrete package; ➂ The new packaging will involve packaging the LPDDR separately.

➀ The rise of RISC-V cores and the challenges of certification; ➁ The role of Breker Verification Systems in the certification process; ➂ The complexity of certifying RISC-V ISA implementations and the efforts of RISC-V International.

➀ Samsung is reportedly reducing its foundry and legacy DRAM production; ➁ The South Korean semiconductor giant is considering selling outdated NAND equipment in China; ➂ Local Chinese companies are said to be potential buyers.

➀ SK Hynix is scheduled to provide samples of its Gen 5 HBM, HBM3E 16H, in early 2025; ➁ The HBM3E 16H features 16 stacked DRAM dies and will utilize mass reflow molding technology; ➂ SK Hynix CEO Kwak Noh-jung announced this at an event hosted by SK Group.

➀ SK hynix posts record-high Q3 2024 profit; ➁ Sales of AI memory, HBM, and eSSDs see 'explosive' demand; ➂ SK hynix solidifies its position as the world's No.1 AI memory technology provider.

➀ Google is rumored to switch to TSMC's N3E process for Tensor G5; ➁ The report also clarifies that Google has chosen not to use 2nm technology for Tensor G6; ➂ The move could impact the competition in the AI and smartphone chip markets.

➀ Samsung has developed next-gen 24Gbps GDDR7 memory modules; ➁ Offering higher VRAM capacities on future consumer GPUs; ➂ Up to 42.5Gbps speeds.

➀ Arm is exploring the feasibility of running LLMs on mobile devices; ➁ Arm's optimization techniques for LLMs on mobile; ➂ The importance of practical use cases for LLMs in mobile devices

➀ SK Hynix has placed a significant order for thermal compression bonders from ASMPT; ➁ The equipment is for the production of HBM3E 12H, SK Hynix's newest high-bandwidth memory; ➂ The order includes over 30 units of the equipment.

➀ Contract prices of DRAM and NAND dropped by over 10% in September; ➁ The decline was due to low demand for PCs and consumer electronics; ➂ DDR4 8Gb 1Gx8 prices fell by 17.07% to US$1.7.

➀ SK Hynix has announced the development of a Gen 6 10-nanometer (nm) 16Gb DDR5 DRAM, marking the first in the industry. ➁ This development positions SK Hynix ahead of its domestic competitor, Samsung, which began manufacturing Gen 5 DRAM in May. ➂ The competition between SK Hynix and Samsung continues to drive advancements in DRAM technology.

➀ SK Hynix announces plans to develop a 4F2 DRAM similar to Samsung; ➁ The cost of EUV processes has been rapidly increasing since the commercialization of 1c DRAM; ➂ Seo Jae Wook, an SK Hynix researcher, highlighted this during an industry conference in Seoul.

➀ Samsung has started mass production of 12 GB and 16 GB LPDDR5X modules in the industry's thinnest package, measuring 0.65 mm in thickness. ➁ The ultra-thin design was achieved through new packaging methods and an optimized back-lapping process, offering a 21.2% improvement in heat resistance. ➂ Thinner LPDDR5X packaging enhances airflow within smartphones, significantly improving thermal management and potentially extending device lifespan.

1. DRAM and NAND Flash revenue expected to increase significantly in 2024 due to AI. 2. DRAM revenue projected to reach $90.7 billion in 2024, with a further increase to $136.5 billion in 2025. 3. NAND Flash revenue expected to reach $67.4 billion in 2024, driven by QLC enterprise SSDs.

1. SK Hynix achieved its highest operating profit in six years during the second quarter of 2023. 2. The company reported revenue of 16.42 trillion won and operating profit of 5.46 trillion won. 3. Net income for the quarter was 4.12 trillion won.

1. Micron expands its datacenter DRAM portfolio with MR-DIMMs, offering higher bandwidth and capacity. 2. MR-DIMMs use a data buffer to double transfer rates at standard DDR5 speeds. 3. Micron's MR-DIMMs are designed for Intel's Xeon 6 Family, showing significant performance improvements in benchmarks.

1. Jusung Engineering is developing ALD technology to reduce the number of steps in the EUV process. 2. The chairman of Jusung Engineering, Chul Joo Hwang, believes that stacking transistors will be the future of semiconductor development. 3. This approach is seen as necessary due to the limitations in scaling DRAM and logic chips, similar to how NAND stacks transistors.